scholarly journals Enamelled Steel Substrates for Printed Circuits

1983 ◽  
Vol 10 (2-3) ◽  
pp. 177-183
Author(s):  
R. Kužel ◽  
J. Broukal
Keyword(s):  
Thick Film ◽  
Firing Temperature ◽  
Ceramic Coatings ◽  
Basic Material ◽  
Ceramic Substrates ◽  
Printed Circuits ◽  
Steel Substrates ◽  
Thick Film Technology ◽  
Thermally Treated

The preparation of steel substrates coated with intermediate ground and final ceramic coatings is described. The basic material for the preparation of both coatings is the same kind of special glass. The coatings were thermally treated up to 960℃. The resulting substrates were tested for the usage in thick film technology by applying ruthenium resistor compositions designed for use on ceramic substrates. The resistors were fired up to 900℃ and their resistance and TCR were measured. They showed almost the same dependence on firing temperature as the resistors printed on alumina substrates. The TCR was only shifted towards more positive values.

Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substrates

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000053-000057
Author(s):  
Jaroslaw Kita ◽  
Sven Wiegärtner ◽  
Alistair Prince ◽  
Peter Weigand ◽  
Ralf Moos
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Screen Printing ◽  
Temperature Sensors ◽  
Electrical Characteristics ◽  
Buried Structures ◽  
Ceramic Substrates ◽  
Temperature Characteristics ◽  
Film Type ◽  
Thick Film Technology

Abstract The application of thermocouples as temperature sensors has been well known and has already been established for many years. However, for classical thick-film technology using screen-printing and firing, no standardized solutions exist. The here-presented newly developed PtRh thick-film compositions (90% Pt,10% Rh) allows to construct thick-film type S thermocouples (Pt/PtRh), following the IEC temperature characteristics. They can be fired in air, and therefore can be easily integrated into existing thick-film components and devices. In an earlier study, the new Pt-Rh composition was successfully tested on alumina substrates. Their electrical characteristics is equal with classical wire type S thermocouples. This study continues the investigations of thick-film thermocouples. We tested the newly developed pastes for high temperature applications on alumina substrates and evaluated the application of the new screen-printable type S thermocouples on LTCC ceramics. Three possible configurations were investigated: deposited on already fired LTCC substrates (post-fired), screen-printed and co-fired with LTCC tapes on the top surface as well as as buried structures. The paper presents the results of our evaluation and discusses further possible applications.

Materials and Processes for High Functionality Hybrid Circuit Packages

1987 ◽  
Vol 108 ◽  
Author(s):  
Donald Jaffe
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Polymeric Materials ◽  
Ceramic Substrates ◽  
Thin Film Technology ◽  
Hybrid Circuit ◽  
Thick Film Technology

ABSTRACTMaterials and processes used for high functionality hybrid circuit packages based on ceramic substrates are described. Emphasis is on hybrid circuits used for telecommunications and related applications. Examples include packages utilizing thin film technology, thick film technology and combinations of the two technologies. Various thick and thin multilayer approaches to achieve high interconnection density are discussed. These employ a variety of metal conducting systems in conjunction with glasses and/or polymeric materials as dielectric insulating layers.

scholarly journals Ceramic on Metal Substrates Produced by Plasma Spraying for Thick Film Technology

1983 ◽  
Vol 10 (2-3) ◽  
pp. 143-150 ◽  
Author(s):  
Leszek Gołonka ◽  
Lech Pawłowski
Keyword(s):  
Stainless Steel ◽  
Thick Film ◽  
Plasma Spraying ◽  
Ceramic Coatings ◽  
Pure Alumina ◽  
Film Conductor ◽  
Steel Substrates ◽  
Resistance Stability ◽  
Sprayed Coatings ◽  
Plasma Spraying Process

The arc plasma spraying process was applied to obtain ceramic coatings on stainless steel substrates. The outer coatings were formed from pure alumina or alumina + 2 wt. % titania mixture. The nichrome intermediate coating was applied to increase adhesion of ceramic coating to stainless steel. The X-ray analysis, metallographic and SEM investigations of the sprayed coatings were also carried out. The effect of interaction of thick film conductor and resistor compositions was studied. Conductor ink P 202 PdAg and resistor ink DP 1321 were evaluated. The TCR, resistance stability were measured as a function of firing cycles. These parameters and the resistivity of sprayed alumina were compared with standard 96% alumina substrate characteristics.

