Performance of a Thermoelectric Cooler Box Powered Using Solar Panels with a Mini Pin Fin Heat Removal Unit

Abstract This experimental study focuses on the enhancement of the heat removal process by modifying the geometry of pin fin heat sinks, while maintaining the same effective heat transfer area. The pins are cut at an angle to reduce the blockage of air flow across the surface. To perform this study, a small scale wind tunnel facility has been designed specifically for testing high power dissipation processors and other ULSI components. The facility is fully automated and controlled by an HP3852A Data Acquisition System interfaced with a 486 based PC computer. The average surface temperature, Reynolds number, Nusselt number and other relevant heat transfer parameters were reduced from the data collected. Results from the study show that a heat sink with an angled trailing edge produces the greatest enhancement of heat removal. The mechanism for the improved heat transfer is the larger temperature gradient across the surface, which is obtained by lowering the minimum temperature on the surface.

Download Full-text

Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767188 ◽

2011 ◽

Cited By ~ 4

Author(s):

T. Brunschwiler ◽

S. Paredes ◽

U. Drechsler ◽

B. Michel

Keyword(s):

Angle Of Attack ◽

Heat Removal ◽

Pin Fin ◽

Pin Fin Arrays

Download Full-text

Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

Journal of Electronic Packaging ◽

10.1115/1.4049814 ◽

2021 ◽

Vol 143 (3) ◽

Author(s):

Yuanchen Hu ◽

Md Obaidul Hossen ◽

Zhimin Wan ◽

Muhannad S. Bakir ◽

Yogendra Joshi

Keyword(s):

Heat Transfer ◽

Integrated Circuit ◽

High Performance ◽

Heat Dissipation ◽

Three Dimensional ◽

Heat Removal ◽

Power Estimation ◽

Leakage Power ◽

Pin Fin ◽

Pin Fins

Abstract Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation bottleneck due to the increased volumetric heat generation and reduced surface area. Previous work demonstrated that pin-fin enhanced microgap cooling, which provides fluidic cooling between layers could potentially address the heat dissipation challenge. In this paper, a compact multitier pin-fin single-phase liquid cooling model has been established for both steady-state and transient conditions. The model considers heat transfer between layers via pin-fins, as well as the convective heat removal in each tier. Spatially and temporally varying heat flux distribution, or power map, in each tier can be modeled. The cooling fluid can have different pumping power and directions for each tier. The model predictions are compared with detailed simulations using computational fluid dynamics/heat transfer (CFD/HT). The compact model is found to run 120–600 times faster than the CFD/HT model, while providing acceptable accuracy. Actual leakage power estimation is performed in this codesign model, which is an important contribution for codesign of 3D-SICs. For the simulated cases, temperatures could decrease 3% when leakage power estimation is adopted. This model could be used as electrical-thermal codesign tool to optimize thermal management and reduce leakage power.

Download Full-text

Parameter Optimization of a Micro Heat Sink With Circular Pin-Fins

ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B ◽

10.1115/fedsm-icnmm2010-30473 ◽

2010 ◽

Cited By ~ 3

Author(s):

Mustafa Koz ◽

Ali Kosar

Keyword(s):

Experimental Data ◽

Heat Sink ◽

Stokes Equations ◽

Numerical Models ◽

Symmetry Plane ◽

Heat Removal ◽

Heat Sinks ◽

Performance Criteria ◽

Pin Fin ◽

Pin Fins

Micro heat sinks have a broad applicability in many fields such as aerospace applications, micro turbine cooling, micro reactors electronics cooling and micro biological applications. Among different types of micro heat sinks, those with micro pin-fins are becoming popular due to their enhanced heat removal performance. However, relevant experimental data is still scarce and few optimization studies are present in the literature. In order to effectively optimize their performance an extensive parametric study is necessary and should be based on a realistic model. Moreover, micro pin fin heat sinks should be optimized according to appropriate performance criteria depending on the application. The objective of this paper is to fill the research gap in micro pin fin heat sink optimization based on realistic configurations. In this paper, the parameters for micro pin optimization are the pin-fin height over diameter ratio (0.5<H/D<5) and the longitudinal and transverse pitch ratios (1.5<(SL, ST)/D<5), while Reynolds number and heat flux provided from the base of the micro heat sink are in the range of (1<Re<100) and (20<q(W/cm2)<500) respectively. In this research micro pin fin heat sinks are three dimensionally modeled on a one-to-one scale with the use of commercially available software COMSOL Multiphasics 3.5a. Full Navier-Stokes equations subjected to continuity and energy equations are solved for stationary conditions. To have increased computational efficiency, half of the heat sink is modeled with the use of a symmetry plane. In order to validate the use of numerical models parametric values from previous experimental data available in the literature are exactly taken and simulated. The numerical and experimental results show a good agreement. After this validation optimization study is performed using the three dimensional numerical models.

