Thermoelectric cooler box using a mini pin fin as a heat removal unit: Effect of using radiator on coefficient of performance

2021 ◽  
Author(s):  
Mirmanto Mirmanto ◽  
Syahrul Syahrul ◽  
Made Wirawan ◽  
Ida Bagus Alit ◽  
Zulham Saputra
Keyword(s):  
Heat Removal ◽  
Coefficient Of Performance ◽  
Thermoelectric Cooler ◽  
Pin Fin

scholarly journals Performance of a Thermoelectric Cooler Box Powered Using Solar Panels with a Mini Pin Fin Heat Removal Unit

2021 ◽  
Vol 6 (3) ◽  
pp. 355-360
Author(s):  
Mirmanto Mirmanto ◽  
Syahrul Syahrul ◽  
Made Wirawan ◽  
Zulham Saputra
Keyword(s):  
Heat Removal ◽  
Thermoelectric Cooler ◽  
Solar Panels ◽  
Pin Fin

scholarly journals Simulation and experimental study on performance analysis of solar photovoltaic integrated thermoelectric cooler using MATLAB Simulink

2021 ◽  
pp. 301-301
Author(s):  
Lalith Nadimuthu ◽  
Divya Selvaraj ◽  
Kirubakaran Victor
Keyword(s):  
Cooling System ◽  
Thermoelectric Module ◽  
Heat Removal ◽  
Coefficient Of Performance ◽  
Photovoltaic Module ◽  
Air Cooling ◽  
Thermoelectric Cooler ◽  
Solar Photovoltaic ◽  
Matlab Simulink ◽  
Effective Heat

The present study investigates the performance of solar photovoltaic integrated thermoelectric cooler (TEC) using MATLAB Simulink. The enhancement of efficiency has been achieved using an effective heat removal mechanism from the hot side heat sink. Since the hot side temperature is a crucial parameter. The intrinsic material properties like Seebeck coefficient (?), Thermal Conductance (K) and Electrical resistance (R) of the thermoelectric module are carefully estimated using analytical method and reported. The MATLAB Simulink Peltier module is developed based on the estimated intrinsic properties. The effect of system Voltage (V) and Current (A) on the thermal parameters like cooling capacity (QC) and Coefficient of performance (COP) has been investigated. The simulation study is validated by conducting a series of experimental analysis. The experimental model is equipped with a 100 Wp polycrystalline solar photovoltaic module to integrate and power the 12V/5 A of the 60-Watt thermoelectric cooler. Moreover, the results reveal that there is a significant effect of ambient and hot side temperature on the thermoelectric cooler performance. The fin-type conductive mode of heat transfer mechanism is adopted along with the convective forced air-cooling system to achieve effective heat removal from the hot side. The infrared thermographic investigation is carried out for ascertaining effective heat removal.

scholarly journals Performance Analysis of Hybrid Desiccant Cooling System with Enhanced Dehumidification Capability Using TRNSYS

2021 ◽  
Vol 11 (7) ◽  
pp. 3236
Author(s):  
Ji Hyeok Kim ◽  
Joon Ahn
Keyword(s):  
Thermal Comfort ◽  
Cooling System ◽  
Operation Mode ◽  
Heat Removal ◽  
Simulation Models ◽  
Coefficient Of Performance ◽  
Dimensional Structure ◽  
Dominant Factor ◽  
Exhaust Heat ◽  
Chp System

In a field test of a hybrid desiccant cooling system (HDCS) linked to a gas engine cogeneration system (the latter system is hereafter referred to as the combined heat and power (CHP) system), in the cooling operation mode, the exhaust heat remained and the latent heat removal was insufficient. In this study, the performance of an HDCS was simulated at a humidity ratio of 10 g/kg in conditioned spaces and for an increasing dehumidification capacity of the desiccant rotor. Simulation models of the HDCS linked to the CHP system were based on a transient system simulation tool (TRNSYS). Furthermore, TRNBuild (the TRNSYS Building Model) was used to simulate the three-dimensional structure of cooling spaces and solar lighting conditions. According to the simulation results, when the desiccant capacity increased, the thermal comfort conditions in all three conditioned spaces were sufficiently good. The higher the ambient temperature, the higher the evaporative cooling performance was. The variation in the regeneration heat with the outdoor conditions was the most dominant factor that determined the coefficient of performance (COP). Therefore, the COP was higher under high temperature and dry conditions, resulting in less regeneration heat being required. According to the prediction results, when the dehumidification capacity is sufficiently increased for using more exhaust heat, the overall efficiency of the CHP can be increased while ensuring suitable thermal comfort conditions in the cooling space.

