Evolutionary genetic approach to determine junction temperature in electronic packages

2002 ◽  
Author(s):  
A. Parthiban ◽  
K. Jeevan ◽  
K.N. Seetharamu ◽  
I.A. Azid
Keyword(s):  
Junction Temperature ◽  
Electronic Packages ◽  
Genetic Approach ◽  
Evolutionary Genetic

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

2009 ◽  
Author(s):  
Arun Prakash Raghupathy ◽  
Attila Aranyosi ◽  
Urmila Ghia ◽  
Karman Ghia ◽  
William Maltz
Keyword(s):  
Boundary Condition ◽  
Design Methodology ◽  
Integrated Design ◽  
Physical Models ◽  
Junction Temperature ◽  
Electronic Packages ◽  
Active Components ◽  
Detailed Model ◽  
Heat Flows ◽  
Small Form Factor

In the current study, a network-based resistor model has been developed for thermal analysis of a complex optoelectronic package called SFP (Small Form-factor Pluggable Device). This is done using the DELPHI (DEvelopment of Libraries of PHysical models for an Integrated design) Methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction, and typically has four heat generating sources. The detailed model for the SFP is constructed and validated using a natural convection experiment. The validated detailed model is used for generating the Boundary-Condition-Independent (BCI) Compact Thermal Model (CTM). Codes for solving the network topology and interfacing with the optimization subroutine were written using Matlab 7. The resulting CTM is extensively validated with multiple boundary condition sets. The CTM for the SFP shows maximum relative of errors less than 10% for the junction temperature on all of its active components and less than 20% for the heat flows through its sides for extreme set of boundary conditions.

Designing nootropic dipeptides using an evolutionary-genetic approach

2006 ◽  
Vol 40 (1) ◽  
pp. 18-22
Author(s):  
T. A. Gudasheva ◽  
S. S. Trofimov ◽  
A. A. Morozova ◽  
S. V. Nikitin ◽  
R. U. Ostrovskaya ◽  
...  
Keyword(s):  
Genetic Approach ◽  
Evolutionary Genetic

An Evolutionary Genetic Approach to Understanding Plastid Gene Function: Lessons from Photosynthetic and Nonphotosynthetic Plants

1990 ◽  
pp. 2381-2388 ◽  
Author(s):  
Jeffrey D. Palmer ◽  
Patrick J. Calie ◽  
Claude W. dePamphilis ◽  
John M. Logsdon ◽  
Deborah S. Katz-Downie ◽  
...  
Keyword(s):  
Gene Function ◽  
Genetic Approach ◽  
Plastid Gene ◽  
Evolutionary Genetic

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

2011 ◽  
Vol 133 (1) ◽  
Author(s):  
Arun Prakash Raghupathy ◽  
John Janssen ◽  
Attila Aranyosi ◽  
Urmila Ghia ◽  
Karman Ghia ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Boundary Condition ◽  
Thermal Model ◽  
Integrated Design ◽  
Physical Models ◽  
Junction Temperature ◽  
Small Subset ◽  
Electronic Packages ◽  
Detailed Model ◽  
Small Form Factor

In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using the DEvelopment of Libraries of PHysical models for an Integrated design (DELPHI) methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction and typically has four fixed heat generating sources. The detailed model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all “thinkable” boundary conditions that are experienced by the SFP device in practical situations. The commercial optimization tool developed by the DELPHI team, DOTCOMP, is used for generating the compact thermal model. A detailed validation of the CTM of the SFP in real-time applications using FLOTHERM 7.2, a computational fluid dynamics-based thermal analysis software package, is performed. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model. The SFP CTM predicts the junction temperature of the four power-dissipating components and the heat flows through the sides with relative error less than 10%.

Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages

2006 ◽  
Vol 3 (4) ◽  
pp. 177-193 ◽  
Author(s):  
Andy Perkins ◽  
Krishna Tunga ◽  
Suresh Sitaraman
Keyword(s):  
Fatigue Life ◽  
Environmental Parameters ◽  
Acceleration Factor ◽  
Junction Temperature ◽  
Design Parameters ◽  
Substrate Thickness ◽  
Electronic Packages ◽  
Printed Wiring Board ◽  
Ceramic Ball ◽  
Wiring Board

There is a need for a new Acceleration Factor (AF) that can relate Accelerated Thermal Cycle (ATC) fatigue life to Power Cycle (PC) fatigue life quickly and accurately in order to avoid over designing electronic packages for benign environments. An AF, such as the Norris-Landzberg AF, is only applicable when using it to predict fatigue life within the same environment, i.e. ATC to ATC or PC to PC. This work proposes an AF that takes into account the differences between ATC tests and PC tests for ceramic ball grid array (CBGA) packages by considering relevant design and environmental parameters. The new AF is based on relevant design parameters such as substrate size, substrate thermal conductivity, substrate thickness, coefficient of thermal (CTE) mismatch between the substrate and printed wiring board (PWB), PWB thickness, and environmental parameters such as temperature range (ΔT), frequency of cycles (f), and peak/junction temperature (Tj). Finite Element Models (FEM), experimental data, laser moiré interferometry, Design of Simulation (DOS), ANOVA, and regression analysis are used to develop the new AF. The new AF can be used to more accurately assess PC fatigue life from ATC tests so that expensive over-designing of electronic packages can be avoided for desktop/server/laptop applications.