Download Full-text

Experimental Investigation of Liquid Cooling Through Shallow Copperclad Cavities With Etched Pin-Fin Arrays

Volume 3: Fluid Machinery; Erosion, Slurry, Sedimentation; Experimental, Multiscale, and Numerical Methods for Multiphase Flows; Gas-Liquid, Gas-Solid, and Liquid-Solid Flows; Performance of Multiphase Flow Systems; Micro/Nano-Fluidics ◽

10.1115/fedsm2018-83265 ◽

2018 ◽

Author(s):

Yin Lam ◽

Nicole Okamoto ◽

Younes Shabany ◽

Sang-Joon John Lee

Keyword(s):

Pressure Drop ◽

Thermal Resistance ◽

Surface Area ◽

Flow Rate ◽

Heat Sink ◽

Heat Removal ◽

Heat Sinks ◽

Liquid Cooling ◽

Pin Fin ◽

Pin Fin Arrays

Heat removal is an increasing engineering challenge for higher-density packaging of circuit components. Microchannel heat sinks with liquid cooling have been investigated to take advantage of high surface-to-volume ratio and higher heat capacity of liquids relative to gases. This study experimentally investigated heat removal by liquid cooling through shallow copperclad cavities with staggered pin-fin arrays. Cavities with pin-fins were fabricated by chemical etching of a copperclad layer (nominally 105 μm thick) on a printed-circuit substrate (FR-4). The overall etched cavity was 30 mm wide, 40 mm long, and 0.1 mm deep. The pins were 1.1 mm in diameter and were distributed in a staggered arrangement. The cavity was sealed with a second copperclad substrate using an elastomer gasket. This assembly was then connected to a syringe pump delivery system. Deionized water was used as the working fluid, with volumetric flow rate up to 1.5 mL/min. The heat sink was subjected to a uniform heat flux of 5 W on the underside. Performance of the heat sink was evaluated in terms of pressure drop and the convection thermal resistance. Pressure drop across the heat sinks was less than 10 kPa, dominated by wall surface area rather than the small surface area contributed by cylindrical pins. At low flow rate, caloric thermal resistance dominated the overall thermal resistance of the heat sink. When compared to a microchannel without pins, the pin-fin microchannel reduced convective thermal resistance of the heat sink by approximately a factor of 4.

Download Full-text

Simulation and experimental study on performance analysis of solar photovoltaic integrated thermoelectric cooler using MATLAB Simulink

Thermal Science ◽

10.2298/tsci201211301n ◽

2021 ◽

pp. 301-301

Author(s):

Lalith Nadimuthu ◽

Divya Selvaraj ◽

Kirubakaran Victor

Keyword(s):

Cooling System ◽

Thermoelectric Module ◽

Heat Removal ◽

Coefficient Of Performance ◽

Photovoltaic Module ◽

Air Cooling ◽

Thermoelectric Cooler ◽

Solar Photovoltaic ◽

Matlab Simulink ◽

Effective Heat

The present study investigates the performance of solar photovoltaic integrated thermoelectric cooler (TEC) using MATLAB Simulink. The enhancement of efficiency has been achieved using an effective heat removal mechanism from the hot side heat sink. Since the hot side temperature is a crucial parameter. The intrinsic material properties like Seebeck coefficient (?), Thermal Conductance (K) and Electrical resistance (R) of the thermoelectric module are carefully estimated using analytical method and reported. The MATLAB Simulink Peltier module is developed based on the estimated intrinsic properties. The effect of system Voltage (V) and Current (A) on the thermal parameters like cooling capacity (QC) and Coefficient of performance (COP) has been investigated. The simulation study is validated by conducting a series of experimental analysis. The experimental model is equipped with a 100 Wp polycrystalline solar photovoltaic module to integrate and power the 12V/5 A of the 60-Watt thermoelectric cooler. Moreover, the results reveal that there is a significant effect of ambient and hot side temperature on the thermoelectric cooler performance. The fin-type conductive mode of heat transfer mechanism is adopted along with the convective forced air-cooling system to achieve effective heat removal from the hot side. The infrared thermographic investigation is carried out for ascertaining effective heat removal.

