scholarly journals Simulation and experimental study on performance analysis of solar photovoltaic integrated thermoelectric cooler using MATLAB Simulink

2021 ◽  
pp. 301-301
Author(s):  
Lalith Nadimuthu ◽  
Divya Selvaraj ◽  
Kirubakaran Victor
Keyword(s):  
Cooling System ◽  
Thermoelectric Module ◽  
Heat Removal ◽  
Coefficient Of Performance ◽  
Photovoltaic Module ◽  
Air Cooling ◽  
Thermoelectric Cooler ◽  
Solar Photovoltaic ◽  
Matlab Simulink ◽  
Effective Heat

The present study investigates the performance of solar photovoltaic integrated thermoelectric cooler (TEC) using MATLAB Simulink. The enhancement of efficiency has been achieved using an effective heat removal mechanism from the hot side heat sink. Since the hot side temperature is a crucial parameter. The intrinsic material properties like Seebeck coefficient (?), Thermal Conductance (K) and Electrical resistance (R) of the thermoelectric module are carefully estimated using analytical method and reported. The MATLAB Simulink Peltier module is developed based on the estimated intrinsic properties. The effect of system Voltage (V) and Current (A) on the thermal parameters like cooling capacity (QC) and Coefficient of performance (COP) has been investigated. The simulation study is validated by conducting a series of experimental analysis. The experimental model is equipped with a 100 Wp polycrystalline solar photovoltaic module to integrate and power the 12V/5 A of the 60-Watt thermoelectric cooler. Moreover, the results reveal that there is a significant effect of ambient and hot side temperature on the thermoelectric cooler performance. The fin-type conductive mode of heat transfer mechanism is adopted along with the convective forced air-cooling system to achieve effective heat removal from the hot side. The infrared thermographic investigation is carried out for ascertaining effective heat removal.

scholarly journals Performance Analysis of Hybrid Desiccant Cooling System with Enhanced Dehumidification Capability Using TRNSYS

2021 ◽  
Vol 11 (7) ◽  
pp. 3236
Author(s):  
Ji Hyeok Kim ◽  
Joon Ahn
Keyword(s):  
Thermal Comfort ◽  
Cooling System ◽  
Operation Mode ◽  
Heat Removal ◽  
Simulation Models ◽  
Coefficient Of Performance ◽  
Dimensional Structure ◽  
Dominant Factor ◽  
Exhaust Heat ◽  
Chp System

In a field test of a hybrid desiccant cooling system (HDCS) linked to a gas engine cogeneration system (the latter system is hereafter referred to as the combined heat and power (CHP) system), in the cooling operation mode, the exhaust heat remained and the latent heat removal was insufficient. In this study, the performance of an HDCS was simulated at a humidity ratio of 10 g/kg in conditioned spaces and for an increasing dehumidification capacity of the desiccant rotor. Simulation models of the HDCS linked to the CHP system were based on a transient system simulation tool (TRNSYS). Furthermore, TRNBuild (the TRNSYS Building Model) was used to simulate the three-dimensional structure of cooling spaces and solar lighting conditions. According to the simulation results, when the desiccant capacity increased, the thermal comfort conditions in all three conditioned spaces were sufficiently good. The higher the ambient temperature, the higher the evaporative cooling performance was. The variation in the regeneration heat with the outdoor conditions was the most dominant factor that determined the coefficient of performance (COP). Therefore, the COP was higher under high temperature and dry conditions, resulting in less regeneration heat being required. According to the prediction results, when the dehumidification capacity is sufficiently increased for using more exhaust heat, the overall efficiency of the CHP can be increased while ensuring suitable thermal comfort conditions in the cooling space.