Interactions between bismuth oxide and ceramic substrates for thick film technology

1998 ◽  
Vol 13 (7) ◽  
pp. 1865-1874 ◽  
Author(s):  
Simona Immovilli ◽  
Bruno Morten ◽  
Maria Prudenziati ◽  
Alessandro Gualtieri ◽  
Massimo Bersani
Keyword(s):  
Activation Energy ◽  
Reaction Time ◽  
Thick Film ◽  
Penetration Depth ◽  
Bismuth Oxide ◽  
Thick Films ◽  
Reaction Products ◽  
Ceramic Substrates ◽  
Diffusion Limited ◽  
Thick Film Technology

We investigated the interactions between screen printed and fired layers of Bi2O3 and ceramic substrates of alumina and beryllia. It was found that the reaction products are invariably crystalline in nature. Several transitions of Bi2O3 in its polymorphic phases were found to occur on BeO substrates, while newly formed compounds have been observed to grow on alumina substrates, i.e., Al4Bi2O9 on 99.9% Al2O3 and Bi12SiO20 on 96% Al2O3. Bismuth deeply penetrates in the ceramic interstices in all the cases. Until Bi2O3 is not completely reacted, this penetration is diffusion limited (penetration depth , where td is the reaction time) with values of the activation energy ranging from 3.7 ± 0.6 eV (BeO substrate) to 1.4 ± 0.06 eV (96% Al2O3 substrate). It is shown that these processes are notably different to those occurring in PbO/ceramic systems; moreover, they imply different adhesion phenomena of thick films on different substrates.

Handbook of Thick Film Technology

1976 ◽  
Vol 22 (11-12) ◽  
pp. 791
Author(s):  
R. Naylor
Keyword(s):  
Thick Film ◽  
Thick Film Technology

scholarly journals Piezoelectric Thick Film Deposition via Powder/Granule Spray in Vacuum: A Review

Actuators ◽  
2020 ◽  
Vol 9 (3) ◽  
pp. 59
Author(s):  
Deepak Rajaram Patil ◽  
Venkateswarlu Annapureddy ◽  
J. Kaarthik ◽  
Atul Thakre ◽  
Jun Akedo ◽  
...  
Keyword(s):  
Thick Film ◽  
Thick Films ◽  
Cost Effective ◽  
Aerosol Deposition ◽  
Ceramic Coatings ◽  
Film Deposition ◽  
Energy Harvesters ◽  
Ceramic Films ◽  
Dense Ceramic ◽  
Processing Techniques

Conventional thin-film processing techniques remain inadequate for obtaining superior dense ceramic thick films. The incompatibility of ceramic films prepared via other methods, such as screen printing, spin coating, and sputtering, is a major obstacle in the fabrication of thick film-based ceramic electronic components. The granule spray in vacuum (GSV) processes and aerosol deposition (AD) are important coating approaches for forming dense ceramic thick films featuring nanoscale crystallite structures at room temperature, which offer excellent material properties and facilitate cost-effective production. AD ceramic coatings require the acceleration of solid-state submicron ceramic particles via gas streams with a velocity of a few hundred meters per second, which are then wedged onto a substrate. This process is economical and particularly useful for the fabrication of piezoelectric thick film-based microactuators, energy harvesters, sensors, and optoelectronic devices. More recently, the GSV technique was improved to achieve more uniform and homogeneous film deposition after AD. This review article presents a detailed overview of the AD and GSV processes for piezoelectric thick films in terms of recent scientific and technological applications.

Sensor applications of thick-film technology

1988 ◽  
Vol 135 (4) ◽  
pp. 77 ◽  
Author(s):  
J.E. Brignell ◽  
N.M. White ◽  
A.W.J. Cranny
Keyword(s):  
Thick Film ◽  
Sensor Applications ◽  
Thick Film Technology
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