Download Full-text

ANALISA PENGGUNAAN TRANSISTOR 2N3055 DAN TEC (THERMOELECTRIC COOLER) SEBAGAI BAHAN ALTERNATIF PANEL SEL SURYA (SOLAR CELL)

Jurnal Energi dan Teknologi Manufaktur (JETM) ◽

10.33795/jetm.v4i01.74 ◽

2021 ◽

Vol 4 (01) ◽

pp. 1-6

Author(s):

Muhammad Agus Sahbana ◽

Akhmad Farid

Keyword(s):

Power Plants ◽

Electrical Energy ◽

Appropriate Technology ◽

Solar Panel ◽

Thermoelectric Cooler ◽

Solar Panels ◽

Energy Needs ◽

Alternative Power ◽

Oil Gas

The renewable energy has a very important role in meeting energy needs. This is because the use of fuel for conventional power plants in the long term will deplete the dwindling resources of oil, gas and coal and can also cause environmental pollution. Solar panels based on 2N3055 transistors and Thermoelectric Cooler (TEC) are the basic materials for designing alternative power plants. In the manufacturing process, this solar panel utilizes electronic components that are capable of generating electrical energy (emf), so that it can be used as an appropriate technology to produce a solar panel that utilizes solar energy in the form of heat and solar radiation. The use of transistors 2N3055 and TEC proved to be more efficient in generating electrical energy, there was no significant decrease in voltage and current even though the weather was suddenly cloudy. The average voltage and current generated in this solar panel are 24.58 VDC and 2.72 Ampere DC.

Download Full-text

Co-Placement for Pin-Fin Based Micro-Fluidically Cooled 3D ICs

Volume 1: Thermal Management ◽

10.1115/ipack2015-48354 ◽

2015 ◽

Cited By ~ 2

Author(s):

Zhiyuan Yang ◽

Ankur Srivastava

Keyword(s):

High Performance ◽

Flow Direction ◽

Heat Removal ◽

Cooling Capacity ◽

Wire Length ◽

Pin Fin ◽

3D Ics ◽

The Wire ◽

Silicon Vias ◽

The Cost

3D ICs with through-silicon vias (TSVs) can achieve high performance while exacerbating the problem of heat removal. This necessitates the use of more aggressive cooling solutions such as micropin-fin based fluidic cooling. However, micropin-fin cooling comes with overheads such as non-uniform cooling capacity along the flow direction and restriction on the position of TSVs to where pins exist. 3D gate and TSV placement approaches un-aware of these drawbacks may lead to detrimental effects and even infeasible chip design. In this paper, we present a hierarchical partitioning based algorithm for co-placing gates and TSVs to co-optimize the wire-length and in-layer temperature uniformity, given the logical level netlist and layer assignment of gates. Compared to the wire-length driven gate placement followed by a TSV legalization stage, our approach can achieve up to 75% and 25% reduction of in-layer temperature variation and peak temperature, respectively, with the cost of 13% increase in wire-length.

Download Full-text

Thermo-Hydraulic Performance of Square Micro Pin Fins under Forced Convection

International Journal of Heat and Technology ◽

10.18280/ijht.390118 ◽

2021 ◽

Vol 39 (1) ◽

pp. 170-178

Author(s):

Niranjan Ramendra Singh ◽

Singh Onkar ◽

Janakarajan Ramkumar

Keyword(s):

Reynolds Number ◽

Forced Convection ◽

Heat Sink ◽

Turbulent Transport ◽

Heat Removal ◽

Surface Flow ◽

Fin Efficiency ◽

Pin Fin ◽

Pin Fins ◽

Micro Pin Fins

Thermal management of the new generation’s high performance electronic and mechanical devices is becoming important due to their miniaturization. Conventionally, the plate fin arrangement is widely used for removal of dissipated heat but, their effectiveness is not up to mark. Among different options, the most attractive and efficient alternative for overcoming this problem is micro pin fin heat sink. This paper presents the experimental investigation of square micro-pin fins heat sink for identifying the most suitable pin fin geometry for heat removal applications under forced convection. Twenty five square micro pin fin heat sinks were tested for three different heat load and Reynolds number. The results show that for large fin height lower thermal resistance was observed at the cost of large pressure drop. The dimensionless heat transfer coefficient increases with fin height and Reynolds number while it decreases with increasing fin spacing. The improvement in micro pin fin efficiency were observed by about 2 to 9% owing to presence of fins on the impingement surface, flow mixing, disruption of the boundary layers, and augmentation of turbulent transport.

Download Full-text