cu thin film
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2021 ◽  
Vol 96 (5) ◽  
pp. 055706
Author(s):  
Songyou Lian ◽  
Congkang Xu ◽  
Jiangyong Wang ◽  
Hendrik C Swart ◽  
Jacobus J Terblans

2020 ◽  
Vol 399 ◽  
pp. 126139 ◽  
Author(s):  
Stanislav Haviar ◽  
Tomáš Kozák ◽  
Michael Meindlhumer ◽  
Michal Zítek ◽  
Kateřina Opatová ◽  
...  
Keyword(s):  

2020 ◽  
Vol 92 (18) ◽  
pp. 12518-12527 ◽  
Author(s):  
Agnieszka Priebe ◽  
Jean-Paul Barnes ◽  
Thomas Edward James Edwards ◽  
Emese Huszár ◽  
Laszlo Pethö ◽  
...  

2020 ◽  
Vol 272 ◽  
pp. 127843 ◽  
Author(s):  
Jian Hui ◽  
Hengrui Zhang ◽  
Qingyun Hu ◽  
Zhan Zhang ◽  
Yang Ren ◽  
...  
Keyword(s):  
X Ray ◽  

2020 ◽  
Vol 13 (03) ◽  
pp. 2051012
Author(s):  
Alina Uusiku ◽  
Hiroki Nagai ◽  
Mitsunobu Sato

A conductive Cu thin film with a thickness of 170[Formula: see text]nm, electrical resistivity of 8.9(2) [Formula: see text][Formula: see text]cm and adhesion strength of 12(7) MPa was fabricated at 180∘C in air. The spray solutions were prepared by electrolyzing Cu electrodes in an aqueous solution of ammonium formate, and then by adding ethylenediamine-N, N, N[Formula: see text], N[Formula: see text]-tetraacetic acid (EDTA). The surface morphology image of resultant Cu thin film, observed by a field emission scanning electron microscope, revealed Cu grains with particle sizes of ca. [Formula: see text][Formula: see text]nm. It was indicated that the Cu complex containing EDTA ligand in the spray solution plays important roles to (1) provide enough amount of carbon atoms as a reducing agent for phase transition of its coordinated Cu[Formula: see text] to crystalline Cu0 and (2) prevent the product from oxidation under atmospheric O2 during spray coating.


2020 ◽  
Vol 698 ◽  
pp. 137853
Author(s):  
H. Mes-adi ◽  
Y. Lachtioui ◽  
K. Saadouni ◽  
M. Mazroui

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