Optimal Package Design of Stacks of Convection-Cooled Printed Circuit Boards Using Entropy Generation Minimization Method

2007 ◽  
Author(s):  
Wen Jei Yang ◽  
Takahiro Furukawa ◽  
Shuichi Torii
Keyword(s):  
Reynolds Number ◽  
Entropy Generation ◽  
Printed Circuit Boards ◽  
Junction Temperature ◽  
Electronic Packages ◽  
Circuit Boards ◽  
Thermal Optimization ◽  
Printed Circuit ◽  
Entropy Generation Minimization ◽  
Conductance Method

Thermal optimization of a stack of printed circuit boards using entropy generation minimization (EGM) method is presented. The study consists of two parts. One is focused on the entropy generation of a module in periodically fully-developed channel flow (PDF), while the other is the optimization applied to electronic packages composed of a stack of printed circuit boards. In the process of optimizing electronics packaging, consideration is given to two constraints which are the maximum junction temperature specified by a chip manufacturer and the allowable pressure difference across the channel maintained by cooling fans. The Reynolds number, block geometry and bypass flow area ratio are varied to search for an optimal channel spacing using the EGM method whose validity is borne out by comparing with those obtained by the conventional thermal optimization (or overall thermal conductance) method. A dimensionless optimal board spacing parameter C is derived which involves the relative migration speed (or time) of heat transfer and viscous friction over the PDF channel length. A correlation equation is derived which expresses C in terms of the Reynolds number and block geometry. This equation can be employed in the optimal design of electronic packages.

Evolution, genes, and inter‐disciplinary personality research

2007 ◽  
Vol 21 (5) ◽  
pp. 639-665 ◽  
Author(s):  
Lars Penke ◽  
Jaap J. A. Denissen ◽  
Geoffrey F. Miller
Keyword(s):  
Environmental Factors ◽  
Mate Choice ◽  
Evolutionary Theory ◽  
Genetic Model ◽  
Integrative Model ◽  
Genetic Approach ◽  
Genetic Theory ◽  
Personality Research ◽  
Evolutionary Genetic ◽  
Scientific Status

Most commentaries welcomed an evolutionary genetic approach to personality, but several raised concerns about our integrative model. In response, we clarify the scientific status of evolutionary genetic theory and explain the plausibility and value of our evolutionary genetic model of personality, despite some shortcomings with the currently available theories and data. We also have a closer look at mate choice for personality traits, point to promising ways to assess evolutionarily relevant environmental factors and defend higher‐order personality domains and the g‐factor as the best units for evolutionary genetic analyses. Finally, we discuss which extensions of and alternatives to our model appear most fruitful, and end with a call for more inter‐disciplinary personality research grounded in evolutionary theory. Copyright © 2007 John Wiley & Sons, Ltd.

Immersion Cooling of Vertically Mounted Plastic Packages Using Various Flourinert Liquids

2004 ◽  
Vol 1 (3) ◽  
pp. 157-168
Author(s):  
Logendran Bharatham ◽  
G. A. Quadir ◽  
A. Y. Hassan ◽  
K.N. Seetharamu
Keyword(s):  
Power Flow ◽  
Lower Surface ◽  
Junction Temperature ◽  
Heat Transfer Analysis ◽  
Electronic Packages ◽  
Dielectric Liquids ◽  
Immersion Cooling ◽  
Alternative Means ◽  
Lower Surface Temperature ◽  
Liquid Immersion

Liquid immersion cooling offers an alternative means to counter the high amount of heat dissipated by electronic packages. This study focuses on conjugate heat transfer analysis of a double PLCC packages mounted on a vertical PCB cooled by different Flourinert liquids such as FC 77, FC 3283, FC 43 and FC 70 with the aid of a CFD software. The effects of package power, flow velocity and the use of different types of dielectric liquids on the performance of the above PLCC packages are investigated. A comparison with air-cooled cases clearly indicates that a very much lower surface temperature exists on the operating packages in the case of dielectric liquids. For the convenience of application in the electronic industry, the results are presented in the form of correlations for junction temperature for each package.

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