Boron Doping using Proximity Rapid Thermal Diffusion from Spin-on-Dopants

1994 ◽  
Vol 342 ◽  
Author(s):  
M. Rastogi ◽  
W. Zagozdzon-Wosik ◽  
F. Romero-Borja ◽  
J. M. Heddleson ◽  
R. Beavers ◽  
...  
Keyword(s):  
Thermal Diffusion ◽  
Process Variables ◽  
Dopant Incorporation ◽  
Boron Doped ◽  
Doping Technique ◽  
Rapid Thermal Diffusion ◽  
P Type ◽  
Temperature Time ◽  
Secondary Ion ◽  
Dopant Source

ABSTRACTProximity rapid thermal diffusion (RTD) has been investigated as a doping technique for p-type boron doped junctions. The efficiency of RTD has been studied as a function of process variables (temperature, time, and ambient) and evaluated based on sheet resistance measurements, secondary ion mass spectroscopy (SIMS), spreading resistance (SR), and Fourier transmission infrared absorption (FTIR) in a spin-on-dopant source (SOD). The doping efficiency in source wafers is controlled by different mechanism than in processed wafers. Strong influence of dopant incorporation in the processed wafers on oxygen content in the diffusion ambient is observed especially at low diffusion temperatures.

A Comparison of Magnesium and Beryllium Acceptors in GaN Grown by rf-Plasma Assisted Molecular Beam Epitaxy

2000 ◽  
Vol 639 ◽  
Author(s):  
A.J. Ptak ◽  
T.H. Myers ◽  
Lijun Wang ◽  
N.C. Giles ◽  
M. Moldovan ◽  
...  
Keyword(s):  
Atomic Hydrogen ◽  
Molecular Beam ◽  
Surface Segregation ◽  
Secondary Ion Mass Spectrometry ◽  
Rf Plasma ◽  
Dopant Incorporation ◽  
Optical Activation ◽  
P Type ◽  
Kinetics Of ◽  
Secondary Ion

ABSTRACTStep-doped structures of both magnesium and beryllium were grown in GaN and analyzed using secondary ion mass spectrometry. Dopant incorporation was studied as a function of substrate temperature and dopant flux for Ga-polarity and N-polarity GaN. Incorporation is different for each polarity, with Mg incorporating by up to a factor of 20 times more (30 times more with atomic hydrogen) on the Ga-face, while Be incorporates more readily on the N-face. The effect of atomic hydrogen on the incorporation kinetics of both Mg and Be is also discussed. Mg and Be both undergo surface segregation during growth. Photoluminescence measurements suggest that Be is a p-type dopant with an optical activation energy of approximately 100 meV.

scholarly journals Dopant Incorporation Efficiency in CVD Silicon Carbide Epilayers

1995 ◽  
Vol 410 ◽  
Author(s):  
D. J. Larkin
Keyword(s):  
Secondary Ion Mass Spectrometry ◽  
Semiconductor Device ◽  
Dopant Concentration ◽  
Competition Effect ◽  
Dopant Incorporation ◽  
The Many ◽  
Site Competition ◽  
Secondary Ion ◽  
Dopant Source ◽  
Incorporation Efficiency

ABSTRACTIn order to ensure reproducible and reliable SiC semiconductor device characteristics, controlled dopant incorporation must be accomplished. Some of the many factors which greatly influence dopant incorporation are the site-competition effect, SiC(0001) substrate polarity, substrate temperature, and the dopant-source reactor concentration. In this paper, dopant incorporation is considered and compared for various dopants in the context of dopant incorporation efficiency. By using secondary ion mass spectrometry (SIMS), the relative dopant incorporation efficiencies were calculated by dividing the SIMS determined dopant concentration in the resulting epitaxial layer by the intentional gas phase dopant concentration used during the SiC CVD. Specifically, the relative magnitudes of dopant incorporation efficiencies for nitrogen, phosphorus, and boron in 6H-SiC (0001) Si-face epitaxial layers are compared as a function of the site-competition effect and the dopant-source reactor concentrations. This serves as a first approximation for comparison of the relative “doping potencies” of some common dopants used in SiC CVD epitaxial growth.

Activation of Implanted Poly Gates by Short Cycle Time Annealing

2000 ◽  
Vol 610 ◽  
Author(s):  
A. T. Fiory ◽  
K. K. Bourdelle
Keyword(s):  
Chemical Vapor ◽  
Maximum Temperature ◽  
Flat Band ◽  
Flat Band Voltage ◽  
Thermal Oxide ◽  
Van Der Pauw ◽  
P Type ◽  
Temperature Time ◽  
And Diffusion ◽  
Secondary Ion

AbstractAmorphous silicon films with B, P, and As implants were activated with thermal anneals that include spiking to the maximum temperature. Films were grown over thermal oxide by chemical vapor deposition as two separately implanted 50-nm layers for manipulating dopant placement and diffusion. Electrical activation was determined by Hall van der Pauw and MOS C-V, and dopant diffusion was profiled by secondary ion mass spectroscopy (SIMS). Flat-band voltage was used to benchmark relative thermal budgets for p-type poly. Temperature-time relationships are used to deduce effective activation energies.