Performance Evaluation of DRACS System for FHTR and Time Assessment of Operation Procedure

2013 ◽  
Author(s):  
Junya Nakata ◽  
Mikihiro Wakui ◽  
Michitsugu Mori ◽  
Hiroto Sakashita ◽  
Charles Forsberg
Keyword(s):  
Performance Evaluation ◽  
High Temperature ◽  
Cooling System ◽  
Heat Removal ◽  
Severe Accident ◽  
Air Cooling ◽  
Fluoride Salt ◽  
Nuclear Power Reactor ◽  
Decay Heat ◽  
Operation Procedure

The Fluoride-salt-cooled High-temperature Reactor (FHR) is a new concept of nuclear power reactor being investigated mainly in U.S. and China. The coolant is a liquid salt with a melting point of about 460°C and a boiling point of over 1400°C. As the baseline decay heat removal system, a passive Direct Reactor Air Cooling System (DRACS) is utilized. Though DRACS system has been developed in Sodium Fast reactors (SFR), there are some differences between both. For example, the system in FHR must decrease heat removal when temperatures are low to avoid freezing of the salt and blocking the flow of liquid. Therefore, considering its characteristics, a numerical investigation of DRACS system is needed to evaluate whether FHR has proper ability to remove decay heat and to be robust for a long-time cooling operation after even a severe accident. Furthermore, in addition to its performance evaluation, it is required to make up the operation plan of FHR considering features of this system. It is highly important, with the view of avoiding severe accident, to determine by when the system should be started up. In both countries mentioned above, Fluoride-salt-cooled High-temperature Test Reactor (FHTR) is currently in progress to build. Reviewing its design and system is a crucial step needed to develop the FHR technology. In this research, a performance of DRACS system under some thermal-hydraulic basic events was evaluated by numerical simulation. This paper also suggested the adequate operation procedure suitable for FHTR to avoid a severe accident.

Exergoeconomic analysis of a solar photovoltaic-based direct evaporative air-cooling system

Solar Energy ◽  
2019 ◽  
Vol 193 ◽  
pp. 253-266 ◽  
Author(s):  
Alireza Kiyaninia ◽  
Hajir Karimi ◽  
Vahid Madadi Avargani
Keyword(s):  
Cooling System ◽  
Air Cooling ◽  
Solar Photovoltaic ◽  
Air Cooling System ◽  
Exergoeconomic Analysis

Modelling and Simulation of Solar Photovoltaic Cell for Different Insolation Values Based on MATLAB/Simulink Environment

2014 ◽  
Vol 550 ◽  
pp. 137-143 ◽  
Author(s):  
S. Narendiran ◽  
Sarat Kumar Sahoo
Keyword(s):  
Photovoltaic Cell ◽  
Photovoltaic Module ◽  
Solar Photovoltaic ◽  
Electrical Characteristics ◽  
Array Type ◽  
Matlab Simulink ◽  
Photovoltaic Modules ◽  
Pv Module ◽  
Current Input ◽  
In Series

The paper discuss about the modelling and electrical characteristics of photovoltaic cell and its array type of construction in matlab-simulink environment at different insolation levels. The photovoltaic module is modelled using the diode electrical characteristic equation. The photovoltaic cell is analysed by voltage input and current input modules, The voltage and current input photovoltaic modules are simulated with different insolation values by varying the construction of PV modules. The results conclude that the current input PV module is well suited for applications were it shares same current when connected in series and voltage input PV module, where it shares same voltage when connected in parallel.

scholarly journals Estimation of coefficient of performance of thermoelectric cooler using a 30 W single-stage type

2021 ◽  
Author(s):  
Rotimi Adedayo Ibikunle ◽  
Mutalubi Aremu Akintunde ◽  
Isaac Femi Titiladunayo ◽  
Adekunle Akanni Adeleke
Keyword(s):  
Heat Exchange ◽  
Electrical Power ◽  
Thermoelectric Module ◽  
Single Stage ◽  
Coefficient Of Performance ◽  
Thermoelectric Cooler ◽  
Cooling Period ◽  
Vegetable Samples ◽  
Cooling Chamber ◽  
Before And After

