scholarly journals Syntheses and Step-by-Step Morphological Analysis of Nano-Copper-Decorated Carbon Long Fibers for Aerospace Structural Applications

Crystals ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 1090
Author(s):  
Walid M. Daoush ◽  
Turki S. Albogmy ◽  
Moath A. Khamis ◽  
Fawad Inam
Keyword(s):  
Carbon Fiber ◽  
Surface Morphology ◽  
Carbon Fibers ◽  
Electroless Deposition ◽  
Copper Coating ◽  
Copper Deposition ◽  
Coating Process ◽  
Copper Sulphate Solution ◽  
Structural Applications ◽  
Electroless Copper

Carbon long fiber/copper composites were prepared using electroless and electroplating methods with copper metal for potential aerospace applications. Carbon fibers were heat-treated at 450 °C followed by acid treatment before the metallization processes. Three different methods of metallization processes were applied: electroless silver deposition, electroless copper deposition and electroplating copper deposition. The metallized carbon fibers were subjected to copper deposition via two different routes. The first method was the electroless deposition technique in an alkaline tartrate bath using formaldehyde as a reducing agent of the copper ions from the copper sulphate solution. The second method was conducted by copper electroplating on the chemically treated carbon fibers. The produced carbon fiber/copper composites were extensively investigated by Field-Emission Scanning Electron Microscopy (FE-SEM) supported with an Energy Dispersive X-Ray Analysis (EDAX) unit to analyze the size, surface morphology, and chemical composition of the produced carbon long fiber/copper composites. The results show that the carbon fiber/copper composites prepared using the electroplating method had a coated type surface morphology with good adhesion between the copper coated layer and the surface of the carbon fibers. However, the carbon fiber/copper composites prepared using the electroless deposition had a decorated type morphology. Moreover, it was observed that the metallized carbon fibers using the silver method enhanced the electroless copper coating process with respect to the electroless copper coating process without silver metallization. The electrical conductivity of the carbon fiber/copper composites was improved by metallization of the carbon fibers using silver, as well as by the electrodeposition method.

Electroless copper deposition on a pitch-based activated carbon fiber and an application for NO removal

2008 ◽  
Vol 202 (15) ◽  
pp. 3571-3578 ◽  
Author(s):  
Jeong Hoon Byeon ◽  
Hee Seung Yoon ◽  
Ki Young Yoon ◽  
Seung Kon Ryu ◽  
Jungho Hwang
Keyword(s):  
Activated Carbon ◽  
Carbon Fiber ◽  
Activated Carbon Fiber ◽  
Copper Deposition ◽  
No Removal ◽  
Electroless Copper

scholarly journals Laser-Induced Selective Electroless Plating on PC/ABS Polymer: Minimisation of Thermal Effects for Supreme Processing Speed

Polymers ◽  
2020 ◽  
Vol 12 (10) ◽  
pp. 2427
Author(s):  
Karolis Ratautas ◽  
Vytautas Vosylius ◽  
Aldona Jagminienė ◽  
Ina Stankevičienė ◽  
Eugenijus Norkus ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Electroless Plating ◽  
Thermal Effects ◽  
Chemical Activation ◽  
Polymer Surface ◽  
Copper Deposition ◽  
Limiting Factor ◽  
Surface Activation ◽  
Laser Writing ◽  
Electroless Copper

The selective surface activation induced by laser (SSAIL) for electroless copper deposition on Polycarbonate/Acrylonitrile Butadiene Styrene (PC/ABS) blend is one of the promising techniques of electric circuit formation on free-shape dielectric surfaces, which broadens capabilities of 3D microscopic integrated devices (3D-MIDs). The process consists of laser excitation, chemical activation of laser-excited areas by dipping in a liquid and electroless copper deposition of the laser-treated areas. The limiting factor in increasing throughput of the technology is a laser activation step. Laser writing is performed by modern galvanometric scanners which reach the scanning speed of several meters per second. However, adverse thermal effects on PC/ABS polymer surface abridge the high-speed laser writing. In this work, an investigation was conducted on how these thermal effects limit surface activation for selective metal deposition from the view of physics and chemistry. An advanced laser beam scanning technique of interlacing with precise accuracy and the pulse-on-demand technique was applied to overcome mentioned problems for fast laser writing. Initially, the modelling of transient heat conduction was performed. The results revealed a significant reduction in heat accumulation. Applied methods of laser writing allowed the overall processing rate to increase by up to 2.4 times. Surface morphology was investigated by a scanning electron microscope. Energy-dispersive X-ray spectroscopy was used to investigate the modification of atomic concentration on the surface after laser treatment. Experiments did not show a correlation between surface morphology and electroless plating on laser-treated areas. However, significant variation in the composition of the material was revealed depending on the surface activity for electroless plating.

