Circuit Pattern cu Deposition on Polyimide Surface Using ArF Excimer Laser

Circuit patterned nucleation of copper atoms onto polyimide surface was demonstrated by using ArF excimer laser (λ =193nm) and copper sulfate aqueous solution at an atmospheric pressure. Photo-excited C-H bonds of the polyimide surface were effectively dehydrated with hydrogen atoms which were photodissociated from the water. The dangling bonds of the dehydrated hydrogen atoms were combined with the oxygen and the copper atoms which were photodissociated by copper-sulfate aqueous solution. Thus, C-O-Cu bonds were formed on the surface. After this copper substitution, it was carried out onto the nucleated parts by usual electroless plating at 70°C. In this process, the conductive circuit pattern Cu thin film was deposited on polyimide surface.