Abstract In this study, a single stage thermoelectric cooler (TER, of size: 21 × 14.2 × 13.5 cm) with thermoelectric module (TEM, of type inbc1-127. 05 with size 40 × 40 × 4.0 mm) and applied electrical power of 30 W and current of 2.5 A, was adopted to estimate the coefficient of performance (COP) of thermoelectric refrigerator (TER). The TER uses a fan to cool the heat exchange region of the TEM. The temperature of the fruit/vegetable samples used in this study was taken before and after cooling for a specific period. The temperatures at both the hot and cold sides of the TEM were also taken at every specific cooling period. The experimented TER can cool vegetable/fruit from about 27 to 5°C within 3 h. The aim of this study is to determine the COP of TER to ascertain the possible applications. The temperature gradient at the heat exchange section of TEM was used to estimate the average theoretical COP to be 0.99, the heat extracted from the cooling chamber and the power supplied was used to estimate the average practical cooling COP to be 0.52; which is within 0.4–0.7 standard COP for a single stage type of TER.

scholarly journals Regulation of Cooling Mode of Thermoelectric Bloc

2021 ◽  
pp. 416-423
Author(s):  
Evgeniy N. Vasil'ev
Keyword(s):  
Computational Model ◽  
Thermoelectric Module ◽  
Heat Removal ◽  
Current Strength ◽  
Coefficient Of Performance ◽  
Cooling Power ◽  
Algebraic Equations ◽  
Operating Characteristics ◽  
Cooling Mode ◽  
Thermoelectric Refrigeration

With the help of a computational model, the cooling modes of a block of a thermoelectric refrigeration unit designed for ship's provision and freezing chambers are studied. The computational model, based on the numerical solution of a system of nonlinear algebraic equations, takes into account the operating characteristics of a serial thermoelectric module and the thermal resistances of heat removal and supply devices. The dependences of the cooling power and the coefficient of performance of the block on the supply current of the thermoelectric modules are calculated. The analysis of the cooling modes of the thermoelectric block is carried out and recommendations for regulating the current strength depending on the current temperature conditions in the provision and freezing chambers are developed

ARCTIC: A Rotary Compressor Thermally Insulated µCooler

2005 ◽  
Author(s):  
Joshua D. Heppner ◽  
David C. Walther ◽  
Albert P. Pisano
Keyword(s):  
Hot Spots ◽  
Cooling System ◽  
Heat Removal ◽  
Coefficient Of Performance ◽  
The Arctic ◽  
Working Fluid ◽  
Rotary Compressor ◽  
Speed Increase ◽  
Rotary Engine ◽  
Compressor Design

Microscale cooling to date relies largely on passive on-chip cooling in order to move heat from hot spots to alternate sites. Such passive cooling devices include capillary pump loops (CPL), heat pipes, and thermosiphons. Recent developments for active cooling systems include thermal electric coolers (TECs) for heat removal. This paper focuses on the design of an active microscale closed loop cooling system that uses a Rankine vapor compression cycle cooling system. In this design, a rotary compressor will generate the high pressure required for efficient cooling and will circulate the working fluid to move heat away from chip level hot spots to the ambient. The rotary compressor will leverage technology gained from the Rotary Engine Power System (REPS) program at the UC Berkeley, most specifically the 367 mm3 displacement platform. The advantage of a Wankel (Maillard) compressor is that it provides six compression strokes per revolution rather than a single compression stroke common to other popular compressors such as the rolling piston. The current Wankel compressor design will achieve a theoretical compression ratio of 8:1. The ARCTIC (A Rotary Compressor Thermally Insulated μCooler) system will be a microscale hybrid system consisting of some microfabricated (or MEMS) components including microchannels, in plane MEMS valves, and potentially MEMS temperature, pressure and flow sensors integrated with mesoscale, traditionally machined steel components, including the compressor itself. The system is designed to remove between 25-35 W of heat at 1000 rpm using R-134a but the system is easily scaleable through a speed increase or decrease of the compressor. Further, the current compressor design has a theoretical coefficient of performance (C.O.P.) of approximately 2, a significant improvement over comparable TECs with C.O.P.s of approximately .05-.1. Finally, a thermal circuit analysis determines that the time constant to achieve refrigeration temperature in 12 seconds is possible.

