Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)
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Chemical imaging of micro-vias in organic packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906365 ◽

2002 ◽

Author(s):

Yoon Loong Khong ◽

Hooi Ling Lee

Keyword(s):

Chemical Imaging ◽

Organic Packages

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Applications of newly developed positive photosensitive block co-polyimides to CSPs

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906402 ◽

2002 ◽

Author(s):

S. Matsumoto ◽

Xing Zhou Jin ◽

T. Fukushima ◽

M. Miyamura ◽

H. Itatani

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Copper flip chip bump interconnect technology for microwave subsystems including RF characterization

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906396 ◽

2002 ◽

Cited By ~ 1

Author(s):

A. Wong ◽

D. Linton

Keyword(s):

Flip Chip ◽

Interconnect Technology

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Evolutionary genetic approach to determine junction temperature in electronic packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906362 ◽

2002 ◽

Author(s):

A. Parthiban ◽

K. Jeevan ◽

K.N. Seetharamu ◽

I.A. Azid

Keyword(s):

Junction Temperature ◽

Electronic Packages ◽

Genetic Approach ◽

Evolutionary Genetic

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ADI-FMM, a customized FMEA for process management in the IC assembly and test industry

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906369 ◽

2002 ◽

Author(s):

M.G. Mena

Keyword(s):

Process Management

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Use of microwave technology for rapid cure of chip-on-board glob top encapsulants

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906370 ◽

2002 ◽

Cited By ~ 2

Author(s):

J.B. Wei ◽

Z. Fathi ◽

Binghua Pan ◽

Chih Kai Nah ◽

Su Liang Chan

Keyword(s):

Microwave Technology ◽

Rapid Cure

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Manufacturability and reliability of non-halogenated molding compounds

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906343 ◽

2002 ◽

Cited By ~ 3

Author(s):

L.G. Cada ◽

R. Lalanto ◽

G. Coronel ◽

N. San Gregorio ◽

D. Asis ◽

...

Keyword(s):

Molding Compounds

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A new approach for system integrated packaging

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906347 ◽

2002 ◽

Author(s):

R. Aschenbrenner ◽

A. Ostmann ◽

E. Jung ◽

C. Landesberger ◽

H. Reichl

Keyword(s):

New Approach

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Analysis of ACA/ACF package using equivalent spring method

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906358 ◽

2002 ◽

Cited By ~ 7

Author(s):

K.N. Chiang ◽

C.W. Chang ◽

J.D. Lin

Keyword(s):

Spring Method

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A new broadband transmission line model for accurate simulation of dispersive interconnects

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456) ◽

10.1109/eptc.2000.906398 ◽

2002 ◽

Cited By ~ 11

Author(s):

J. Morsey ◽

K. Coperich ◽

V. Okhmatovski ◽

A.C. Cangellaris ◽

A. Ruehli

Keyword(s):

Transmission Line ◽

Transmission Line Model ◽

Line Model

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Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Chemical imaging of micro-vias in organic packages

Applications of newly developed positive photosensitive block co-polyimides to CSPs

Copper flip chip bump interconnect technology for microwave subsystems including RF characterization

Evolutionary genetic approach to determine junction temperature in electronic packages

ADI-FMM, a customized FMEA for process management in the IC assembly and test industry

Use of microwave technology for rapid cure of chip-on-board glob top encapsulants

Manufacturability and reliability of non-halogenated molding compounds

A new approach for system integrated packaging

Analysis of ACA/ACF package using equivalent spring method

A new broadband transmission line model for accurate simulation of dispersive interconnects

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456)
Latest Publications