Structural and Electronic Properties of GaAs/InGaAs/GaAs Heterostructures

1989 ◽  
Vol 160 ◽  
Author(s):  
J. M. Bonar ◽  
R. Hull ◽  
R. J. Malik ◽  
R. W. Ryan ◽  
J. F. Walker
Keyword(s):  
Misfit Dislocation ◽  
Heterojunction Bipolar Transistors ◽  
Strain Relaxation ◽  
Bipolar Transistors ◽  
Electrical Characteristics ◽  
Transmission Electron ◽  
Structural And Electronic Properties ◽  
Interfacial Dislocations ◽  
Made In

AbstractWe have made a study of GaAs/InGaAs/GaAs (001) strained layer heterostructures using Transmission Electron Microscopy (TEM) as a structural tool to determine the misfit dislocation structure and density as a function of Indium concentration. The average misfit dislocation spacing varies from > 10 µm for x < 0.3, to a few microns at x = 0.3, and drops to a few hundred Angstroms at x = 0.5. We did in-situ annealing experiments in order to study the strain relaxation process, measuring the temperature at which the structure begins to relax, and the dislocation velocities. Dislocation velocities are a few microns per second at the growth temperature of 450 ° C, and tens of microns per second at 690 ° C. In addition to interfacial dislocations in the usual <110> directions, in samples where x ≥ 0.4, we observed dislocations running in <100> directions. A study of the electrical characteristics of the material was made in parallel with the structural measurements: the mobility of the InGaAs layer was measured, the material was processed into Heterojunction Bipolar Transistors (HBT’s) and the gain was measured. The electrical characteristics initially improved with the addition of In, peaking at x = 0.1 and dropping sharply for higher x.

In situ TEM measurements of the electrical properties of interface dislocations

1992 ◽  
Vol 50 (2) ◽  
pp. 1338-1339
Author(s):  
F. M. Ross ◽  
R. Hull ◽  
D. Bahnck ◽  
J. C. Bean ◽  
L. J. Peticolas ◽  
...  
Keyword(s):  
Electrical Properties ◽  
Electronic Device ◽  
In Situ Tem ◽  
Device Performance ◽  
Misfit Dislocations ◽  
Electrical Characteristics ◽  
Strained Layer ◽  
Transmission Electron ◽  
Interfacial Dislocations

We describe an investigation of the electrical properties of interfacial dislocations in strained layer heterostructures. We have been measuring both the structural and electrical characteristics of strained layer p-n junction diodes simultaneously in a transmission electron microscope, enabling us to correlate changes in the electrical characteristics of a device with the formation of dislocations.The presence of dislocations within an electronic device is known to degrade the device performance. This degradation is of increasing significance in the design and processing of novel strained layer devices which may require layer thicknesses above the critical thickness (hc), where it is energetically favourable for the layers to relax by the formation of misfit dislocations at the strained interfaces. In order to quantify how device performance is affected when relaxation occurs we have therefore been investigating the electrical properties of dislocations at the p-n junction in Si/GeSi diodes.

Kinetic Barriers to Strain Relaxation in GexSi1-x/Si Epitaxy

1989 ◽  
Vol 160 ◽  
Author(s):  
R. Hull ◽  
J.C. Bean
Keyword(s):  
Relaxation Process ◽  
Misfit Dislocation ◽  
Strain Relaxation ◽  
Dislocation Nucleation ◽  
Transmission Electron ◽  
Structure Geometry ◽  
Si Epitaxy ◽  
Annealing Experiments ◽  
Kinetic Barriers

AbstractWe discuss the kinetic barriers to misfit dislocation nucleation, propagation and interaction in lattice-mismatched GexSi1-x/Si epitaxy. Experimental real-time observations of the strain relaxation process via in-situ annealing experiments in a transmission electron microscope enable each of these processes to be separately studied. Quantitative parameters defining misfit dislocation processes may be derived; these are found to be highly dependent upon the structure geometry. The approximations involved in extending these measurements to a description of the relaxation process during growth are described in detail.

Experimental and Theoretical Analysis of Strain Relaxation in GexSi1-x/Si(100) Heteroepitaxy

1989 ◽  
Vol 148 ◽  
Author(s):  
R. Hull ◽  
J.C. Bean
Keyword(s):  
Misfit Dislocation ◽  
Strain Relaxation ◽  
Dislocation Nucleation ◽  
Fundamental Parameters ◽  
Interaction Processes ◽  
Transmission Electron ◽  
Wide Range ◽  
Relaxation Measurements ◽  
Good Agreement

ABSTRACTBy analyzing in-situ strain relaxation measurements of GexSi1-x/Si(100) epitaxy in a Transmission Electron Microscope, we are able to quantify the fundamental parameters which describe strain energy relaxation via misfit dislocation introduction. Quantitative descriptions of misfit dislocation nucleation, propagation and interaction processes are derived. The numerical parameters obtained from these experiments are then incorporated into a predictive theoretical model of strain relaxation whichrelies only upon experimentally measured quantities. Good agreement between experiment and theory is obtained over a wide range of data.

