PoP Technology for the Automotive Industry

2014 ◽  
Vol 2014 (1) ◽  
pp. 000081-000085
Author(s):  
Jaimal Williamson ◽  
Kurt Wachtler ◽  
David Chin ◽  
Mike Pierce
Keyword(s):  
Automotive Industry ◽  
Memory Performance ◽  
Automotive Applications ◽  
Defect Level ◽  
Packaging Technology ◽  
Package Design ◽  
Surface Mount ◽  
Board Level ◽  
Performance Surface ◽  
Board Level Reliability

Package-on-Package (PoP) technology has been in production for commercial and portable electronic applications for many years. The key challenge for PoP in automotive applications is meeting the aggressive defect level requirements. The need for PoP has historically been driven by mobile and tablet applications and an increased demand for more processor and memory performance within smaller spaces. With the maturity and excellent historical performance of PoP technology used with TI OMAPTM processor products, PoP can now be introduced as a reliable packaging technology in the automotive industry. This paper will describe the work involved in the enablement of commercial PoP technology into the automotive industry. The challenges and requirements regarding package design, warpage performance, surface mount (SMT) characterization, and board-level reliability (BLR) performance will all be explained.

Optimizing Board Level Reliability of a Novel LGA Package for IoT Applications

2016 ◽  
Vol 2016 (1) ◽  
pp. 000675-000682
Author(s):  
Tara Assi ◽  
Paul Galles ◽  
Andrew Mawer ◽  
Trent Uehling ◽  
Steve Safai
Keyword(s):  
Internet Of Things ◽  
Technology Development ◽  
Bend Testing ◽  
Package Design ◽  
Vast Array ◽  
Thermomechanical Cycling ◽  
Iot Applications ◽  
Board Level ◽  
Board Level Reliability ◽  
Level Performance

Abstract Technology development for Internet of Things applications is growing astronomically, increasing the demand for smaller, faster, and lower power solutions to run and power a vast array of connected machines and objects. The LS1012A is the smallest 64-bit processor on the market today, with a novel 211 LGA package that creates a mechanically robust and space efficient component. However, excellent board level reliability is required in order to meet the various IoT application needs. This study evaluates the board level reliability of the 211 LGA by performing single chamber thermomechanical cycling, monotonic bend testing, and JEDEC drop testing. The objective of this study is to fully optimize the board level performance of the 211 LGA without dramatically altering the package design. Two significant board level changes were applied to achieve significant board level performance, exceeding all projected application uses.

scholarly journals ESD Diode Protection Incorporated on Leadframe Package

2020 ◽  
pp. 30-33
Author(s):  
Frederick Ray I. Gomez ◽  
Edwin M. Graycochea Jr. ◽  
Nerie R. Gomez ◽  
Rennier S. Rodriguez
Keyword(s):  
Integrated Circuit ◽  
Electrostatic Discharge ◽  
Electronic Devices ◽  
Circuit Board ◽  
Surface Mount Technology ◽  
Package Design ◽  
Surface Mount ◽  
Before And After ◽  
Board Level

With the new die technology becomes smaller and thinner, silicon die circuit metallization also becomes smaller, thus electronic devices like quad-flat no-leads multi-row (QFN-mr) semiconductor leadframe package design become more sensitive and prone to electrostatic discharge (ESD) damages. This paper focused and introduced an additional surface mount technology by attaching diodes before and after diebonding process to protect the whole package and to prevent package related issues encountered. With this diode attached on the silicon die and leads, added protection could be achieved on the integrated circuit (IC) mounted on the circuit board level.

Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties

2020 ◽  
Vol 2020 (1) ◽  
pp. 000073-000077
Author(s):  
Jong-Gi Lee ◽  
Jin-Soo Bae ◽  
Yeo-Hoon Yoon ◽  
Jun-Ho Lee ◽  
Kang-Young Cho
Keyword(s):  
Life Time ◽  
Critical Issue ◽  
Memory Device ◽  
Point Of View ◽  
Automotive Application ◽  
Automotive Applications ◽  
Large Ball ◽  
The One ◽  
Board Level ◽  
Board Level Reliability

Abstract As increased in demand for using memory devices in automotive applications, board level reliability (BLR) has been the one of the critical issue for using FBGA type packages in automotive. The required specification of BLR is listed in various standards (AEC-Q100, Q104 etc) and it is varied by automotive application customers. Most of customers are targeting grade from 1 to 3, however, requirement to memory package is grade 1 (−40°C~125°C). Currently low power (LP) memory device is widely adopted in automotive applications due to its wide bandwidth and high density capability. From package reliability point of view, it is challenge to satisfy the required BLR for target package by 1) dimension optimization, 2) selection of material, 3) mount condition, and 4) work around method. In this paper, the best combination to achieve the highest BLR life time was investigated compared with current mobile application LP4 package. Large pad size with large ball, high content of Ag in solder ball and Ni/Au pad finish were the best combination to result in the longest life time. Various density of LP4 package BLR were also estimated by mechanical simulation based from actual thermal cycling test on the highest Si volume LP4 package.

Rapid Prediction of BGA Board Level Reliability Due to PWB Flexure

2004 ◽  
Author(s):  
Chuntao Zhang
Keyword(s):  
Structural Parameters ◽  
Software Tool ◽  
Response Surfaces ◽  
Influential Factors ◽  
Product Development Process ◽  
Printed Wiring Board ◽  
Package Design ◽  
Wiring Board ◽  
Board Level ◽  
Board Level Reliability

BGA interconnect fatigue failure due to printed wiring board (PWB) flexure has been one of the top board-level reliability issues in portable electronic devices as products become smaller and lighter. Although much effort has been expended in the past to investigate the effect of package design on component bending reliability, the effects of PWB structural parameters such as board support and component location on board-level reliability have not been well studied. As a result, data and information currently available for design assistance are limited. In this study, a methodology was developed to systematically characterize the component board level reliability due to PWB flexure. Response surfaces and correction factors were generated based on the systematic characterization with respect to the board structural parameters and other influential factors, and implemented in a software tool, permitting rapid reliability prediction of BGA board level reliability at the earliest stage of product development process to reduce cycle time.

Board Level Reliability of Automotive Grade WLCSP for Radar Applications

2020 ◽  
Author(s):  
Nishant Lakhera ◽  
Burt Carpenter ◽  
Trung Duong ◽  
Mollie Benson ◽  
Andrew J Mawer
Keyword(s):  
Radar Applications ◽  
Board Level ◽  
Board Level Reliability

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

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