Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap

2021 ◽  
Vol 143 (3) ◽  
Author(s):  
Yuanchen Hu ◽  
Md Obaidul Hossen ◽  
Zhimin Wan ◽  
Muhannad S. Bakir ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Integrated Circuit ◽  
High Performance ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Heat Removal ◽  
Power Estimation ◽  
Leakage Power ◽  
Pin Fin ◽  
Pin Fins

Abstract Three-dimensional (3D) stacked integrated circuit (SIC) chips are one of the most promising technologies to achieve compact, high-performance, and energy-efficient architectures. However, they face a heat dissipation bottleneck due to the increased volumetric heat generation and reduced surface area. Previous work demonstrated that pin-fin enhanced microgap cooling, which provides fluidic cooling between layers could potentially address the heat dissipation challenge. In this paper, a compact multitier pin-fin single-phase liquid cooling model has been established for both steady-state and transient conditions. The model considers heat transfer between layers via pin-fins, as well as the convective heat removal in each tier. Spatially and temporally varying heat flux distribution, or power map, in each tier can be modeled. The cooling fluid can have different pumping power and directions for each tier. The model predictions are compared with detailed simulations using computational fluid dynamics/heat transfer (CFD/HT). The compact model is found to run 120–600 times faster than the CFD/HT model, while providing acceptable accuracy. Actual leakage power estimation is performed in this codesign model, which is an important contribution for codesign of 3D-SICs. For the simulated cases, temperatures could decrease 3% when leakage power estimation is adopted. This model could be used as electrical-thermal codesign tool to optimize thermal management and reduce leakage power.

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal

2016 ◽  
Vol 138 (1) ◽  
Author(s):  
Thomas Brunschwiler ◽  
Arvind Sridhar ◽  
Chin Lee Ong ◽  
Gerd Schlottig
Keyword(s):  
Integrated Circuits ◽  
Thermal Management ◽  
Integrated Circuit ◽  
Power Dissipation ◽  
High Performance ◽  
Heat Dissipation ◽  
Hybrid Approach ◽  
Three Dimensional ◽  
Heat Removal ◽  
Back Side

An overview of the thermal management landscape with focus on heat dissipation from three-dimensional (3D) chip stacks is provided in this study. Evolutionary and revolutionary topologies, such as single-side, dual-side, and finally, volumetric heat removal, are benchmarked with respect to a high-performance three-tier chip stack with an aggregate power dissipation of 672 W. The thermal budget of 50 K can be maintained by three topologies, namely: (1) dual-side cooling, implemented by a thermally active interposer, (2) interlayer cooling with four-port fluid delivery and drainage at 100 kPa pressure drop, and (3) a hybrid approach combining interlayer with embedded back-side cooling. Of all the heat-removal concepts, interlayer cooling is the only approach that scales with the number of dies in the chip stack and hence enables extreme 3D integration. However, the required size of the microchannels competes with the requirement of low through-silicon-via (TSV) heights and pitches. A scaling study was performed to derive the TSV pitch that is compatible with cooling channels to dissipate 150 W/cm2 per tier. An active integrated circuit (IC) area of 4 cm2 was considered, which had to be implemented on the varying tier count in the stack. A cuboid form factor of 2 mm × 4 mm × 2.55 mm results from a die count of 50. The resulting microchannels of 2 mm length allow small hydraulic diameters and thus a very high TSV density of 1837 1/mm2. The accumulated heat flux and the volumetric power dissipation are as high as 7.5 kW/cm2 and 29 kW/cm3, respectively.

