Implementation of a front-end-module by embedding a RF switch IC and a power amplifier in printed-circuit-board

2009 ◽  
Author(s):  
Jong-In Ryu ◽  
Se-Hoon Park ◽  
Jong-Won Moon ◽  
Dongsu Kim ◽  
Jun Chul Kim ◽  
...  
Keyword(s):  
Power Amplifier ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Rf Switch ◽  
Printed Circuit ◽  
Front End ◽  
Front End Module

An Assessment of the Impact of Interconnect Strategies on Thermal Performance of GaAs Power Amplifier IC Devices

2001 ◽  
Author(s):  
V. H. Adams ◽  
T.-Y. Tom Lee
Keyword(s):  
Thermal Resistance ◽  
Power Amplifier ◽  
Thermal Performance ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Wire Bond ◽  
Die Attach ◽  
The Impact

Abstract Alternative interconnect strategies are being considered in place of the standard wire bond interconnect for GaAs power amplifier MMIC devices due to cost and electrical performance improvements. The package/die thermal performance consequences are potentially high-risk issue to these interconnect strategies and requires evaluation. Thermal simulations are conducted to compare and evaluate the thermal performances of three interconnect strategies: wire bond, gold post-flip chip, and through via interconnects. The test vehicle simulated is a three-stage, dual band power amplifier integrated circuit dissipating approximately 5 W steady-state power. Parametric studies are conducted to evaluate the impact of the printed circuit board, die thickness, solid gold vias, and design enhancements on package thermal performance. Best thermal performance is provided by a wire bonded, thin GaAs die attached with solder die attach to a printed circuit board that maximizes the number of plated-through-holes directly under the die. This configuration results in a best case junction-to-heat sink thermal resistance of 12 °C/W. Optimum flip chip and through via designs result in degraded thermal performance compared to the above described wire bond design but may have acceptable thermal performance. For these simulations, predicted junction-to-heatsink thermal resistance is in a range of 15–20 °C/W and is better than a comparable wire bonded design that uses a conductive epoxy die attach material.

scholarly journals REALIZATION OF A CONDUCTIVE BRIDGING RF SWITCH INTEGRATED ONTO PRINTED CIRCUIT BOARD

2015 ◽  
Vol 151 ◽  
pp. 9-16 ◽  
Author(s):  
Etienne Perret ◽  
Thais Luana Vidal ◽  
Arnaud Vena ◽  
Patrice Gonon
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Rf Switch ◽  
Printed Circuit

Effect of Printed Circuit Board Structures on Temperature-Dependent Gain Characteristics of RF Power Amplifier Chips

2008 ◽  
Vol 18 (5) ◽  
pp. 323-325 ◽  
Author(s):  
Jeongkyu Heo ◽  
Jae Choon Kim ◽  
Ki Hyuk Kim ◽  
Jae-Sung Rieh ◽  
Jin Taek Chung ◽  
...  
Keyword(s):  
Power Amplifier ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Rf Power ◽  
Temperature Dependent ◽  
Printed Circuit ◽  
Rf Power Amplifier

InGaP/GaAs HBT power amplifier based on flexible printed circuit board

2006 ◽  
Author(s):  
Seong-Sik Myoung ◽  
Sang-Hoon Cheon ◽  
Jae-Woo Park ◽  
Jin-Sang Jang ◽  
Moon-Ho Dong ◽  
...  
Keyword(s):  
Power Amplifier ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Flexible Printed Circuit

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission
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