scholarly journals Surface Finishing Technology and Semiconductor Fabrication Process. Wet Cleaning Technology for Silicon Wafer.

1998 ◽  
Vol 49 (3) ◽  
pp. 242-247
Author(s):  
Koji IZUNOME
Keyword(s):  
Silicon Wafer ◽  
Fabrication Process ◽  
Surface Finishing ◽  
Semiconductor Fabrication ◽  
Cleaning Technology

Fabrication of Ultra Thick Ferromagnetic Structures in Silicon

2004 ◽  
Author(s):  
Debbie G. Jones ◽  
Albert P. Pisano
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Scanning Electron Microscopy ◽  
Saturation Magnetization ◽  
Silicon Wafer ◽  
Fabrication Process ◽  
Sem Images ◽  
Deep Reactive Ion Etching ◽  
Scanning Electron

A novel fabrication process is presented to create ultra thick ferromagnetic structures in silicon. The structures are fabricated by electroforming NiFe into silicon templates patterned with deep reactive ion etching (DRIE). Thin films are deposited into photoresist molds for characterization of an electroplating cell. Results show that electroplated films with a saturation magnetization above 1.6 tesla and compositions of approximately 50/50 NiFe can be obtained through agitation of the electrolyte. Scanning electron microscopy (SEM) images show that NiFe structures embedded in a 500 μm thick silicon wafer are realized and the roughening of the mold sidewalls during the DRIE aids in adhesion of the NiFe to the silicon.

Fabrication Process of Antimony Telluride and Bismuth Telluride Micro Thermoelectric Generator

2015 ◽  
Vol 9 (6) ◽  
pp. 612-618
Author(s):  
Mizue Mizoshiri ◽  
◽  
Masashi Mikami ◽  
Kimihiro Ozaki ◽  
Keyword(s):  
Bismuth Telluride ◽  
Thermoelectric Generator ◽  
Fabrication Process ◽  
Thermoelectric Generators ◽  
Antimony Telluride ◽  
Semiconductor Fabrication ◽  
Micro Thermoelectric Generator ◽  
Key Techniques

This paper describes the process of fabricating micro thermoelectric generators (μ-TEGs) based on antimony telluride (Sb-Te) and bismuth telluride (Bi-Te). These materials have excellent thermoelectric (TE) conversion properties. The deposition and patterning processes for thermoelectric films are key techniques in the fabrication of μ-TEGs. However, it is difficult to form TE micropatterns using conventional semiconductor technologies because Sb-Te and Bi-Te are brittle and difficult to etch. Therefore, a semiconductor fabrication process is developed for TE film patterning. Here, various processes for depositing Sb-Te and Bi-Te TE films are described. Then, the combinations of the deposition and patterning techniques are reviewed. Finally, the generation properties of the μ-TEGs are summarized.

Assessment of fire protection performance of water mist applied in exhaust ducts for semiconductor fabrication process

2005 ◽  
Vol 29 (5) ◽  
pp. 295-302 ◽  
Author(s):  
Yi-Liang Shu ◽  
Wei-Jin Jeng ◽  
Chen-Wei Chiu ◽  
Chiun-Hsun Chen
Keyword(s):  
Fire Protection ◽  
Water Mist ◽  
Fabrication Process ◽  
Semiconductor Fabrication
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