scholarly journals Cooling Performance of Thermoelectric Cooling (TEC) and Applications: A review

2018 ◽  
Vol 225 ◽  
pp. 03021 ◽  
Author(s):  
Aqilah Che Sulaiman ◽  
Nasrul Amri Mohd Amin ◽  
Mohd Hafif Basha ◽  
Mohd Shukry Abdul Majid ◽  
Nashrul Fazli bin Mohd Nasir ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Figure Of Merit ◽  
Review Paper ◽  
Large Range ◽  
Cooling System ◽  
High Reliability ◽  
Thermoelectric Module ◽  
Coefficient Of Performance ◽  
Thermoelectric Cooling ◽  
Compact Size

Thermoelectric cooling (TEC) is a new attractive method that is can be used as a temperature controller. Thermoelectric module (TEM) is a device that environmentally friendly utilizing for cooling and heating application such as heat pump and power generation. Therefore, the understanding of relation between electrical conductivity and heat conductivity of the TEC material is essentially to improve the coefficient of performance (COP) efficiency. The figure of merit is addressed by focusing the best material in TEC with different cooling material. The critical finding of TEC for this review paper is the higher the electrical conductivity and the lower thermal conductivity, the maximum the COP. Finally, the possiblity of the TEC application is reviewed according to the advantages of TEC such as high reliability, less maintenance and compact size that commercially found in large range of thermoelectric cooling system. N

Thermoelectric cooler box using a mini pin fin as a heat removal unit: Effect of using radiator on coefficient of performance

2021 ◽  
Author(s):  
Mirmanto Mirmanto ◽  
Syahrul Syahrul ◽  
Made Wirawan ◽  
Ida Bagus Alit ◽  
Zulham Saputra
Keyword(s):  
Heat Removal ◽  
Coefficient Of Performance ◽  
Thermoelectric Cooler ◽  
Pin Fin

Electrohydrodynamic Microfabricated Ionic Wind Pumps for Thermal Management Applications

2014 ◽  
Vol 136 (6) ◽  
Author(s):  
Andojo Ongkodjojo Ong ◽  
Alexis R. Abramson ◽  
Norman C. Tien
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Thermal Management ◽  
High Reliability ◽  
Semiconductor Industry ◽  
Heat Removal ◽  
Coefficient Of Performance ◽  
Air Cooling ◽  
Ionic Wind

This work demonstrates an innovative microfabricated air-cooling technology that employs an electrohydrodynamic (EHD) corona discharge (i.e., ionic wind pump) for electronics cooling applications. A single, microfabricated ionic wind pump element consists of two parallel collecting electrodes between which a single emitting tip is positioned. A grid structure on the collector electrodes can enhance the overall heat-transfer coefficient and facilitate an IC compatible batch process. The optimized devices studied exhibit an overall device area of 5.4 mm × 3.6 mm, an emitter-to-collector gap of ∼0.5 mm, and an emitter curvature radius of ∼12.5 μm. The manufacturing process developed for the device uses glass wafers, a single mask-based photolithography process, and a low-cost copper-based electroplating process. Various design configurations were explored and modeled computationally to investigate their influence on the cooling phenomenon. The single devices provide a high heat-transfer coefficient of up to ∼3200 W/m2 K and a coefficient of performance (COP) of up to ∼47. The COP was obtained by dividing the heat removal enhancement, ΔQ by the power consumed by the ionic wind pump device. A maximum applied voltage of 1.9 kV, which is equivalent to approximately 38 mW of power input, is required for operation, which is significantly lower than the power required for the previously reported devices. Furthermore, the microfabricated single device exhibits a flexible and small form factor, no noise generation, high efficiency, large heat removal over a small dimension and at low power, and high reliability (no moving parts); these are characteristics required by the semiconductor industry for next generation thermal management solutions.

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