scholarly journals Implementation of the Front-End-Module with a Power Amplifier for Wireless LAN

10.5772/9049 ◽  
2010 ◽  
Author(s):  
Jong-In Ryu ◽  
Dongsu Kim ◽  
Jun-Chul Kim
Keyword(s):  
Power Amplifier ◽  
Wireless Lan ◽  
Front End ◽  
Front End Module

An LTCC Based Filter and Front End Module using Heterogeneous Dielectrics

2006 ◽  
Vol 3 (3) ◽  
pp. 129-135 ◽  
Author(s):  
Jun Chul Kim ◽  
Dongsu Kim ◽  
Hyun Min Cho ◽  
Jong Chul Park ◽  
Nam Kee Kang
Keyword(s):  
Power Amplifier ◽  
Bandpass Filter ◽  
Wave Length ◽  
Signal Delay ◽  
Ceramic Substrates ◽  
Front End ◽  
Quarter Wave ◽  
Front End Module ◽  
Signal Delay Time ◽  
Shunt Capacitor

This paper presents a multi-layered bandpass filter (BPF) and a power amplifier module (PAM) integrated with a SAW duplexer based on heterogeneous ceramic substrates. The heterogeneous substrates are composed of two different ceramic layers with εr = 7.4 and 17.5 in order to take advantage of their own properties. In the PAM substrate, a DC blocking capacitor and a shunt capacitor for an output matching network of a power amplifier are embedded with a material of εr = 17.5 to reduce occupied areas of the capacitors. On the other hand, a quarter-wave-length stripline and RF chokes are realized with a material of εr = 7.4 to reduce signal delay time. In the multi-layered BPF, a coupled stripline and a high shunt capacitor are embedded with materials of εr = 7.4 and 17.5, respectively, resulting in improved spurious characteristics.

scholarly journals RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems

2003 ◽  
Author(s):  
M. Tentzeris ◽  
J. Laskar
Keyword(s):  
Wireless Lan ◽  
High Performance ◽  
Low Cost ◽  
Patch Antennas ◽  
Organic Substrates ◽  
Q Factor ◽  
Rf System ◽  
Front End ◽  
Organic Packages ◽  
Front End Module

This paper presents the development of RF System-on-Package (SOP) architectures for compact and low cost wireless radio front-end systems. A novel 3D integration approach for SOP-based solutions for wireless communication applications is proposed and utilized for the implementation of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LTCC substrates using μBGA technology. LTCC designs of high-performance multilayer embedded bandpass filters and novel stacked cavity-backed patch antennas are also reported. In addition, the fabrication of very high Q-factor inductors and embedded filter in organic substrates demonstrate the satisfactory performance of multilayer organic packages. The well known full-wave numerical techniques of FDTD and MRTD are used for the modeling of adjacent lines crosstalk, of the Q-factor of embedded passives and for the accurate simulation of MEMS structures.

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