High-frequency characterization of embedded active components in printed circuit boards

2006 ◽  
Author(s):  
Maarten Cauwe ◽  
Johan De Baets ◽  
Andre Van Calster
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Active Components ◽  
Printed Circuit

scholarly journals Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

2018 ◽  
Vol 193 ◽  
pp. 140-153 ◽  
Author(s):  
Gautier Girard ◽  
Mohamad Jrad ◽  
Slim Bahi ◽  
Marion Martiny ◽  
Sébastien Mercier ◽  
...  
Keyword(s):  
High Frequency ◽  
Printed Circuit Boards ◽  
Woven Composites ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Numerical Characterization

Modular Printed Circuit Boards for Broadband Characterization of Nanoelectronic Quantum Devices

2016 ◽  
Vol 65 (8) ◽  
pp. 1827-1835 ◽  
Author(s):  
Marco Lorenzo Valerio Tagliaferri ◽  
Alessandro Crippa ◽  
Simone Cocco ◽  
Marco De Michielis ◽  
Marco Fanciulli ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Quantum Devices ◽  
Printed Circuit

Time-Dependent Rheological Behavior of Fluids For Electronics Packaging

2005 ◽  
Vol 127 (4) ◽  
pp. 370-374 ◽  
Author(s):  
X. B. Chen
Keyword(s):  
Rheological Behavior ◽  
Printed Circuit Boards ◽  
Flow Behavior ◽  
Electronics Packaging ◽  
Time Dependent ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Fluid Behavior ◽  
Surface Mounting

In electronics packaging, one of the key processes is dispensing fluid materials, such as adhesive, epoxy, encapsulant, onto substrates or printed circuit boards for the purpose of surface mounting or encapsulation. In order to precisely control the dispensing process, the understanding and characterization of the flow behavior of the fluid being dispensed is very important, as the behavior can have a significant influence on the dispensing process. However, this task has proven to be very challenging due to the fact that the fluids for electronics packaging usually exhibit the time-dependent rheological behavior, which has not been well defined in literature. In the paper a study on the characterization of the time-dependent rheological behavior of the fluids for electronics packaging is presented. In particular, a model is developed based on structural theory and then applied to the characterization of the decay and recovery of fluid behavior, which happen in the dispensing process due to the interruption of process. Experiments are carried out to verify the effectiveness of the model developed.

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