Three-Dimensional Analysis on the Performance of the Thermoelectric Micro-Cooler

2005 ◽  
Author(s):  
Kong Hoon Lee ◽  
Ook Joong Kim
Keyword(s):  
Temperature Difference ◽  
Three Dimensional ◽  
Coefficient Of Performance ◽  
Thermoelectric Cooler ◽  
Small Temperature ◽  
Small Current ◽  
Thermoelectric Element ◽  
Maximum Value ◽  
Column Type ◽  
P Type

Three-dimensional numerical analysis has been carried out using the FEMLAB software package to figure out the performance of the thermoelectric micro-cooler. A small-size and column-type thermoelectric cooler is considered and Bi2Te3 and Sb2Te3 are selected as the n- and p-type thermoelectric materials, respectively. The thickness of the thermoelectric element considered is 5 to 20 μm and the thickness affects the performance of the cooler. The effect of parameters such as the temperature difference, the current, and the thickness of the thermoelectric element on the performance of the cooler has also been investigated. The coefficient of performance (COP) is the primary factor to evaluate the performance of the cooler and the COP varies with the parameters. The COP has the maximum value at a certain current and the value decreases with the temperature difference or the thickness. The predicted results also show that the performance can be improved for thick thermoelectric element at the small temperature difference and small current.

High Power CPU Cooling Experiment

1995 ◽  
Author(s):  
Elizabeth B. Nadworny ◽  
T. Gary Yip ◽  
Nader Farag
Keyword(s):  
Heat Transfer ◽  
High Power ◽  
Power Dissipation ◽  
Heat Removal ◽  
Data Acquisition System ◽  
Heat Sinks ◽  
Small Scale ◽  
Heat Transfer Area ◽  
Pin Fin ◽  
Transfer Parameters

Abstract This experimental study focuses on the enhancement of the heat removal process by modifying the geometry of pin fin heat sinks, while maintaining the same effective heat transfer area. The pins are cut at an angle to reduce the blockage of air flow across the surface. To perform this study, a small scale wind tunnel facility has been designed specifically for testing high power dissipation processors and other ULSI components. The facility is fully automated and controlled by an HP3852A Data Acquisition System interfaced with a 486 based PC computer. The average surface temperature, Reynolds number, Nusselt number and other relevant heat transfer parameters were reduced from the data collected. Results from the study show that a heat sink with an angled trailing edge produces the greatest enhancement of heat removal. The mechanism for the improved heat transfer is the larger temperature gradient across the surface, which is obtained by lowering the minimum temperature on the surface.

Energy Flow in the Information Technology Stack: Introducing the Coefficient of Performance of the Ensemble

2006 ◽  
Author(s):  
Chandrakant D. Patel ◽  
Ratnesh K. Sharma ◽  
Cullen E. Bash ◽  
Monem H. Beitelmal
Keyword(s):  
Information Technology ◽  
Data Center ◽  
Air Conditioning ◽  
Cooling Tower ◽  
Heat Removal ◽  
Flow Distribution ◽  
Coefficient Of Performance ◽  
Dynamics Modeling ◽  
Smart Data ◽  
The Cost

The information technology industry is in the midst of a transformation to lower the cost of operation through consolidation and better utilization of critical data center resources. Successful consolidation necessitates increasing utilization of capital intensive "always-on" data center infrastructure, and reducing the recurring cost of power. A need exists, therefore for an end to end physical model that can be used to design and manage dense data centers and determine the cost of operating a data center. The chip core to the cooling tower model must capture the power levels and thermo-fluids behavior of chips, systems, aggregation of systems in racks, rows of racks, room flow distribution, air conditioning equipment, hydronics, vapor compression systems, pumps and heat exchangers. Earlier work has outlined the foundation for creation of a "smart" data center through use of flexible cooling resources and a distributed sensing and control system that can provision the cooling resources based on the need. This paper shows a common thermodynamic platform which serves as an evaluation and basis for policy based control engine for such a "smart" data center with much broader reach - from chip core to the cooling tower. Computational Fluid Dynamics modeling is performed to determine the computer room air conditioning utilization for a given distribution of heat load and cooling resources in a production data center. Coefficient of performance (COP) of the computer room air conditioning units, based on the level of utilization, is used with COP of other cooling resources in the stack to determine the COP of the ensemble. The ensemble COP represents an overall measure of the performance of the heat removal stack in a data center.

