scholarly journals PREPARATION AND STUDY OF n-GaP LAYERS DEPOSITED ON p-Si SUBSTRATES BY LIQUID PHASE EPITAXY

1995 ◽  
Vol 18 (1) ◽  
pp. 113-113
Author(s):  
F. Banhart ◽  
F.O. Phillipp ◽  
R. Bergmann ◽  
E. Czech ◽  
M. Konuma ◽  
...  

Defect-free silicon layers grown on insulators (SOI) are an essential component for future three-dimensional integration of semiconductor devices. Liquid phase epitaxy (LPE) has proved to be a powerful technique to grow high quality SOI structures for devices and for basic physical research. Electron microscopy is indispensable for the development of the growth technique and reveals many interesting structural properties of these materials. Transmission and scanning electron microscopy can be applied to study growth mechanisms, structural defects, and the morphology of Si and SOI layers grown from metallic solutions of various compositions.The treatment of the Si substrates prior to the epitaxial growth described here is wet chemical etching and plasma etching with NF3 ions. At a sample temperature of 20°C the ion etched surface appeared rough (Fig. 1). Plasma etching at a sample temperature of −125°C, however, yields smooth and clean Si surfaces, and, in addition, high anisotropy (small side etching) and selectivity (low etch rate of SiO2) as shown in Fig. 2.


1988 ◽  
Vol 53 (13) ◽  
pp. 1201-1203 ◽  
Author(s):  
Shiro Sakai ◽  
Shi S. Chang ◽  
Ramu V. Ramaswamy ◽  
Jae‐Hoon Kim ◽  
Gouri Radhakrishnan ◽  
...  

1990 ◽  
Vol 68 (5) ◽  
pp. 2158-2163 ◽  
Author(s):  
P. O. Hansson ◽  
J. H. Werner ◽  
L. Tapfer ◽  
L. P. Tilly ◽  
E. Bauser

2008 ◽  
Vol 43 (12) ◽  
pp. 1278-1285 ◽  
Author(s):  
Th. Teubner ◽  
U. Jendritzki ◽  
K. Böttcher ◽  
G. Schadow ◽  
R. Heimburger ◽  
...  

1993 ◽  
Vol 317 ◽  
Author(s):  
F. Banhart ◽  
N. Nagel ◽  
F. Phillipp ◽  
E. Bauser

ABSTRACTDefect-free coalescence of Si layers which grow laterally over partially oxidized Si substrates is achieved in liquid phase epitaxy from indium solution. An adequate design of the oxide pattern on (111) substrates ascertains that the growth fronts of the Si layers merge gradually on the SiO2 and avoids the formation of inclusions or crystallographic defects. Electron Microscopy in diffraction contrast and convergent beam electron diffraction reveal that the epitaxial Si layers bend towards the substrate as they grow laterally over the SiO2 film. The layers straighten out again as they merge and form a perfect seam of coalescence.


1987 ◽  
Vol 102 ◽  
Author(s):  
M.I. Alonso ◽  
H.-P. Trah ◽  
E. Bauser ◽  
H. Cerva ◽  
H.P. Strunki

ABSTRACTSi1−zGez single crystal layers were grown on Si(iii) by liquid phase epitaxy (LPE) over the entire composition range (0 ≤ x ( 1). Using Sn as solvent all compositions were produced; alloys with compositions 0 ≤ x ≤ 0.75 were obtained using In as solvent; the range 0.75 ≤ x ≤ 1 was covered with Bi solvent. The solvents used, the composition of the solution, the saturation temperature, and the cooling rate, were found to strongly influence the growth morphology.


1997 ◽  
Vol 485 ◽  
Author(s):  
A. M. Sembian ◽  
I. Silier ◽  
K. Davies ◽  
A. Gutjahr ◽  
K. Lyutovich ◽  
...  

AbstractWe have investigated the surface morphology of thick SiGe layers grown on Si(100) substrates. SiGe layers containing different Ge concentrations (from 0 to 16 at.%) and having thickness of about 15μm are prepared by liquid phase epitaxy (LPE) method using various growth conditions. The wavelength of undulation of SiGe layers is found to be increasing when we adopt low cooling rates during LPE process. The roughness of the layer does not show any significant change with cooling rate.


2004 ◽  
Vol 84 (14) ◽  
pp. 2563-2565 ◽  
Author(s):  
Yaocheng Liu ◽  
Michael D. Deal ◽  
James D. Plummer

2015 ◽  
Vol 23 (3) ◽  
Author(s):  
I.I. Izhnin ◽  
K.D. Mynbaev ◽  
A.V. Voitsekhovsky ◽  
A.G. Korotaev ◽  
O.I. Fitsych ◽  
...  

AbstractStudies of background donor concentration (BDC) in HgCdTe samples grown with different types of technology were performed with the use of ion milling as a means of eliminating the compensating acceptors. In bulk crystals, films grown with liquid phase epitaxy and films fabricated with molecular beam epitaxy (MBE) on Si substrates, BDC of the order of ~10


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