Materials and Processes for High Functionality Hybrid Circuit Packages

1987 ◽  
Vol 108 ◽  
Author(s):  
Donald Jaffe
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Polymeric Materials ◽  
Ceramic Substrates ◽  
Thin Film Technology ◽  
Hybrid Circuit ◽  
Thick Film Technology

ABSTRACTMaterials and processes used for high functionality hybrid circuit packages based on ceramic substrates are described. Emphasis is on hybrid circuits used for telecommunications and related applications. Examples include packages utilizing thin film technology, thick film technology and combinations of the two technologies. Various thick and thin multilayer approaches to achieve high interconnection density are discussed. These employ a variety of metal conducting systems in conjunction with glasses and/or polymeric materials as dielectric insulating layers.

Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substrates

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000053-000057
Author(s):  
Jaroslaw Kita ◽  
Sven Wiegärtner ◽  
Alistair Prince ◽  
Peter Weigand ◽  
Ralf Moos
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Screen Printing ◽  
Temperature Sensors ◽  
Electrical Characteristics ◽  
Buried Structures ◽  
Ceramic Substrates ◽  
Temperature Characteristics ◽  
Film Type ◽  
Thick Film Technology

Abstract The application of thermocouples as temperature sensors has been well known and has already been established for many years. However, for classical thick-film technology using screen-printing and firing, no standardized solutions exist. The here-presented newly developed PtRh thick-film compositions (90% Pt,10% Rh) allows to construct thick-film type S thermocouples (Pt/PtRh), following the IEC temperature characteristics. They can be fired in air, and therefore can be easily integrated into existing thick-film components and devices. In an earlier study, the new Pt-Rh composition was successfully tested on alumina substrates. Their electrical characteristics is equal with classical wire type S thermocouples. This study continues the investigations of thick-film thermocouples. We tested the newly developed pastes for high temperature applications on alumina substrates and evaluated the application of the new screen-printable type S thermocouples on LTCC ceramics. Three possible configurations were investigated: deposited on already fired LTCC substrates (post-fired), screen-printed and co-fired with LTCC tapes on the top surface as well as as buried structures. The paper presents the results of our evaluation and discusses further possible applications.

scholarly journals A Study on Effect of Line Width, Composition and Firing Temperature on the Microstripline Properties

2000 ◽  
Vol 23 (3) ◽  
pp. 163-173 ◽  
Author(s):  
Sunit Rane ◽  
Vijaya Puri
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Line Width ◽  
Firing Temperature ◽  
Thick Films ◽  
Alumina Substrate ◽  
Thin Film Technology ◽  
Binder Composition ◽  
Cu Thin Film ◽  
Ku Band

The transmittance and reflectance of microstriplines of different widths, fabricated by thick film and thin film technology are studied in the X and Ku band (8–18 GHz). The fritless thick film Ag pastes with different binder composition was formulated indigenously and screen-printed the microstriplines on alumina substrate. These microstriplines were compared with the microstriplines made from ESL (USA) pastes and also Cu thin film circuits. The effect of line width, composition and firing temperature on the thick film microstriplines was investigated. The transmittance of all the indigenously prepared Ag thick film paste compared well with microstriplines prepared with ESL pastes. All these thick film pastes gave good transmittance upto 18.0 GHz. The results indicate firing at 700℃ gives best films, and also 18 mil or 20-mil line width is more suitable than conventional 25-mil line width if thick films are used for metallization upto 18.0 GHz.

scholarly journals New Thick-Film Microwave Elements for Microwave Integrated Circuits

1983 ◽  
Vol 11 (1) ◽  
pp. 1-20 ◽  
Author(s):  
Janusz J. Gondek ◽  
Marek A. Wójcicki ◽  
Jan Cąber
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
Mathematical Models ◽  
Thick Film ◽  
Technological Process ◽  
Operating Conditions ◽  
Microwave Integrated Circuits ◽  
Thin Film Technology ◽  
Strip Lines ◽  
Constituent Elements

