Board level reliability and surface mount assembly of 0.35mm and 0.3mm pitch wafer level packages

2014 ◽  
Author(s):  
Beth Keser ◽  
Rey Alvarado ◽  
Alan Choi ◽  
Mark Schwarz ◽  
Steve Bezuk
Keyword(s):  
Wafer Level ◽  
Surface Mount ◽  
Board Level ◽  
Board Level Reliability

PoP Technology for the Automotive Industry

2014 ◽  
Vol 2014 (1) ◽  
pp. 000081-000085
Author(s):  
Jaimal Williamson ◽  
Kurt Wachtler ◽  
David Chin ◽  
Mike Pierce
Keyword(s):  
Automotive Industry ◽  
Memory Performance ◽  
Automotive Applications ◽  
Defect Level ◽  
Packaging Technology ◽  
Package Design ◽  
Surface Mount ◽  
Board Level ◽  
Performance Surface ◽  
Board Level Reliability

Package-on-Package (PoP) technology has been in production for commercial and portable electronic applications for many years. The key challenge for PoP in automotive applications is meeting the aggressive defect level requirements. The need for PoP has historically been driven by mobile and tablet applications and an increased demand for more processor and memory performance within smaller spaces. With the maturity and excellent historical performance of PoP technology used with TI OMAPTM processor products, PoP can now be introduced as a reliable packaging technology in the automotive industry. This paper will describe the work involved in the enablement of commercial PoP technology into the automotive industry. The challenges and requirements regarding package design, warpage performance, surface mount (SMT) characterization, and board-level reliability (BLR) performance will all be explained.

Package Qualification Envelope for 22FDX® Technology

2019 ◽  
Vol 2019 (1) ◽  
pp. 000169-000175
Author(s):  
Christian Klewer ◽  
Frank Kuechenmeister ◽  
Jens Paul ◽  
Dirk Breuer ◽  
Bjoern Boehme ◽  
...  
Keyword(s):  
Flip Chip ◽  
Silicon On Insulator ◽  
Wafer Level ◽  
Characterization Methods ◽  
Fully Depleted ◽  
Individual Market ◽  
The Individual ◽  
Key Aspects ◽  
Board Level ◽  
Board Level Reliability

Abstract This article describes the methodology used to derive the 22FDX® Fully-Depleted Silicon-On-Insulator (FDSOI) Chip Package Interaction (CPI) qualification envelope. In the first part it is discussed how the individual market segments influence the technology features and offerings, including BEOL stacks and package types. In the following, the criteria used for the selection of BEOL stacks, die and package sizes and the interconnect type for the qualification envelope are summarized and explained. The three CPI qualification stages and related characterization methods are presented. CPI test structures used in the envelope are reported and their placement on the technology qualification vehicles (TQV) is outlined on the basis of flip chip TQV. Finally, the paper presents the passing 22FDX® package and board level reliability results obtained for wire bond, flip chip, as well as wafer level fan-in and fan-out package technologies. Key aspects of the individual qualifications are reported.

Board level reliability of automotive eWLB (embedded wafer level BGA) FOWLP

2016 ◽  
Author(s):  
Lin Yaojian ◽  
Bernard Adams ◽  
Roberto Antonicelli ◽  
Luc Petit ◽  
Daniel Yap ◽  
...  
Keyword(s):  
Wafer Level ◽  
Board Level ◽  
Board Level Reliability
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