TEM evaluation of graded SixGe1-x heterolayers

1991 ◽  
Vol 49 ◽  
pp. 894-895
Author(s):  
N. David Theodore ◽  
Mamoru Tomozane ◽  
Ming Liaw
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Gas Flow ◽  
Field Effect Transistors ◽  
Chemical Vapor ◽  
Dark Field ◽  
Bipolar Transistors ◽  
Structural Quality ◽  
Weak Beam ◽  
Transmission Electron ◽  
And Behavior

There is extensive interest in SiGe for use in heterojunction bipolar transistors. SiGe/Si superlattices are also of interest because of their potential for use in infrared detectors and field-effect transistors. The processing required for these materials is quite compatible with existing silicon technology. However, before SiGe can be used extensively for devices, there is a need to understand and then control the origin and behavior of defects in the materials. The present study was aimed at investigating the structural quality of, and the behavior of defects in, graded SiGe layers grown by chemical vapor deposition (CVD).The structures investigated in this study consisted of Si1-xGex[x=0.16]/Si1-xGex[x= 0.14, 0.13, 0.12, 0.10, 0.09, 0.07, 0.05, 0.04, 0.005, 0]/epi-Si/substrate heterolayers grown by CVD. The Si1-xGex layers were isochronally grown [t = 0.4 minutes per layer], with gas-flow rates being adjusted to control composition. Cross-section TEM specimens were prepared in the 110 geometry. These were then analyzed using two-beam bright-field, dark-field and weak-beam images. A JEOL JEM 200CX transmission electron microscope was used, operating at 200 kV.

TEM study of phosphorus-implanted pseudomorphic Si0.88Ge0.12 on Si(100)

1995 ◽  
Vol 53 ◽  
pp. 468-469
Author(s):  
N. David Theodore ◽  
Donald Y.C Lie ◽  
J. H. Song ◽  
Peter Crozier
Keyword(s):  
Integrated Circuits ◽  
Heterojunction Bipolar Transistors ◽  
Integrated Circuit ◽  
High Speed ◽  
Room Temperature ◽  
Strain Relaxation ◽  
Bipolar Transistors ◽  
Sige Hbt ◽  
Integrated Circuit Manufacturing ◽  
Microstructural Behavior

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. The material offers adjustable bandgaps, improved carrier mobilities over Si homostructures, and compatibility with Si-based integrated-circuit manufacturing. SiGe HBT performance can be improved by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however is that implantation can enhance strain-relaxation of SiGe/Si.Furthermore, once misfit or threading dislocations result, the defects can give rise to recombination-generation in depletion regions of semiconductor devices. It is of relevance therefore to study the damage and anneal behavior of implanted SiGe layers. The present study investigates the microstructural behavior of phosphorus implanted pseudomorphic metastable Si0.88Ge0.12 films on silicon, exposed to various anneals.Metastable pseudomorphic Si0.88Ge0.12 films were grown ~265 nm thick on a silicon wafer by molecular-beam epitaxy. Pieces of this wafer were then implanted at room temperature with 100 keV phosphorus ions to a dose of 1.5×1015 cm-2.

In Situ Electron Microscopy Studies of Surface Dynamical Processes

1998 ◽  
Vol 4 (S2) ◽  
pp. 608-609
Author(s):  
Ruud M. Tromp
Keyword(s):  
Electron Microscopy ◽  
Strain Relaxation ◽  
High Vacuum ◽  
Ultra High Vacuum ◽  
Relaxation Phase ◽  
Transmission Electron ◽  
In Situ Electron Microscopy ◽  
Low Energy Electron ◽  
New Machine

To obtain a full and detailed understanding of the spatiotemporal dynamics of surface processes such as epitaxial growth, strain relaxation, phase transformations and phase transitions, chemisorption and etching, in situ real-time observations have proven to be invaluable. The development of two experimental techniques, i.e. Low Energy Electron Microscopy (LEEM) typically operating at electron energies below 10 eV, and Ultra-High-Vacuum Transmission Electron Microscopy (UHV-TEM) at several 100 keV, has made such in situ studies routinely possible. In many cases, the videodata obtained from such experiments are amenable to detailed, quantitative analysis, yielding statistical, kinetic and thermodynamic information that cannot be obtained in any other way.I will discuss recent experimental developments, including the design and construction of a new and improved LEEM instrument. Figure 1 shows a schematic diagram of this new machine. There are several features that distinguishes this design from most other LEEMs. One is the use of a 90 degree deflection magnetic prism array,