Influence of Electroless Copper Deposition on the Electrochemical Performance of Si/MCMB

2011 ◽  
Vol 306-307 ◽  
pp. 336-339
Author(s):  
Mei Yan ◽  
Wei Qiang Gao ◽  
Rui Sheng Xue ◽  
Jing Hua Yu
Keyword(s):  
Heat Treatment ◽  
Electrochemical Performance ◽  
Heat Treatment Temperature ◽  
Electroless Deposition ◽  
Treatment Temperature ◽  
Copper Deposition ◽  
Mesophase Pitch ◽  
Deposition Condition ◽  
Cu Alloys ◽  
Electroless Copper

Si-Cu alloys have been prepared by electroless depositions with different process. Si-Cu/MCMB materials have been prepared by carbonization of the mixture of Si-Cu, MCMB and mesophase pitch. The influences of electroless deposition condition and heat-treatment temperature on the anodic performance of Cu-Si/MCMB have been studied. Compared with Si/MCMB, Si-Cu/MCMB has more stable cyclical performance. Furthermore, the Si-Cu/MCMB sample produced by cleaning and then electroless deposition on Si shows the better anodic performance than the Si-Cu/MCMB sample produced by direct electroless deposition on Si, because the former sample has more Cu contents than the latter sample.

Microstructural changes of Aluminum Nitride after laser irradiation and electroless copper deposition

1994 ◽  
Vol 52 ◽  
pp. 636-637
Author(s):  
S. Cao ◽  
A. J. Pedraza ◽  
L. F. Allard
Keyword(s):  
Aluminum Nitride ◽  
Laser Irradiation ◽  
Electroless Deposition ◽  
Thermal Evaporation ◽  
Surface Region ◽  
Near Surface ◽  
Laser Patterning ◽  
Electroless Copper ◽  
Excimer Laser Irradiation ◽  
Laser Effect

Excimer-laser irradiation strongly modifies the near-surface region of aluminum nitride (AIN) substrates. The surface acquires a distinctive metallic appearance and the electrical resistivity of the near-surface region drastically decreases after laser irradiation. These results indicate that Al forms at the surface as a result of the decomposition of the Al (which has been confirmed by XPS). A computer model that incorporates two opposing phenomena, decomposition of the AIN that leaves a metallic Al film on the surface, and thermal evaporation of the Al, demonstrated that saturation of film thickness and, hence, of electrical resistance is reached when the rate of Al evaporation equals the rate of AIN decomposition. In an electroless copper bath, Cu is only deposited in laser-irradiated areas. This laser effect has been designated laser activation for electroless deposition. Laser activation eliminates the need of seeding for nucleating the initial layer of electroless Cu. Thus, AIN metallization can be achieved by laser patterning followed by electroless deposition.

The Effect of the Microstructure of Diffusion Barriers on the Palladium Activation for Electroless Copper Deposition

2002 ◽  
Vol 716 ◽  
Author(s):  
Seok Woo Hong ◽  
Yong Sun Lee ◽  
Ki-Chul Park ◽  
Jong-Wan Park
Keyword(s):  
Electron Microscopy ◽  
Diffusion Barriers ◽  
Copper Deposition ◽  
X Ray Diffraction ◽  
Plan View ◽  
X Ray ◽  
Transmission Electron ◽  
Electroless Copper ◽  
Sheet Resistance Measurement ◽  
Scanning Electron

AbstractThe effect of microstructure of dc magnetron sputtered TiN and TaN diffusion barriers on the palladium activation for autocatalytic electroless copper deposition has been investigated by using X-ray diffraction, sheet resistance measurement, field emission scanning electron microscopy (FE-SEM) and plan view transmission electron microscopy (TEM). The density of palladium nuclei on TaN diffusion barrier increases as the grain size of TaN films decreases, which was caused by increasing nitrogen content in TaN films. Plan view TEM results of TiN and TaN diffusiton barriers showed that palladium nuclei formed mainly on the grain boundaries of the diffusion barriers.