Numerical Investigation on the Flow and Heat Transfer Characteristics of the Superheated Steam in the Wedge Duct With Pin-Fins

2013 ◽  
Author(s):  
Gaoliang Liao ◽  
Xinjun Wang ◽  
Xiaowei Bai ◽  
Ding Zhu ◽  
Jinling Yao
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Nusselt Number ◽  
Three Dimensional ◽  
Heat Transfer Characteristics ◽  
Pin Fin ◽  
Transfer Characteristics ◽  
Flow And Heat Transfer ◽  
Pin Fins ◽  
Steam Superheat

By using the CFX software, the three-dimensional flow and heat transfer characteristics in the cooling duct with pin-fin in the blade trailing edge were numerically simulated. The effects of pin-fin arrangements, Reynolds number, steam superheat degrees, streamwise pin density and convergence angle of the wedge duct on the flow and heat transfer characteristics were analysed. The results show that the Nusselt number on the endwall and pin-fin surfaces as well as the pin-fin row averaged Nusselt number increase with the increasing of Reynolds number, while it decreased with the with the increasing of X/D. The pressure drop increases with the increasing of Reynolds number while decreases with the increasing of X/D in the wedge duct. The degree of superheat has little effect on the pressure loss in the wedge duct. A comprehensive analysis and comparison show that the highest thermal performance is reached in the wedge duct when the value of X/D is 1.5.

Orthotropic Thermal Conductivity Effect on Cylindrical Pin Fin Heat Transfer

2005 ◽  
Author(s):  
Raj Bahadur ◽  
Avram Bar-Cohen
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
High Performance ◽  
Heat Sinks ◽  
Transfer Coefficients ◽  
Design And Optimization ◽  
Pin Fin ◽  
Wide Range ◽  
Pin Fins ◽  
The One

There is growing interest in the use of polymer composites with enhanced thermal conductivity for high performance fin arrays and heat sinks. However, the thermal conductivity of these materials is relatively low compared to conventional fin metals, and strongly orthotropic. Therefore, the design and optimization of such polymer pin fins requires extension of the one dimensional classical fin analysis to include two-dimensional orthotropic heat conduction effects. An analytical equation for heat transfer from a cylindrical pin fin with orthotropic thermal conductivity is derived and validated using detailed finite-element results. The thermal performance of such fins was found to be dominated by the axial thermal conductivity, but to depart from the classical fin solution with increasing values of a radius- and radial conductivity-based Biot number. Using these relations, it is determined that fin orthotropy does not materially affect the behavior of typical air-cooled fins. Alternatively, for heat transfer coefficients achievable with water cooling and conductivity ratios below 0.1, the fin heat transfer rate can fall more than 25% below the “classical” heat transfer rates. Detailed orthotropic fin temperature distributions are used to explain this discrepancy. Simplified orthotropic pin fin heat transfer equations are derived and validated over a wide range of orthotropic conditions.

Forced Convection Heat Transfer Enhancement by Porous Pin Fins in Rectangular Channels

2010 ◽  
Vol 132 (5) ◽  
Author(s):  
Jian Yang ◽  
Min Zeng ◽  
Qiuwang Wang ◽  
Akira Nakayama
Keyword(s):  
Heat Transfer ◽  
Three Dimensional ◽  
Convection Heat Transfer ◽  
Heat Fluxes ◽  
Physical Parameters ◽  
Pore Density ◽  
Pressure Drops ◽  
Pin Fin ◽  
Rectangular Channels ◽  
Pin Fins

The forced convective heat transfer in three-dimensional porous pin fin channels is numerically studied in this paper. The Forchheimer–Brinkman extended Darcy model and two-equation energy model are adopted to describe the flow and heat transfer in porous media. Air and water are employed as the cold fluids and the effects of Reynolds number (Re), pore density (PPI) and pin fin form are studied in detail. The results show that, with proper selection of physical parameters, significant heat transfer enhancements and pressure drop reductions can be achieved simultaneously with porous pin fins and the overall heat transfer performances in porous pin fin channels are much better than those in traditional solid pin fin channels. The effects of pore density are significant. As PPI increases, the pressure drops and heat fluxes in porous pin fin channels increase while the overall heat transfer efficiencies decrease and the maximal overall heat transfer efficiencies are obtained at PPI=20 for both air and water cases. Furthermore, the effects of pin fin form are also remarkable. With the same physical parameters, the overall heat transfer efficiencies in the long elliptic porous pin fin channels are the highest while they are the lowest in the short elliptic porous pin fin channels.

scholarly journals Numerical Research on Thermal Variations along SSF Pin Fins Shaped with SSM Processing

