Oxygen Effect in Diamond Deposition at Low Temperatures

1989 ◽  
Vol 162 ◽  
Author(s):  
Y. Liou ◽  
A. Inspektor ◽  
R. Weimer ◽  
D. Knight ◽  
R. Messier

ABSTRACTDiamond thin films were deposited on different substrates at low temperatures (lowest temperature∼ 300°C, estimated) in a microwave plasma enhanced chemical vapor deposition (MPCVD) system. The deposited films were amorphous carbon or diamond films depending on the different gas mixtures used. The growth rate of diamond thin films was decreased by adding oxygen to the gas mixture. The addition of oxygen to the gas mixtures was found to be important for diamond growth at low temperatures. Different concentrations of oxygen have been added into the gas mixture. Without oxygen, the deposited films were white soots and easily scratched off. Increasing the oxygen input improved the quality of the Raman peaks and increased the film transpancy. The diamond films were also characterized by scanning electron microscopy (SEM).

1995 ◽  
Vol 383 ◽  
Author(s):  
R. Ramesham ◽  
R. F. Askew ◽  
M. F. Rose

ABSTRACTDiamond films were deposited by microwave plasma CVD using H2 and CH4 gas mixture over various substrate materials such as Si, Pd, Be, Cu, Mo, AIN, SiO2, Si3N4, Al2O3, Sapphire, Quartz, Ni-base alloys, single crystal Ni, boron nitride, and Ti. We have used a Z-axis pull stud test to determine adhesion strength of diamond film to some of the substrates. Our observations on the adhesion of diamond films to the above substrates are reported. A method will be described to evaluate Young's modulus of CVD diamond films using fabricated diamond cantilever beams.


1994 ◽  
Vol 339 ◽  
Author(s):  
R. Ramesham ◽  
M. F. Rose ◽  
R. F. Askew ◽  
M. Bozack

ABSTRACTMicrowave plasma has been used to grow diamond films using CH4 and H2 over nickel substrates. Nucleation of the diamond has been achieved by manual scratching and ultrasonic agitation of the substrates. The substrate was left in the H 2 microwave plasma to remove any oxide film present prior to the diamond growth. According to SEM the morphology of the grown films was (100) textured over the entire surface. Our interest is to study the effect of O2 on the growth rate and the morphology of as-deposited diamond films. Infact, O2 has a tendency to preferentially etch the diamond (etch rate: 111 > 110 >100). Injection of O2 into the reaction mixture could enhance the 100 texture further. Raman analysis confirms the deposited films as diamond. Effect of O2 on the nature of the films and the characterization of as-deposited films is described.


2016 ◽  
Vol 15 (4) ◽  
pp. 614-618 ◽  
Author(s):  
Hideyuki Watanabe ◽  
Hitoshi Umezawa ◽  
Toyofumi Ishikawa ◽  
Kazuki Kaneko ◽  
Shinichi Shikata ◽  
...  

CrystEngComm ◽  
2020 ◽  
Vol 22 (12) ◽  
pp. 2138-2146 ◽  
Author(s):  
G. Shu ◽  
V. G. Ralchenko ◽  
A. P. Bolshakov ◽  
E. V. Zavedeev ◽  
A. A. Khomich ◽  
...  

Homoepitaxial diamond growth may proceed with stops and resumptions to produce thick crystals. We found the resumption procedure to take place in a complex way, via a disturbance of step growth features, followed by the recovery after a certain time.


1998 ◽  
Vol 83 (1) ◽  
pp. 540-543 ◽  
Author(s):  
D. Zhou ◽  
T. G. McCauley ◽  
L. C. Qin ◽  
A. R. Krauss ◽  
D. M. Gruen

1995 ◽  
Vol 383 ◽  
Author(s):  
Jim Sizemore ◽  
R. J. Hohlfelder ◽  
J. J. Vlassak ◽  
W. D. Nix

ABSTRACTIt is shown that the blister testing technique can be used to measure the adhesion of thin films to their substrates. A brief discussion of blister test mechanics is presented here, leading to a simple equation relating adhesion to the height of the blister and the pressure causing it to grow. Blister test data for plasma-enhanced CVD diamond films on Si substrates have been analyzed using this relation. The tests show adhesion energies of 1.8– 2.6 J/m2.


1991 ◽  
Vol 6 (6) ◽  
pp. 1278-1286 ◽  
Author(s):  
R. Ramesham ◽  
T. Roppel ◽  
C. Ellis ◽  
D.A. Jaworske ◽  
W. Baugh

Polycrystalline diamond thin films have been deposited on single crystal silicon substrates at low temperatures (⋚ 600 °C) using a mixture of hydrogen and methane gases by high pressure microwave plasma-assisted chemical vapor deposition. Low temperature deposition has been achieved by cooling the substrate holder with nitrogen gas. For deposition at reduced substrate temperature, it has been found that nucleation of diamond will not occur unless the methane/hydrogen ratio is increased significantly from its value at higher substrate temperature. Selective deposition of polycrystalline diamond thin films has been achieved at 600 °C. Decrease in the diamond particle size and growth rate and an increase in surface smoothness have been observed with decreasing substrate temperature during the growth of thin films. As-deposited films are identified by Raman spectroscopy, and the morphology is analyzed by scanning electron microscopy.


2007 ◽  
Vol 329 ◽  
pp. 551-556
Author(s):  
Xiao Gang Jian ◽  
L.D. Shi ◽  
Ming Chen ◽  
Fang Hong Sun

Adhesion properties of diamond thin films are essential to their performance in technical applications. To obtain the adhesive strength precisely and quantitatively has been the frontier issue to the related scientists and engineers. In this paper, a new experimental equipment for blister tests was designed purposely and fabricated considering related influencing facts. A free-standing window of diamond thin film with the support of silicon wafer was obtained by the aid of photolithography and anisotropic wet etching technology so as to improve the precision of quantitative adhesion measures of diamond films. The mechanics for calculating the quantitative driving force of blister-induced delamination of diamond thin film is presented, which is on base of intensive modeling and simulation. The laser interferometer measurement with fine solution was used to pick up dynamic signals of diamond thin film bulge deformation in micrometer scale and the relationship demonstration of stress to strain of the diamond thin film was available, as a consequence, the adhesive strength could be obtained precisely and quantitatively by the valid model. The paper confirms the accessibility to precise quantitative adhesion measures of diamond films and the results will be beneficial to wide application of diamond thin films in the related fields.


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