Formation and Structure of Epitaxial NiSi2 and CoSi2

1981 ◽  
Vol 10 ◽  
Author(s):  
L. J. Chen ◽  
J. W. Mayer ◽  
K. N. Tu
Keyword(s):  
Thin Films ◽  
Dark Field ◽  
Dark Field Imaging ◽  
Transmission Electron ◽  
Contrast Analysis ◽  
Interfacial Dislocations ◽  
Cobalt Thin Films ◽  
Predicted Values ◽  
Field Imaging

Transmission electron microscopy has been applied to study the formation and structure of epitaxial NiSi2 and CoSi2 thin films on silicon. Bright field and dark field imaging reveal the interface planes of faceted silicides through the strain contrast, analogous to the contrast of the precipitate-matrix interface of coherent or semicoherent precipitates. Superlattice dark field imaging depicts the distribution of twin-related and epitaxial silicides in these systems. { 111 } interfaces were found to be more prominent than {001} interfaces. Twin-related silicides were observed to cover more area on the substrate silicon than epitaxial silicides did.In situ annealing of nickel and cobalt thin films on silicon provides a unique means of investigation of the transformation from polycrystalline to epitaxial silicides. The NiSi2 transformation was found to be very rapid at 820°C, whereas the CoSi2 transformation appeared to be very sluggish. Furnace annealing confirmed that only a small fraction of CoSi2 transforms to epitaxial CoSi2 after annealing at 850°C for 4h.Diffraction contrast analysis has been applied to interfacial dislocations of epitaxial NiSi2/Si and CoSi2/Si systems. The dislocations were found to be of edge type with ⅙<112> and ½<110> Burgers' vectors. The average spacings are close to their respective theoretically predicted values.

In situ transmission electron microscope study of interface sliding and migration in an ultrafine lamellar structure

2006 ◽  
Vol 21 (10) ◽  
pp. 2453-2459 ◽  
Author(s):  
L.M. Hsiung ◽  
J. Zhou ◽  
T.G. Nieh
Keyword(s):  
Electron Microscope ◽  
Transmission Electron Microscope ◽  
Lamellar Structure ◽  
Cooperative Movement ◽  
Transmission Electron ◽  
Transmission Electron Microscope Study ◽  
Interfacial Dislocations ◽  
And Migration ◽  
Interface Sliding

The instability of interfaces in an ultrafine TiAl-(γ)/Ti3Al-(α2) lamellar structure by straining at room temperature has been investigated using in situ straining techniques performed in a transmission electron microscope. The purpose of this study was to obtain experimental evidence to support the creep mechanisms based upon the interface sliding in association with a cooperative movement of interfacial dislocations, which was proposed previously to rationalize a nearly linear creep behavior of ultrafine lamellar TiAl alloys. The results reveal that the sliding and migration of lamellar interfaces can take place simultaneously as a result of the cooperative movement of interfacial dislocations, which can lead to an adverse effect in the performance of ultrafine lamellar TiAl alloy.

Technology and First Electrical Characteristics of Complementary NPN and PNP InAlAs/InGaAs Heterojunction Bipolar Transistors

2002 ◽  
Vol 41 (Part 1, No. 2B) ◽  
pp. 1124-1130 ◽  
Author(s):  
Delong Cui ◽  
Dimitris Pavlidis ◽  
Donald Sawdai ◽  
Patrick Chin ◽  
Tom Block
Keyword(s):  
Heterojunction Bipolar Transistors ◽  
Bipolar Transistors ◽  
Electrical Characteristics

Implant-induced strain-relaxation in SiGe/Si layers

1993 ◽  
Vol 51 ◽  
pp. 1112-1113
Author(s):  
N. David Theodore ◽  
Gordon Tam
Keyword(s):  
Integrated Circuits ◽  
Heterojunction Bipolar Transistors ◽  
High Speed ◽  
High Performance ◽  
Strain Relaxation ◽  
Base Material ◽  
Sige Layer ◽  
Bipolar Transistors ◽  
Leakage Currents ◽  
Extrinsic Base

SiGe is being extensively investigated for use in heterojunction bipolar-transistors (HBT) and high-speed integrated circuits. SiGe is typically used as an epitaxial base material in HBTs. To obtain extremely high-performance bipolar-transistors it is necessary to reduce the extrinsic base-resistance. This can be done by increasing the base-doping or by widening the base link-region by ion implantation. A problem that arises however with the use of implantation is that blanket implants have been found to enhance strain-relaxation of SiGe/Si. Strain relaxation will cause the bandgap-difference between Si and SiGe to decrease; this difference is maximum for a strained SiGe layer. The electrical benefits of using SiGe/Si arise largely from the presence of a significant bandgap-difference across the SiGe/Si interface. Strain relaxation reduces this benefit. Furthermore, once misfit or threading dislocations result (during strain-relaxation), the defects can give rise to recombination-generation in depletion regions of the device; high electrical leakage currents result.

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