2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

373

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781479924073

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Package-level electromagnetic interference analysis

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897595 ◽

2014 ◽

Cited By ~ 5

Author(s):

Namhoon Kim ◽

Leo Hongyu Li ◽

Sam Karikalan ◽

Reza Sharifi ◽

Henry Kim

Keyword(s):

Electromagnetic Interference ◽

Interference Analysis

Download Full-text

Assembly and packaging technologies for high-temperature and high-power GaN HEMTs

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897605 ◽

2014 ◽

Cited By ~ 7

Author(s):

A. A. Bajwa ◽

Y. Qin ◽

J. Wilde ◽

R. Reiner ◽

P. Waltereit ◽

...

Keyword(s):

High Temperature ◽

High Power ◽

Gan Hemts

Download Full-text

Computational investigation of failure in anodized aluminum

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897582 ◽

2014 ◽

Author(s):

Sabrina Ball ◽

Ibrahim Guven ◽

Pankaj Sinha ◽

Rajiv Rastogi ◽

Brian McCarson

Keyword(s):

Computational Investigation ◽

Anodized Aluminum

Download Full-text

Solder joint inspection with induction thermography

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897494 ◽

2014 ◽

Author(s):

Johannes Bohm ◽

Klaus-Juergen Wolter ◽

Henning Heuer

Keyword(s):

Solder Joint ◽

Solder Joint Inspection

Download Full-text

Thermal and electrical tests of air-gap TSV

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897529 ◽

2014 ◽

Cited By ~ 2

Author(s):

Cui Huang ◽

Dong Wu ◽

Zheyao Wang

Keyword(s):

Air Gap

Download Full-text

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897471 ◽

2014 ◽

Cited By ~ 2

Author(s):

Bing Dang ◽

Joana Maria ◽

Qianwen Chen ◽

Jae-Woong Nah ◽

Paul Andry ◽

...

Download Full-text

Advancements in fabrication of glass interposers

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897261 ◽

2014 ◽

Cited By ~ 25

Author(s):

Aric Shorey ◽

Philippe Cochet ◽

Alan Huffman ◽

John Keech ◽

Matt Lueck ◽

...

Download Full-text

CMOS multiplexer for portable biosensing system with integrated microfluidic interface

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897285 ◽

2014 ◽

Cited By ~ 3

Author(s):

Tetiana Voitsekhivska ◽

Eike Suthau ◽

Klaus-Juergen Wolter

Keyword(s):

Biosensing System

Download Full-text

First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897426 ◽

2014 ◽

Cited By ~ 9

Author(s):

Kaya Demir ◽

Andac Armutlulu ◽

Jialing Tong ◽

Raghuram Pucha ◽

Venkatesh Sundaram ◽

...

Keyword(s):

Bare Glass

Download Full-text

High-speed wet etching of through silicon vias (TSVs) in micro- and nanoscale

2014 IEEE 64th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2014.6897352 ◽

2014 ◽

Cited By ~ 3

Author(s):

Liyi Li ◽

Ching-Ping Wong

Keyword(s):

High Speed ◽

Wet Etching ◽

Through Silicon Vias ◽

Silicon Vias

Download Full-text

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Package-level electromagnetic interference analysis

Assembly and packaging technologies for high-temperature and high-power GaN HEMTs

Computational investigation of failure in anodized aluminum

Solder joint inspection with induction thermography

Thermal and electrical tests of air-gap TSV

Assembly and packaging of non-bumped 3D chip stacks on bumped substrates

Advancements in fabrication of glass interposers

CMOS multiplexer for portable biosensing system with integrated microfluidic interface

First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers

High-speed wet etching of through silicon vias (TSVs) in micro- and nanoscale

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
Latest Publications