Reliability of Copper-Plated Through-Package-Via (TPV) in Glass Packages with in-Situ Stress Measurements Using Raman Spectroscopy

2016 ◽  
Author(s):  
Kaya Demir ◽  
Abdellah Benali ◽  
Venky Sundaram ◽  
P. Markondeya Raj ◽  
Rao Tummala
Keyword(s):  
Raman Spectroscopy ◽  
In Situ Stress ◽  
Stress Measurements ◽  
In Situ Stress Measurements

Estimation of the present-day stress field using in-situ stress measurements in the Alxa area, Inner Mongolia for China's HLW disposal

2017 ◽  
Vol 220 ◽  
pp. 76-84 ◽  
Author(s):  
Jianju Du ◽  
Xianghui Qin ◽  
Qingli Zeng ◽  
Luqing Zhang ◽  
Qunce Chen ◽  
...  
Keyword(s):  
Stress Field ◽  
Inner Mongolia ◽  
In Situ Stress ◽  
Stress Measurements ◽  
In Situ Stress Measurements
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