Cytocompatibility of Carbon Nanofiber Materials for Neural Applications

2003 ◽  
Vol 774 ◽  
Author(s):  
Janice L. McKenzie ◽  
Michael C. Waid ◽  
Riyi Shi ◽  
Thomas J. Webster
Keyword(s):  
Carbon Fiber ◽  
Surface Energy ◽  
Carbon Nanofibers ◽  
Carbon Fibers ◽  
Carbon Nanofiber ◽  
Fiber Composite ◽  
Scar Tissue ◽  
Pc 12 Cells ◽  
Low Surface Energy ◽  
Poly Carbonate

AbstractSince the cytocompatibility of carbon nanofibers with respect to neural applications remains largely uninvestigated, the objective of the present in vitro study was to determine cytocompatibility properties of formulations containing carbon nanofibers. Carbon fiber substrates were prepared from four different types of carbon fibers, two with nanoscale diameters (nanophase, or less than or equal to 100 nm) and two with conventional diameters (or greater than 200 nm). Within these two categories, both a high and a low surface energy fiber were investigated and tested. Astrocytes (glial scar tissue-forming cells) and pheochromocytoma cells (PC-12; neuronal-like cells) were seeded separately onto the substrates. Results provided the first evidence that astrocytes preferentially adhered on the carbon fiber that had the largest diameter and the lowest surface energy. PC-12 cells exhibited the most neurites on the carbon fiber with nanodimensions and low surface energy. These results may indicate that PC-12 cells prefer nanoscale carbon fibers while astrocytes prefer conventional scale fibers. A composite was formed from poly-carbonate urethane and the 60 nm carbon fiber. Composite substrates were thus formed using different weight percentages of this fiber in the polymer matrix. Increased astrocyte adherence and PC-12 neurite density corresponded to decreasing amounts of the carbon nanofibers in the poly-carbonate urethane matrices. Controlling carbon fiber diameter may be an approach for increasing implant contact with neurons and decreasing scar tissue formation.

scholarly journals Undergraduate Research Program to Recycle Composite Waste

2021 ◽  
Vol 11 (7) ◽  
pp. 354
Author(s):  
Waleed Ahmed ◽  
Essam Zaneldin ◽  
Amged Al Hassan
Keyword(s):  
Mechanical Properties ◽  
Compressive Strength ◽  
Carbon Fiber ◽  
Undergraduate Students ◽  
Research Program ◽  
Modulus Of Elasticity ◽  
Undergraduate Research ◽  
Undergraduate Research Program ◽  
Structural Applications ◽  
Cfrp Composite

With the rapid growth in the manufacturing industry and increased urbanization, higher amounts of composite material waste are being produced, causing severe threats to the environment. These environmental concerns, coupled with the fact that undergraduate students typically have minimal experience in research, have initiated the need at the UAE University to promote research among undergraduate students, leading to the development of a summer undergraduate research program. In this study, a recycling methodology is presented to test lab-fabricated Carbon-Fiber-Reinforced Polymer (CFRP) for potential applications in industrial composite waste. The work was conducted by two groups of undergraduate students at the UAE University. The methodology involved the chemical dissolution of the composite waste, followed by compression molding and adequate heat treatment for rapid curing of CFRP. Subsequently, the CFRP samples were divided into three groups based on their geometrical distinctions. The mechanical properties (i.e., modulus of elasticity and compressive strength) were determined through material testing, and the results were then compared with steel for prompt reference. The results revealed that the values of mechanical properties range from 2 to 4.3 GPa for the modulus of elasticity and from 203.7 to 301.5 MPa for the compressive strength. These values are considered competitive and optimal, and as such, carbon fiber waste can be used as an alternate material for various structural applications. The inconsistencies in the values are due to discrepancies in the procedure as a result of the lack of specialized equipment for handling CFRP waste material. The study concluded that the properties of CFRP composite prepreg scrap tend to be reusable instead of disposable. Despite the meager experimental discrepancies, test values and mechanical properties indicate that CFRP composite can be successfully used as a material for nonstructural applications.

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