Manufacturability and reliability of non-halogenated molding compounds

2002 ◽  
Author(s):  
L.G. Cada ◽  
R. Lalanto ◽  
G. Coronel ◽  
N. San Gregorio ◽  
D. Asis ◽  
...  
Keyword(s):  
Molding Compounds

Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds

2019 ◽  
Vol 99 ◽  
pp. 161-167 ◽  
Author(s):  
Shih-Chieh Chao ◽  
Wei-Chen Huang ◽  
Jen-Hsiang Liu ◽  
Jenn-Ming Song ◽  
Po-Yen Shen ◽  
...  
Keyword(s):  
Lead Frame ◽  
Molding Compounds ◽  
Oxidation Characteristics ◽  
Commercial Copper

Air entrapment in sheet molding compounds (SMC)

1986 ◽  
Vol 7 (6) ◽  
pp. 431-434 ◽  
Author(s):  
Dag Slotfeldt-Ellingsen ◽  
Elisabeth Magnus ◽  
Eric Ekern ◽  
Egil Holtmon ◽  
Lars Corneliussen
Keyword(s):  
Air Entrapment ◽  
Molding Compounds

Adhesion Strengths of Epoxy Molding Compounds to Gold-plated Copper Leadframes

2000 ◽  
Vol 73 (1) ◽  
pp. 1-17 ◽  
Author(s):  
Sung Yl ◽  
Jang-Kyo Kim ◽  
Chee Yoon Yue ◽  
Jang-Hsing Hsieh
Keyword(s):  
Molding Compounds

scholarly journals Volumetrical Characterization of Sheet Molding Compounds

Materials ◽  
2010 ◽  
Vol 3 (12) ◽  
pp. 5083-5096 ◽  
Author(s):  
Alfredo Calvimontes ◽  
Karina Grundke ◽  
Anett Müller
Keyword(s):  
Molding Compounds

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

2012 ◽  
Vol 52 (11) ◽  
pp. 2677-2684 ◽  
Author(s):  
Andrej Ivankovic ◽  
Kris Vanstreels ◽  
Daniel Vanderstraeten ◽  
Guy Brizar ◽  
Renaud Gillon ◽  
...  
Keyword(s):  
Elastic Modulus ◽  
Experimental Methods ◽  
Molding Compounds ◽  
Ic Packaging

Alternative procedures for the recycling of sheet molding compounds

1993 ◽  
Vol 12 (1) ◽  
pp. 35-45 ◽  
Author(s):  
S. H. Patel ◽  
K. E. Gonsalves ◽  
S. S. Stivala ◽  
L. Reich ◽  
D. H. Trivedi
Keyword(s):  
Molding Compounds ◽  
Alternative Procedures

Plasma Surface Modification of Silica and its Application in Epoxy Molding Compounds for Large-Scale Integrated Circuits Packaging

2010 ◽  
Vol 158 ◽  
pp. 184-188 ◽  
Author(s):  
Ming Shan Yang ◽  
Lin Kai Li ◽  
Jian Guo Zhang
Keyword(s):  
Surface Modification ◽  
Acrylic Acid ◽  
Integrated Circuits ◽  
Plasma Polymerization ◽  
High Speed ◽  
Large Scale ◽  
Treatment Time ◽  
Rf Plasma ◽  
Formaldehyde Resin ◽  
Molding Compounds

The surface modification of silica for epoxy molding compounds (EMC) was conducted by plasma polymerization using RF plasma (13.56MPa), and the modification factors such as plasma power, gas pressure and treatment time were investigated systematically in this paper. The monomers utilized for the plasma polymer coatings were pyrrole, 1,3-diaminopropane, acrylic acid and urea. The plasma polymerization coating of silica was characterized by FTIR, contact angle. Using the silica treated by plasma as filler, ortho-cresol novolac epoxy as main resin, novolac phenolic-formaldehyde resin as cross-linking agent and 2-methylmizole as curing accelerating agent, the EMCs used for the packaging of large-scale integrated circuits were prepared by high-speed pre-mixture and twin roller mixing technology. The results have shown that the surface of silica can be coated by plasma polymerization of pyrrole, 1,3-diaminopropane, acrylic acid and urea, and the comprehensive properties of EMC were improved.

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