scholarly journals Laser-Induced Selective Electroless Plating on PC/ABS Polymer: Minimisation of Thermal Effects for Supreme Processing Speed

Polymers ◽  
2020 ◽  
Vol 12 (10) ◽  
pp. 2427
Author(s):  
Karolis Ratautas ◽  
Vytautas Vosylius ◽  
Aldona Jagminienė ◽  
Ina Stankevičienė ◽  
Eugenijus Norkus ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Electroless Plating ◽  
Thermal Effects ◽  
Chemical Activation ◽  
Polymer Surface ◽  
Copper Deposition ◽  
Limiting Factor ◽  
Surface Activation ◽  
Laser Writing ◽  
Electroless Copper

The selective surface activation induced by laser (SSAIL) for electroless copper deposition on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend is one of the promising techniques of electric circuit formation on free-shape dielectric surfaces, which broadens capabilities of 3D microscopic integrated devices (3D-MIDs). The process consists of laser excitation, chemical activation of laser-excited areas by dipping in a liquid and electroless copper deposition of the laser-treated areas. The limiting factor in increasing throughput of the technology is a laser activation step. Laser writing is performed by modern galvanometric scanners which reach the scanning speed of several meters per second. However, adverse thermal effects on PC/ABS polymer surface abridge the high-speed laser writing. In this work, an investigation was conducted on how these thermal effects limit surface activation for selective metal deposition from the view of physics and chemistry. An advanced laser beam scanning technique of interlacing with precise accuracy and the pulse-on-demand technique was applied to overcome mentioned problems for fast laser writing. Initially, the modelling of transient heat conduction was performed. The results revealed a significant reduction in heat accumulation. Applied methods of laser writing allowed the overall processing rate to increase by up to 2.4 times. Surface morphology was investigated by a scanning electron microscope. Energy-dispersive X-ray spectroscopy was used to investigate the modification of atomic concentration on the surface after laser treatment. Experiments did not show a correlation between surface morphology and electroless plating on laser-treated areas. However, significant variation in the composition of the material was revealed depending on the surface activity for electroless plating.

Post-etch treatment enabled electroless copper metallization of porous dielectric

2013 ◽  
Vol 1559 ◽  
Author(s):  
Yezdi N. Dordi
Keyword(s):  
Electroless Plating ◽  
Dielectric Surface ◽  
Copper Deposition ◽  
Copper Metallization ◽  
Plasma Etch ◽  
Thin Carbon ◽  
Electroless Copper ◽  
Pet Film ◽  
Carbon Based

ABSTRACTThis paper describes an alternate two-step metallization scheme for porous dielectrics. The patterned dielectric surface is first treated in a plasma etch chamber where the dielectric surface is coated with a very thin carbon-based film. This is followed by electroless copper deposition. The plasma post-etch treatment (PET) film seals the pores of the dielectric, minimizes dielectric damage, and functionalizes the dielectric to enable electroless plating.

Laser-enhanced electroless plating of silver seed layers for selective electroless copper deposition

2008 ◽  
Vol 20 (4) ◽  
pp. 218-223 ◽  
Author(s):  
Nicholas S. Dellas ◽  
Kenneth Meinert ◽  
Suzanne E. Mohney
Keyword(s):  
Electroless Plating ◽  
Copper Deposition ◽  
Electroless Copper ◽  
Seed Layers

The Effect of Electroless Plating Time on the Coating Performance of SiC Powders

2014 ◽  
Vol 971-973 ◽  
pp. 204-207
Author(s):  
Ming Hu ◽  
Yun Long Zhang ◽  
Jing Gao ◽  
Lin Shan ◽  
Li Li Tang
Keyword(s):  
Surface Morphology ◽  
Electroless Plating ◽  
Copper Matrix ◽  
Interface Bonding ◽  
Hot Press ◽  
Electroless Copper Plating ◽  
Coating Performance ◽  
Bonding Condition ◽  
Electroless Copper ◽  
Hot Press Sintering

In order to improve the interface bonding condition between Cu and SiC powders, electroless copper plating was applied to deposit a Cu coating on SiC powder. The surface morphology of the SiC powder with uncoated and coated copper were investigated. The results showed that the appropriate electroless plating time was necessary for the SiCp with uniform copper-coating. The SiCp/Cu composites were fabricated by hot-press sintering technology. The coated-copper SiCp were uniformly distributed in copper matrix. Key words: Electroless plating, Cu/SiCp composites, Metal coating

scholarly journals Syntheses and Step-by-Step Morphological Analysis of Nano-Copper-Decorated Carbon Long Fibers for Aerospace Structural Applications

