scholarly journals Stress Measurements in Si and SiGe by Liquid-Immersion Raman Spectroscopy

Author(s):  
Daisuke Kosemura ◽  
Motohiro Tomita ◽  
Koji Usuda ◽  
Atsushi Ogur
Author(s):  
Dietmar Vogel ◽  
Astrid Gollhardt ◽  
Bernd Michel

Three different methods of stress measurement with strong spatial resolution are presented. They base on stress relief techniques caused by focused ion beam milling, on altered electron backscattering by deformed lattices and on Stokes line shift measurements by Raman spectroscopy. The capability of these methods is demonstrated by their application to typical MEMS structures. A comparison between the methods is performed in order to outline potentials and limitations.


1993 ◽  
Vol 309 ◽  
Author(s):  
Ingrid De Wolf ◽  
Rudi Bellens ◽  
Guido Groeseneken ◽  
Herman E. Maes

AbstractNon-uniform hot-carrier degradation in n-channel polycide-gate MOSFET's with different thicknesses of the poly-Si film, and in p-channel polycide-gate MOSFET's with TiSi2- or CoSi2-gate-silicide, is studied. The n-MOSFET's with the thinnest poly-Si film, show an increased interface trap generation, while the influence of the gate-silicide material on the degradation behaviour of the p-MOSFET's is found to be very small. The results are evaluated in terms of the effect of mechanical stress on the degradation characteristics: favourable for compressive mechanical stress and unfavourable for tensile stress. A correlation with stress measurements by micro-Raman spectroscopy is made.


2004 ◽  
Vol 21 (2) ◽  
pp. 403-405 ◽  
Author(s):  
Lei Zhen-Kun ◽  
Kang Yi-Lan ◽  
Hu Ming ◽  
Qiu Yu ◽  
Xu Han ◽  
...  

1997 ◽  
Vol 71 (17) ◽  
pp. 2520-2522 ◽  
Author(s):  
J. P. Landesman ◽  
A. Fiore ◽  
J. Nagle ◽  
V. Berger ◽  
E. Rosencher ◽  
...  

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