2019 ◽  
Vol 8 (12) ◽  
pp. 504-507
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Flux ◽  
Stainless Steel ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Pin Fin ◽  
Temperature Distributions ◽  
Pin Fins ◽  
Numerical Research

Fins or heat sinks are meant for boosting heat transfer. Therefore, planned computations remain fortified for examining the impacts of SSF pin fin on thermal dispersal concerning constant thermal value 6 W/cm2 . For that SSF pin fins materials of stainless steel and aluminum are preferred. Usual convective equations are solved to foretell thermal apprehensions. As anticipated, for both the stated SSF pin fins, temperature and heat flux declines for increasing length scales. Additionally, temperature distributions on SSF aluminum pin fin lays beneath SSF stainless steel pin fin. Hence, heat dissipation from SSF aluminum pin fin is relatively higher. Obviously, it may be owing to quite higher thermal conductivity of SSF aluminum pin fin. Consequently, it delivers higher, gregarious and remarkable thermal behaviors. Nevertheless, both simulation forecasts remain analogous with one another.

scholarly journals Mathematical Extrapolating of Highly Efficient Fin Systems

2011 ◽  
Vol 2011 ◽  
pp. 1-18 ◽  
Author(s):  
A.-R. A. Khaled
Keyword(s):  
Thermal Efficiency ◽  
Dissipation Rate ◽  
High Performance ◽  
Heat Dissipation ◽  
Numerical Solutions ◽  
Pin Fin ◽  
Pin Fins ◽  
Effective Efficiency ◽  
Triangular Fin ◽  
Profile Area

Different high-performance fins are mathematically analyzed in this work. Initially, three types are considered: (i) exponential, (ii) parabolic, and (iii) triangular fins. Analytical solutions are obtained. Accordingly, the effective thermal efficiency and the effective volumetric heat dissipation rate are calculated. The analytical results were validated against numerical solutions. It is found that the triangular fin has the maximum effective thermal length. In addition, the exponential pin fin is found to have the largest effective thermal efficiency. However, the effective efficiency for the straight one is the maximum when its effective thermal length based on profile area is greater than 1.4. Furthermore, the exponential straight fin is found to have effective volumetric heat dissipation that can be 440% and 580% above the parabolic and triangular straight fins, respectively. In contrast, the exponential pin fin is found to possess effective volumetric heat dissipation that can be 120% and 132% above the parabolic and triangular pin fins, respectively. Finally, new high performance fins are mathematically generated that can have effective volumetric heat dissipation of 24% and 12% above those of exponential pin and straight fins, respectively.

Numerical Study on Heat Transfer Characteristics in Rectangular Ducts With Pin-Fins

2011 ◽  
Author(s):  
Xinjun Wang ◽  
Xiaowei Bai ◽  
Jiangbo Wu ◽  
Rui Liu ◽  
Ding Zhu ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Nusselt Number ◽  
Numerical Study ◽  
Flow Direction ◽  
Three Dimensional ◽  
Heat Transfer Characteristics ◽  
Pin Fin ◽  
Transfer Characteristics ◽  
Pin Fins

By using the CFX software, three-dimensional flow and heat transfer characteristics in rectangular cooling ducts with in-line and staggered array pin-fins of gas turbine blade trailing edge were numerically simulated. The effects of in-line and staggered arrays of pin-fins, flow Reynolds number as well as density of cylindrical pin-fins in flow direction on heat transfer characteristics were analyzed. Both in the cases of in-line and staggered arrays of pin-fins, the results show that the pin-fin surface averaged Nusselt number increases with the increasing of Reynolds number. In the case of the same Reynolds number, the mean Nusselt number of pin-fin surface decreased with the increasing of X/D (the ratio of streamwise pin-pitch to pin-fin diameter) value. The Nusselt number increases gradually before the first pin-fin row and then reached the fully developed value at fourth or fifth row. The pin-fin Nusselt number at flow direction is larger than that at back flow direction. Along the height direction of pin-fin, the Nusselt number in middle area is larger.