Investigation of Proximity Rtd for Submicron Junctions in Vlsi Si Devices

1993 ◽  
Vol 303 ◽  
Author(s):  
W. Zagozdzon-Wosik ◽  
P. Grabiec ◽  
F. Romero-Borja ◽  
L. T. Wood ◽  
G. Lux
Keyword(s):  
Sheet Resistance ◽  
Thermal Diffusion ◽  
Mass Spectroscopy ◽  
Secondary Ion Mass Spectroscopy ◽  
Si Doping ◽  
Shallow Junctions ◽  
Rapid Thermal Diffusion ◽  
Kinetics Of ◽  
Secondary Ion

ABSTRACTProximity rapid thermal diffusion is presented as a doping process for fabrication of very shallow junctions. The kinetics of Si doping with B, P and As is investigated using sheet resistance measurements, secondary ion mass spectroscopy and FTIR analyses. The efficiency of doping is affected by the dopant transport in the SOD which depends on the structure and composition of the SOD.

Rapid Thermal Diffusion of Zinc In GaAs

1987 ◽  
Vol 92 ◽  
Author(s):  
T.S. Kalkur ◽  
Y.C. Lu ◽  
C.A. Paz de Araujo
Keyword(s):  
Thermal Diffusion ◽  
Ohmic Contacts ◽  
Low Voltage ◽  
Hole Concentration ◽  
Silica Film ◽  
Transmission Line Method ◽  
Van Der Pauw ◽  
Rapid Thermal Diffusion ◽  
Secondary Ion ◽  
Voltage Scanning

ABSTRACTRapid thermal diffusion of zinc into semi-insulating GaAs from spin-on zinc silica film is investigated. The rapid thermal diffusion is performed for various diffusion times (5 to 25 sec) and temperatures (800° to 950° C) with tungstenhalogen lamps as the heat source. The sheet resistivity, surface hole concentration and mobility of these zinc diffused layers as measured by Van der Pauw technique shows the formation of shallow p+ layer. The surface morphology of these diffused layers are observed in a low voltage Scanning Electron Microscope (SEM) and the depth profile of diffused impurities are determined by Secondary Ion Mass Spectroscopy (SIMS). Nonalloyed ohmic contacts are formed on these zinc diffused layers and the contact resistivity is determined by the Transmission Line Method (TLM).

P-type polycrystalline diamond layers by rapid thermal diffusion of boron

2000 ◽  
Vol 76 (7) ◽  
pp. 849-851 ◽  
Author(s):  
Oleh B. Krutko ◽  
Peter B. Kosel ◽  
R. L. C. Wu ◽  
S. J. Fries-Carr ◽  
S. Heidger ◽  
...  
Keyword(s):  
Thermal Diffusion ◽  
Polycrystalline Diamond ◽  
Rapid Thermal Diffusion ◽  
P Type

The Effect of Doping Concentration and Conductivity Type on Preferential Etching of 4H-SiC by Molten KOH

2004 ◽  
Vol 815 ◽  
Author(s):  
Ying Gao ◽  
Zehong Zhang ◽  
Robert Bondokov ◽  
Stanislav Soloviev ◽  
Tangali Sudarshan
Keyword(s):  
Thermal Diffusion ◽  
Basal Plane ◽  
Doping Concentration ◽  
Structural Defects ◽  
Etch Pits ◽  
Conductivity Type ◽  
Isotropic Etching ◽  
Electrochemical Processes ◽  
P Type ◽  
Koh Etching

AbstractMolten KOH etchings were implemented to delineate structural defects in the n- and ptype 4H-SiC samples with different doping concentrations. It was observed that the etch preference is significantly influenced by both the doping concentrations and the conductivity types. The p-type Si-face 4H-SiC substrate has the most preferential etching property, while it is least for n+ samples. It has been clearly demonstrated that the molten KOH etching process involves both chemical and electrochemical processes, during which isotropic etching and preferential etching are competitive. The n+ 4H-SiC substrate was overcompensated via thermal diffusion of boron to p-type and followed by molten KOH etching. Three kinds of etch pits corresponding to threading screw, threading edge, and basal plane dislocations are distinguishably revealed. The same approach was also successfully employed in delineating structural defects in (0001) C-face SiC wafers.

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