Crystals ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 1090
Author(s):  
Walid M. Daoush ◽  
Turki S. Albogmy ◽  
Moath A. Khamis ◽  
Fawad Inam
Keyword(s):  
Carbon Fiber ◽  
Surface Morphology ◽  
Carbon Fibers ◽  
Electroless Deposition ◽  
Copper Coating ◽  
Copper Deposition ◽  
Coating Process ◽  
Copper Sulphate Solution ◽  
Structural Applications ◽  
Electroless Copper

Carbon long fiber/copper composites were prepared using electroless and electroplating methods with copper metal for potential aerospace applications. Carbon fibers were heat-treated at 450 °C followed by acid treatment before the metallization processes. Three different methods of metallization processes were applied: electroless silver deposition, electroless copper deposition and electroplating copper deposition. The metallized carbon fibers were subjected to copper deposition via two different routes. The first method was the electroless deposition technique in an alkaline tartrate bath using formaldehyde as a reducing agent of the copper ions from the copper sulphate solution. The second method was conducted by copper electroplating on the chemically treated carbon fibers. The produced carbon fiber/copper composites were extensively investigated by Field-Emission Scanning Electron Microscopy (FE-SEM) supported with an Energy Dispersive X-Ray Analysis (EDAX) unit to analyze the size, surface morphology, and chemical composition of the produced carbon long fiber/copper composites. The results show that the carbon fiber/copper composites prepared using the electroplating method had a coated type surface morphology with good adhesion between the copper coated layer and the surface of the carbon fibers. However, the carbon fiber/copper composites prepared using the electroless deposition had a decorated type morphology. Moreover, it was observed that the metallized carbon fibers using the silver method enhanced the electroless copper coating process with respect to the electroless copper coating process without silver metallization. The electrical conductivity of the carbon fiber/copper composites was improved by metallization of the carbon fibers using silver, as well as by the electrodeposition method.

The Effect of the Microstructure of Diffusion Barriers on the Palladium Activation for Electroless Copper Deposition

2002 ◽  
Vol 716 ◽  
Author(s):  
Seok Woo Hong ◽  
Yong Sun Lee ◽  
Ki-Chul Park ◽  
Jong-Wan Park
Keyword(s):  
Electron Microscopy ◽  
Diffusion Barriers ◽  
Copper Deposition ◽  
X Ray Diffraction ◽  
Plan View ◽  
X Ray ◽  
Transmission Electron ◽  
Electroless Copper ◽  
Sheet Resistance Measurement ◽  
Scanning Electron

AbstractThe effect of microstructure of dc magnetron sputtered TiN and TaN diffusion barriers on the palladium activation for autocatalytic electroless copper deposition has been investigated by using X-ray diffraction, sheet resistance measurement, field emission scanning electron microscopy (FE-SEM) and plan view transmission electron microscopy (TEM). The density of palladium nuclei on TaN diffusion barrier increases as the grain size of TaN films decreases, which was caused by increasing nitrogen content in TaN films. Plan view TEM results of TiN and TaN diffusiton barriers showed that palladium nuclei formed mainly on the grain boundaries of the diffusion barriers.

scholarly journals Surface Texturing of Polyethylene Terephthalate Induced by Excimer Laser in Silver Nanoparticle Colloids

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3263
Author(s):  
Jakub Siegel ◽  
Tatiana Savenkova ◽  
Jana Pryjmaková ◽  
Petr Slepička ◽  
Miroslav Šlouf ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Polyethylene Terephthalate ◽  
Excimer Laser ◽  
Silver Nanoparticle ◽  
Polymer Surface ◽  
Surface Texturing ◽  
Nanoparticle Distribution ◽  
Pulse Excimer Laser ◽  
Variable Surface ◽  
Variable Morphology

We report on a novel technique of surface texturing of polyethylene terephthalate (PET) foil in the presence of silver nanoparticles (AgNPs). This approach provides a variable surface morphology of PET evenly decorated with AgNPs. Surface texturing occurred in silver nanoparticle colloids of different concentrations under the action of pulse excimer laser. Surface morphology of PET immobilized with AgNPs was observed by AFM and FEGSEM. Atomic concentration of silver was determined by XPS. A presented concentration-controlled procedure of surface texturing of PET in the presence of silver colloids leads to a highly nanoparticle-enriched polymer surface with a variable morphology and uniform nanoparticle distribution.

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