2009 59th Electronic Components and Technology Conference
Latest Publications

TOTAL DOCUMENTS

344

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424444755

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074207 ◽

2009 ◽

Cited By ~ 3

Author(s):

Kyoung-Moo Harr ◽

Young-Min Kim ◽

Dae Hwan Lim ◽

Young-Ho Kim ◽

Jin-Gu Kim ◽

...

Keyword(s):

Image Sensor ◽

Conductive Adhesive ◽

Bonding Technique

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The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074048 ◽

2009 ◽

Cited By ~ 15

Author(s):

Richard Coyle ◽

Michael Reid ◽

Claire Ryan ◽

Richard Popowich ◽

Peter Read ◽

...

Keyword(s):

Solder Alloy ◽

Thermal Fatigue ◽

Alloy Composition ◽

Processing Parameters ◽

Fatigue Performance ◽

Free Solder

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Capacitors on organic modules: a new THB failure mode and method of detection

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074173 ◽

2009 ◽

Cited By ~ 1

Author(s):

Wolfgang Sauter ◽

Jennifer Muncy ◽

Joseph Ross ◽

Jeffrey Coffin ◽

Charles Arvin ◽

...

Keyword(s):

Failure Mode

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Intermetallic reaction between electroplated indium and silver layers

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074182 ◽

2009 ◽

Cited By ~ 3

Author(s):

Pin J. Wang ◽

Jong S. Kim ◽

Chin C. Lee

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Manufacturing and stacking of ultra-thin film packages

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074201 ◽

2009 ◽

Cited By ~ 2

Author(s):

Ying-Ching Shih ◽

Tzu-Ying Kuo ◽

Yin-Po Hung ◽

Jing-Yao Chang ◽

Chih-Yuan Cheng ◽

...

Keyword(s):

Thin Film ◽

Ultra Thin Film

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Measurement and analysis of the impact of micrometer scale cracks on the RF performance and reliability of transmission lines

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074175 ◽

2009 ◽

Cited By ~ 3

Author(s):

Michael Kruger ◽

Andreas Middendorf ◽

Ivan Ndip ◽

Nils F. Nissen ◽

Herbert Reichl

Keyword(s):

Transmission Lines ◽

Measurement And Analysis ◽

Rf Performance ◽

Micrometer Scale ◽

The Impact

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Experimental and numerical verification of water ingress into a void of plastic packages by quick diffusion

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074194 ◽

2009 ◽

Author(s):

Haojun Zhang ◽

Seungbae Park

Keyword(s):

Numerical Verification ◽

Water Ingress ◽

Plastic Packages

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Low-frequency test method for integrated RF substrates

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074059 ◽

2009 ◽

Cited By ~ 3

Author(s):

Abhilash Goyal ◽

Madhavan Swaminathan ◽

Abhijit Chatterjee

Keyword(s):

Low Frequency ◽

Test Method ◽

Frequency Test

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Characterization of epoxy/BaTiO3 composite embedded capacitors for high frequency behaviors

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074304 ◽

2009 ◽

Cited By ~ 1

Author(s):

Jin-Gul Hyun ◽

Kyung-Wook Paik ◽

Jun So Pak

Keyword(s):

High Frequency ◽

Embedded Capacitors

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Fabrication and characterization of horizontally aligned carbon nanotubes for interconnect application

2009 59th Electronic Components and Technology Conference ◽

10.1109/ectc.2009.5074205 ◽

2009 ◽

Cited By ~ 3

Author(s):

Yang Chai ◽

Zhiyong Xiao ◽

Philip C. H. Chan

Keyword(s):

Carbon Nanotubes ◽

Aligned Carbon Nanotubes ◽

Fabrication And Characterization

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2009 59th Electronic Components and Technology ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging

The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor

Capacitors on organic modules: a new THB failure mode and method of detection

Intermetallic reaction between electroplated indium and silver layers

Manufacturing and stacking of ultra-thin film packages

Measurement and analysis of the impact of micrometer scale cracks on the RF performance and reliability of transmission lines

Experimental and numerical verification of water ingress into a void of plastic packages by quick diffusion

Low-frequency test method for integrated RF substrates

Characterization of epoxy/BaTiO3 composite embedded capacitors for high frequency behaviors

Fabrication and characterization of horizontally aligned carbon nanotubes for interconnect application

2009 59th Electronic Components and Technology Conference
Latest Publications