Fast laser writing technique for laser assisted selective electroless copper deposition on dielectrics surface for in-mold electronics applications

2021 ◽  
Author(s):  
Karolis Ratautas ◽  
Vytautas Vosylius ◽  
Ina Stankevičienė ◽  
Aldona Jagminienė ◽  
Eugenijus Norkus ◽  
...  
Keyword(s):  
Copper Deposition ◽  
Laser Writing ◽  
Electroless Copper

scholarly journals Laser-Induced Selective Electroless Plating on PC/ABS Polymer: Minimisation of Thermal Effects for Supreme Processing Speed

Polymers ◽  
2020 ◽  
Vol 12 (10) ◽  
pp. 2427
Author(s):  
Karolis Ratautas ◽  
Vytautas Vosylius ◽  
Aldona Jagminienė ◽  
Ina Stankevičienė ◽  
Eugenijus Norkus ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Electroless Plating ◽  
Thermal Effects ◽  
Chemical Activation ◽  
Polymer Surface ◽  
Copper Deposition ◽  
Limiting Factor ◽  
Surface Activation ◽  
Laser Writing ◽  
Electroless Copper

The selective surface activation induced by laser (SSAIL) for electroless copper deposition on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend is one of the promising techniques of electric circuit formation on free-shape dielectric surfaces, which broadens capabilities of 3D microscopic integrated devices (3D-MIDs). The process consists of laser excitation, chemical activation of laser-excited areas by dipping in a liquid and electroless copper deposition of the laser-treated areas. The limiting factor in increasing throughput of the technology is a laser activation step. Laser writing is performed by modern galvanometric scanners which reach the scanning speed of several meters per second. However, adverse thermal effects on PC/ABS polymer surface abridge the high-speed laser writing. In this work, an investigation was conducted on how these thermal effects limit surface activation for selective metal deposition from the view of physics and chemistry. An advanced laser beam scanning technique of interlacing with precise accuracy and the pulse-on-demand technique was applied to overcome mentioned problems for fast laser writing. Initially, the modelling of transient heat conduction was performed. The results revealed a significant reduction in heat accumulation. Applied methods of laser writing allowed the overall processing rate to increase by up to 2.4 times. Surface morphology was investigated by a scanning electron microscope. Energy-dispersive X-ray spectroscopy was used to investigate the modification of atomic concentration on the surface after laser treatment. Experiments did not show a correlation between surface morphology and electroless plating on laser-treated areas. However, significant variation in the composition of the material was revealed depending on the surface activity for electroless plating.

The Effect of the Microstructure of Diffusion Barriers on the Palladium Activation for Electroless Copper Deposition

2002 ◽  
Vol 716 ◽  
Author(s):  
Seok Woo Hong ◽  
Yong Sun Lee ◽  
Ki-Chul Park ◽  
Jong-Wan Park
Keyword(s):  
Electron Microscopy ◽  
Diffusion Barriers ◽  
Copper Deposition ◽  
X Ray Diffraction ◽  
Plan View ◽  
X Ray ◽  
Transmission Electron ◽  
Electroless Copper ◽  
Sheet Resistance Measurement ◽  
Scanning Electron

AbstractThe effect of microstructure of dc magnetron sputtered TiN and TaN diffusion barriers on the palladium activation for autocatalytic electroless copper deposition has been investigated by using X-ray diffraction, sheet resistance measurement, field emission scanning electron microscopy (FE-SEM) and plan view transmission electron microscopy (TEM). The density of palladium nuclei on TaN diffusion barrier increases as the grain size of TaN films decreases, which was caused by increasing nitrogen content in TaN films. Plan view TEM results of TiN and TaN diffusiton barriers showed that palladium nuclei formed mainly on the grain boundaries of the diffusion barriers.

Selective Electroless Copper Deposition within Block Copolymer Microdomains

2000 ◽  
Vol 12 (6) ◽  
pp. 1628-1633 ◽  
Author(s):  
Yot Boontongkong ◽  
Robert E. Cohen ◽  
Michael F. Rubner
Keyword(s):  
Block Copolymer ◽  
Copper Deposition ◽  
Electroless Copper

New plating bath for electroless copper deposition on sputtered barrier layers

2000 ◽  
Vol 50 (1-4) ◽  
pp. 441-447 ◽  
Author(s):  
Yuri Lantasov ◽  
Roger Palmans ◽  
Karen Maex
Keyword(s):  
Copper Deposition ◽  
Plating Bath ◽  
Barrier Layers ◽  
Electroless Copper

scholarly journals Electroless copper deposition on a Pt polyfaceted single crystal

1990 ◽  
Vol 281 (1-2) ◽  
pp. 273-277
Author(s):  
J.J. Podestá ◽  
J.C. Canullo ◽  
A.J. Arvia ◽  
A.G. Alvarez
Keyword(s):  
Single Crystal ◽  
Copper Deposition ◽  
Electroless Copper
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