The realisation of microwave integrated circuits consisting of numerous elements and components, both passive and active, takes place in steps. Initially, experimental constituent elements are designed and constructed, and only after it is found that they satisfy the operating conditions, can they be integrated into a sub-system. As a result of this we obtain complicated Microwave Integrated Circuits (MICs). Initially however one has to construct basic MIC elements such as: resonators, filters, couplings, Y branch joints, circulators, etc. During research over several years carried out at the Microelectronics Department, Institute of Electronics, of the Mining and Metallurgical University of Kraków and devoted to the application of thick-film technology to MIC, the authors have devised and constructed several microwave elements using strip-lines and this paper reports of the results of their studies.Pastes produced by DU PONT/USA were used. New mathematical models for designing thick-film microwave elements have been elaborated using computer techniques. These programmes have differed from analogous ones for MIC realized by thin-film technology can be adapted, after certain modifications, to the realisation of MIC. The authors have introduced new technological operations, not used so far, to the technological process. This has made possible the production of thick-film microwave elements with parameters comparable to those obtained in thin-film technology.

scholarly journals Enamelled Steel Substrates for Printed Circuits

1983 ◽  
Vol 10 (2-3) ◽  
pp. 177-183
Author(s):  
R. Kužel ◽  
J. Broukal
Keyword(s):  
Thick Film ◽  
Firing Temperature ◽  
Ceramic Coatings ◽  
Basic Material ◽  
Ceramic Substrates ◽  
Printed Circuits ◽  
Steel Substrates ◽  
Thick Film Technology ◽  
Thermally Treated

The preparation of steel substrates coated with intermediate ground and final ceramic coatings is described. The basic material for the preparation of both coatings is the same kind of special glass. The coatings were thermally treated up to 960℃. The resulting substrates were tested for the usage in thick film technology by applying ruthenium resistor compositions designed for use on ceramic substrates. The resistors were fired up to 900℃ and their resistance and TCR were measured. They showed almost the same dependence on firing temperature as the resistors printed on alumina substrates. The TCR was only shifted towards more positive values.

scholarly journals Hybrid Realisation of High Precision Analog Conversion Modules

1978 ◽  
Vol 5 (1) ◽  
pp. 49-53 ◽  
Author(s):  
L. Kun
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
High Precision ◽  
High Stability ◽  
Frequency Converter ◽  
Active Components ◽  
Thin Film Technology ◽  
Manufacturing Methods ◽  
Optimum Cost ◽  
Stability And Accuracy

High precision analog modules are manufactured using film technologies. Components which are critical as regards operation and stability are made by thin film technology, additional elements and interconnection of active components are made using thick film technology.Using these two separate manufacturing methods to obtain high stability and accuracy, optimum cost and yield can be achieved. To illustrate these facts, two circuits are discussed in detail, a voltage to frequency converter and a log amplifier.

scholarly journals Hybrid Electronic Watt-Hour Meter

1980 ◽  
Vol 6 (3-4) ◽  
pp. 173-175
Author(s):  
J. Trontelj ◽  
L. Trontelj ◽  
F. Jan ◽  
M. Hrovat
Keyword(s):  
Thin Film ◽  
Modulation Frequency ◽  
Thin Film Technology ◽  
Offset Voltage ◽  
Hybrid Technologies ◽  
Hybrid Circuit

An electronic watt–hour meter in hybrid thick and thin film technology is described. Benefits of combined hybrid technologies are evaluated. Methods for offset voltage and multiplier modulation frequency are given. The hybrid circuit with the 10−5linearity for a 0.1 class electricity meter is shown.

Additive thin film technology for hybrid circuit fabrication

1985 ◽  
Vol 3 (6) ◽  
pp. 2704-2707 ◽  
Author(s):  
H.‐J. Krokoszinski ◽  
H. Oetzmann ◽  
H. Gernoth ◽  
C. Schmidt
Keyword(s):  
Thin Film ◽  
Thin Film Technology ◽  
Circuit Fabrication ◽  
Hybrid Circuit
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