2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium
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9781612847405

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A world of opportunities

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767169 ◽

2011 ◽

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Optimal heat transfer for liquid cooling with minimal coolant volume

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767176 ◽

2011 ◽

Author(s):

Steve Harrington

Keyword(s):

Heat Transfer ◽

Liquid Cooling ◽

Optimal Heat

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Silver diamond composite as a new packaging solution: A thermo-mechanical stability study

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767217 ◽

2011 ◽

Cited By ~ 2

Author(s):

M. Faqir ◽

T. Batten ◽

T. Mrotzek ◽

S. Knippscheer ◽

M. Massiot ◽

...

Keyword(s):

Mechanical Stability ◽

Stability Study ◽

Diamond Composite

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A quick PCB thermal calculator to aid system design of exposed pad packages

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767179 ◽

2011 ◽

Cited By ~ 1

Author(s):

Siva P. Gurrum ◽

Matthew D. Romig ◽

Sandra J. Horton ◽

Darvin R. Edwards

Keyword(s):

System Design

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Issues of thermal testing of AC LEDs

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767214 ◽

2011 ◽

Cited By ~ 6

Author(s):

Andras Poppe ◽

Bernie Siegal ◽

Gabor Farkas

Keyword(s):

Thermal Testing

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Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767188 ◽

2011 ◽

Cited By ~ 4

Author(s):

T. Brunschwiler ◽

S. Paredes ◽

U. Drechsler ◽

B. Michel

Keyword(s):

Angle Of Attack ◽

Heat Removal ◽

Pin Fin ◽

Pin Fin Arrays

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Copyright page

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767162 ◽

2011 ◽

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Data center design using improved CFD modeling and cost reduction analysis

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767185 ◽

2011 ◽

Cited By ~ 1

Author(s):

Travis Mikjaniec ◽

Andy Manning ◽

Derrick Small

Keyword(s):

Data Center ◽

Cost Reduction ◽

Cfd Modeling

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Development of an advanced thermal interface material for high power devices

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767220 ◽

2011 ◽

Cited By ~ 1

Author(s):

My Nguyen ◽

Jason Brandi

Keyword(s):

High Power ◽

Thermal Interface Material ◽

Power Devices ◽

Thermal Interface

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Transient dual interface measurement — A new JEDEC standard for the measurement of the junction-to-case thermal resistance

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium ◽

10.1109/stherm.2011.5767204 ◽

2011 ◽

Cited By ~ 17

Author(s):

Dirk Schweitzer ◽

Heinz Pape ◽

Liu Chen ◽

Rudolf Kutscherauer ◽

Martin Walder

Keyword(s):

Thermal Resistance ◽

Dual Interface

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2011 27th Annual IEEE Semiconductor Thermal Measurement and Management SymposiumLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A world of opportunities

Optimal heat transfer for liquid cooling with minimal coolant volume

Silver diamond composite as a new packaging solution: A thermo-mechanical stability study

A quick PCB thermal calculator to aid system design of exposed pad packages

Issues of thermal testing of AC LEDs

Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks

Copyright page

Data center design using improved CFD modeling and cost reduction analysis

Development of an advanced thermal interface material for high power devices

Transient dual interface measurement — A new JEDEC standard for the measurement of the junction-to-case thermal resistance

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Latest Publications