Thermoelectric Cooler Based Regenerative Adsorption Refrigeration System for High Temperature Electronics

2007 ◽  
Author(s):  
Ashish Sinha ◽  
Yogendra Joshi ◽  
Bruce H. Storm
Keyword(s):  
Coefficient Of Performance ◽  
Thermoelectric Cooler ◽  
Adsorption Refrigeration ◽  
Evaporator Temperature ◽  
Excess Heat ◽  
High Temperature Electronics ◽  
Bed Temperature ◽  
Heat Regeneration ◽  
A Tec ◽  
Adsorption Cycle

This paper presents the analytical study of a thermoelectric cooler (TEC) based two-stage regenerative adsorption cycle with evaporator temperature ranging from 80°C to 180°C and heat rejection temperature ranging from 200°C to 230°C. This proposed cycle restricts the highest temperature at which the TEC regenerates heat by reducing the maximum bed temperature during the desorption phase, which leads to the possibility of the system being realized with commercially available TECs and a reasonable TEC coefficient of performance (COP∼ 0.4). The low COP (<1) of the TEC results in excess heat at the desorption bed during heat regeneration. If the excess heat is rejected to the environment, COP gains arising from regeneration are reduced. Using the TEC to regenerate only part of the heat helps to mitigate this problem. The adsorption cycle in conjunction with TEC can pump heat through larger temperature differences with system efficiency much greater than that of a TEC used alone under identical conditions. The study aims to extend the limits of the adsorption refrigeration systems to provide compact cooling devices for harsh environments.

Numerical Investigation of Heat Transfer Enhancement in a Microchannel With Offset Micro Pin-Fins

2010 ◽  
Author(s):  
Haleh Shafeie ◽  
Omid Abouali ◽  
Khosrow Jafarpour
Keyword(s):  
Heat Transfer ◽  
Pressure Drop ◽  
Numerical Study ◽  
Removal Rate ◽  
Heat Removal ◽  
Coefficient Of Performance ◽  
Navier Stokes ◽  
Liquid Region ◽  
Noticeable Effect ◽  
Pin Fins

This paper presents a numerical study of laminar forced convection in microchannels network heat sinks with fabricated offset pin-fins. A 3-dimensional mathematical model, for conjugate heat transfer in both solid and liquid is presented. For this aim the Navier-Stokes and energy equations for the liquid region and the energy equation for the solid region are solved simultaneously and the pressure drop together heat transfer characteristics of a single-phase microchannel heat sink were investigated. A typical microchannel was selected and it was shown that using offset pin-fins has a noticeable effect and heat removal rate can be increased using this technique. However the pressure drop is also highly increasing which leads to a low coefficient of performance for microchannel with this type of micro-structure.

scholarly journals Estimation of coefficient of performance of thermoelectric cooler using a 30 W single-stage type

2021 ◽  
Author(s):  
Rotimi Adedayo Ibikunle ◽  
Mutalubi Aremu Akintunde ◽  
Isaac Femi Titiladunayo ◽  
Adekunle Akanni Adeleke
Keyword(s):  
Heat Exchange ◽  
Electrical Power ◽  
Thermoelectric Module ◽  
Single Stage ◽  
Coefficient Of Performance ◽  
Thermoelectric Cooler ◽  
Cooling Period ◽  
Vegetable Samples ◽  
Cooling Chamber ◽  
Before And After

Abstract In this study, a single stage thermoelectric cooler (TER, of size: 21 × 14.2 × 13.5 cm) with thermoelectric module (TEM, of type inbc1-127. 05 with size 40 × 40 × 4.0 mm) and applied electrical power of 30 W and current of 2.5 A, was adopted to estimate the coefficient of performance (COP) of thermoelectric refrigerator (TER). The TER uses a fan to cool the heat exchange region of the TEM. The temperature of the fruit/vegetable samples used in this study was taken before and after cooling for a specific period. The temperatures at both the hot and cold sides of the TEM were also taken at every specific cooling period. The experimented TER can cool vegetable/fruit from about 27 to 5°C within 3 h. The aim of this study is to determine the COP of TER to ascertain the possible applications. The temperature gradient at the heat exchange section of TEM was used to estimate the average theoretical COP to be 0.99, the heat extracted from the cooling chamber and the power supplied was used to estimate the average practical cooling COP to be 0.52; which is within 0.4–0.7 standard COP for a single stage type of TER.

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