Augmented Heat Transfer of Internal Blade Tip Wall With Pin-Fins

2009 ◽  
Author(s):  
G. N. Xie ◽  
B. Sunde´n ◽  
L. Wang ◽  
E. Utriainen
Keyword(s):  
Heat Transfer ◽  
Computational Models ◽  
Turbine Blades ◽  
Three Dimensional ◽  
Reynolds Numbers ◽  
Inlet Temperature ◽  
Gas Flows ◽  
Pin Fin ◽  
Pin Fins ◽  
Blade Tip

The heat transferred to the turbine blade is substantially increased as the turbine inlet temperature is increased. Cooling methods are therefore much needed for the turbine blades to ensure a long durability and safe operation. The blade tip region is exposed to the hot gas flows. A common way to cool the tip is to use serpentine passages with 180-deg turn under the blade tip cap taking advantage of the three-dimensional turning effect and impingement. Improving internal convective cooling is therefore required to increase the blade tip life. In this paper, augmented heat transfer of a blade tip has been investigated numerically. The computational models consist of a two-pass channel with 180-deg turn and an array of pin-fins mounted on the tip-cap, and a smooth two-pass channel. Inlet Reynolds numbers are ranging from 100,000 to 600,000. The computations are 3D, steady, incompressible and stationary. The detailed 3D fluid flow and heat transfer over the tip surfaces are presented. The overall performance of the two models is evaluated. It is found that the pin-fins make the counter-rotating vortices towards pin-fin surfaces, resulting in continuous turbulent mixing near the pin-finned tip. Due to the combination of turning, impingement and pin-fin crossflow, the heat transfer coefficient of the pin-finned tip is a factor of as much as 1.84 higher than that of a smooth tip. This augmentation is achieved at the expense of a penalty of pressure drop around 35%. It is suggested that the pin-fins could be used to enhance blade tip heat transfer and cooling.

Comparative Analysis of Heat Transfer and Fluid Flow in Circular and Rhombus Pin Fin Heat Sink Using Nanofluid

2021 ◽  
Vol 13 (5) ◽  
Author(s):  
Dungali Sreehari ◽  
Yogesh K. Prajapati
Keyword(s):  
Heat Transfer ◽  
Fluid Flow ◽  
Comparative Analysis ◽  
Pressure Drop ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Flow Behavior ◽  
Computational Domain ◽  
Pin Fin ◽  
Pin Fins

Abstract Numerical investigation has been carried out to compare the heat transfer performance and fluid flow behavior of microchannel heat sinks with circular and rhombus pin fins which are arranged in an in-line manner. Diameter and sides are 1 mm for circular and rhombus fins. Three-dimensional (3D) computational domain has been simulated using two types of cooling medium, i.e., water and Al2O3–H2O nanofluid. A comprehensive comparative analysis has been presented considering the coolants and pin fin profiles as variable parameters. Two operating variables, i.e., heat flux (q) and Reynolds number (Re), are varied in the range of q = 100–400 kW/m2 and Re = 100–400. A total of 64 cases have been simulated to identify the promising features of both the pin fins attributed to improved heat transfer and overall thermal performance. Comparison has also been made between the coolant medium to find out their heat dissipation potential and flow characteristics in the heat sink. Results obtained in terms of average bottom wall temperature, heat transfer coefficient, Nusselt number (Nu), and pressure drop demonstrate that heat sink with rhombus pin fins dissipates more heat compared to its counterpart. It is attributed to the shape and geometry of rhombus fins that facilitate distinct fluid flow behavior; nevertheless, the pressure drop is less in the circular fin heat sink. Moreover, for constant value of Re, nanofluid extracts more heat compared to water in both configurations of the heat sink.

Effect of Heat Sink Structure Improvement on Heat Dissipation Performance in High Heat Flux

2016 ◽  
Author(s):  
Zhuo Cui
Keyword(s):  
Heat Resistance ◽  
Water Flow ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Convection Heat Transfer ◽  
Cooling Water ◽  
High Heat Flux ◽  
Pin Fin ◽  
Pin Fins ◽  
Pin Fin Arrays

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.

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