Surface Finishing Technology and Semiconductor Fabrication Process. Effect of Water Absorption of Dietectric Underlayers on Textures and Reliabiity in Al-Si-Cu/Ti/TiN/Ti Layered Interconnects.
1998 ◽
Vol 49
(3)
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pp. 266-272
Keyword(s):
1998 ◽
Vol 49
(3)
◽
pp. 260-265
1998 ◽
Vol 49
(3)
◽
pp. 253-259
1998 ◽
Vol 49
(3)
◽
pp. 242-247
Keyword(s):
1998 ◽
Vol 49
(3)
◽
pp. 248-252
2008 ◽
Vol 128
(9)
◽
pp. 585-590
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Keyword(s):
1999 ◽
Vol 29
(5)
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pp. 765-767
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1986 ◽
Vol 26
(6)
◽
pp. 405-409
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