Uv Excimer Laser Induced Prenucleation of Surfaces from Spin-on Films Followed by Electroless Metallization

1988 ◽  
Vol 131 ◽  
Author(s):  
Hilmar Esrom ◽  
Georg Wahl ◽  
Michael Stuke
Keyword(s):  
Excimer Laser ◽  
Electroless Plating ◽  
Laser Light ◽  
Palladium Acetate ◽  
Curved Surfaces ◽  
Surface Material ◽  
Contact Metallization ◽  
Electroless Metallization ◽  
Via Holes

ABSTRACTUV excimer laser light-induced prenucleation of various surfaces from spin-on films in air is described. Good results were obtained using palladium acetate on substrate materials ranging from ceramics to polymers and even paper. Virtually any surface material can be prenucleated in this way. The Pd-prenucleated planar and curved surfaces can be metallized by a vast variety of metals using electroless plating solutions (Cu, Ni, Au, Pt, Co, Sn, and even alloys). Results are described in detail for copper from a standard electroless solution (Doduco or Shipley). Contact metallization through via holes using this process was aachieved with excellent contact properties.

Laser Assisted Seeding for Electroless Plating on Insulators

1992 ◽  
Vol 285 ◽  
Author(s):  
A.G. Schrott ◽  
B. Braren ◽  
E.J.M. O'sullivan ◽  
R.F. Saraf
Keyword(s):  
Band Gap ◽  
Excimer Laser ◽  
Deposition Rate ◽  
Electroless Plating ◽  
Repetition Rate ◽  
Laser Light ◽  
Laser Pulses ◽  
Electron Excitation ◽  
Insulating Materials

ABSTRACTExcimer laser pulses with wavelengths of 248 and 308 nm were used to selectively seed Pd on SiO2 surfaces, making them suitable for electroless plating. This novel seeding process for insulating materials is accomplished with the sample immersed in the seeding solution, and occurs only on the areas of the substrate that are illuminated (through the liquid) by the laser light. The Pd content of the seeded samples increased with the number of pulses, but was rather independent of repetition rate. The deposition rate showed a dependence with wavelength consistent with a defect driven mechanism for electron excitation through the band gap of SiO2. These electrons then reduce the Pd ions in the solution in contact with the surface.

Circular and rectangular via holes formed in SiC via using ArF based UV excimer laser

2011 ◽  
Vol 257 (6) ◽  
pp. 2303-2307 ◽  
Author(s):  
L. Liu ◽  
C.Y. Chang ◽  
Wenhsing Wu ◽  
S.J. Pearton ◽  
F. Ren
Keyword(s):  
Excimer Laser ◽  
Via Holes

Annealing effects of low pressure mercury and excimer laser light on degraded a-Si:H TFTs

1993 ◽  
Vol 164-166 ◽  
pp. 763-766 ◽  
Author(s):  
S.K. Lee ◽  
C.H. Oh ◽  
Y.S. Kim ◽  
J.S. Park ◽  
Y.I. Choi ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Laser Light ◽  
Low Pressure ◽  
Annealing Effects

scholarly journals Delivery of F2-excimer laser light by aluminum hollow fibers

2000 ◽  
Vol 6 (13) ◽  
pp. 257 ◽  
Author(s):  
Yuji Matsuura ◽  
Takashi Yamamoto ◽  
Mitsunobu Miyagi
Keyword(s):  
Excimer Laser ◽  
Laser Light ◽  
Hollow Fibers

Rayleigh and predissociative fluorescence imaging of total and quantum state-specific densities from a combustion bomb using tunable excimer laser light

1993 ◽  
Author(s):  
Gyungsoo Kim ◽  
Hongjie An ◽  
Erhard W. Rothe ◽  
Lynne M. Hitchcock ◽  
Youngwei Gu ◽  
...  
Keyword(s):  
Fluorescence Imaging ◽  
Excimer Laser ◽  
Quantum State ◽  
Laser Light

Circuit Pattern cu Deposition on Polyimide Surface Using ArF Excimer Laser

1998 ◽  
Vol 546 ◽  
Author(s):  
M. Tomita ◽  
M. Murahara
Keyword(s):  
Thin Film ◽  
Aqueous Solution ◽  
Excimer Laser ◽  
Copper Sulfate ◽  
Electroless Plating ◽  
Atmospheric Pressure ◽  
Hydrogen Atoms ◽  
Arf Excimer Laser ◽  
Cu Thin Film ◽  
Copper Substitution

AbstractCircuit patterned nucleation of copper atoms onto polyimide surface was demonstrated by using ArF excimer laser (λ =193nm) and copper sulfate aqueous solution at an atmospheric pressure. Photo-excited C-H bonds of the polyimide surface were effectively dehydrated with hydrogen atoms which were photodissociated from the water. The dangling bonds of the dehydrated hydrogen atoms were combined with the oxygen and the copper atoms which were photodissociated by copper-sulfate aqueous solution. Thus, C-O-Cu bonds were formed on the surface. After this copper substitution, it was carried out onto the nucleated parts by usual electroless plating at 70°C. In this process, the conductive circuit pattern Cu thin film was deposited on polyimide surface.

Uv Excimer Laser-Induced Deposition of Palladium from Palladium Acetate Films

1989 ◽  
Vol 158 ◽  
Author(s):  
Hilmar Esrom ◽  
Georg Wahl
Keyword(s):  
Simple Model ◽  
Aluminum Oxide ◽  
Excimer Laser ◽  
Pulse Energy ◽  
Laser Pulses ◽  
Palladium Acetate ◽  
Induced Decomposition ◽  
Quartz Substrates ◽  
Exposure Process

ABSTRACTUV excimer laser-induced deposition of palladium from spin coated palladium acetate films in air is described. We have investigated mainly the deposition of palladium on aluminum oxide and quartz substrates and its dependence on the fluence and the number of excimer laser pulses. The decomposition mechanism was studied by measuring in situ the transmitted pulse energy during the exposure process. We have found that the excimer laser-induced decomposition of palladium acetate films is mainly pyrolytic and a simple model can be used to describe the decomposition process.

scholarly journals “Artificial” chirality induced in doped polymer by irradiation with circularly polarized excimer laser light

2015 ◽  
Vol 5 (12) ◽  
pp. 2761 ◽  
Author(s):  
Y. Kalachyova ◽  
O. Lyutakov ◽  
I. Goncharova ◽  
V. Svorcik
Keyword(s):  
Excimer Laser ◽  
Laser Light ◽  
Circularly Polarized ◽  
Doped Polymer
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