Effect of Rapid Thermal Oxidation on Blue and Red Luminescence Bands of Porous Silicon

1994 ◽  
Vol 358 ◽  
Author(s):  
S. Sen ◽  
A. J. Kontkiewicz ◽  
A. M. Kontkiewicz ◽  
G. Nowak ◽  
J. Siejka ◽  
...  

ABSTRACTPhotoluminescence (PL) of porous silicon after rapid thermal oxidation was studied using excitation energies of 5.0 and 6.4 eV. The emission spectra in both cases are dominated by a broad blue band centered at 430-450 nm and a much weaker red band positioned at 680-720 nm. Using atomic force microscopy (AFM), we have found a correlation between blue PL intensity and increase in feature size caused by progressive oxidation. The blue luminescence, found in porous Si only after oxidation, is identical, with respect to spectrum and fast decay, to that of thermally grown oxide on crystalline Si. Based on these findings, we conclude that the blue luminescence originates from SiO2 rather than from Si nanocrystals embedded in the oxide matrix. The red luminescence, on the contrary, has a different origin. The intensity of red band is a function of oxidation temperature and at RTP above 1050 °C, the red band is completely eliminated. The red luminescence characteristics are discussed in relation to the possible mechanism.

1997 ◽  
Vol 70 (10) ◽  
pp. 1284-1286 ◽  
Author(s):  
Gu-Bo Li ◽  
Liang-Sheng Liao ◽  
Xiao-Bing Liu ◽  
Xiao-Yuan Hou ◽  
Xun Wang

1998 ◽  
Vol 1 (3-4) ◽  
pp. 281-285 ◽  
Author(s):  
L Debarge ◽  
J.P Stoquert ◽  
A Slaoui ◽  
L Stalmans ◽  
J Poortmans

2002 ◽  
Vol 43 (11) ◽  
pp. 2832-2837 ◽  
Author(s):  
Toshimasa Wadayama ◽  
Tuyoshi Arigane ◽  
Kensho Hayamizu ◽  
Aritada Hatta

1995 ◽  
Vol 255 (1-2) ◽  
pp. 224-227 ◽  
Author(s):  
Walter Lang ◽  
Peter Steiner ◽  
Frank Kozlowski ◽  
Peter Ramm

1996 ◽  
Vol 429 ◽  
Author(s):  
G. A. Hames ◽  
S. E. Beck ◽  
A. G. Gilicinski ◽  
W. K. Henson ◽  
J. J. Wortman

AbstractThe influence of HCl on the quality of gate oxides grown by rapid thermal oxidation has been investigated. HCl was added to oxidation ambient for some rapid thermal oxides while for others the silicon surface was annealed in a partial HCl ambient prior to rapid thermal oxidation. Improvements in gate oxide integrity were monitored on MOS capacitors and MOSFET devices by I-V and C-V testing. The levels of chlorine incorporated in the oxide from the addition of HCl to the process was measured by secondary ion mass spectroscopy. Atomic force microscopy was performed to measure surface roughening during HCl pre-oxidation treatments.


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