Design and analysis of a novel large-range 3-DOF compliant parallel micromanipulator

Compared with the traditional rigid mechanism, the flexible mechanism has more advantages, which play an important role in critical situations such as microsurgery, IC (integrated circuit) fabrication/detection, and some precision operating environment. Especially, there is an increasing need for 3-DOF (degrees-of-freedom) compliant translational micro-platform (CTMP) providing good performance characteristics with large motion range, low cross coupling, and high spatial density. Decoupled topology design of the CTMP can easily realize these merits without increasing the difficulty of controlling. This paper proposes a new three DOF compliant hybrid micromanipulator which have large range of motion up to 100 μm × 100 μm × 100 μm in the direction in the dimension of 90 mm × 90 mm × 50 mm, smaller cross-axis coupling (the max coupling only 2.5%) than the initial XY compliant platform in XY axial.

Duco

Human environments are filled with large open spaces that are separated by structures like walls, facades, glass windows, etc. Most often, these structures are largely passive offering little to no interactivity. In this paper, we present Duco, a large-scale electronics fabrication robot that enables room-scale & building-scale circuitry to add interactivity to vertical everyday surfaces. Duco negates the need for any human intervention by leveraging a hanging robotic system that automatically sketches multi-layered circuity to enable novel large-scale interfaces. The key idea behind Duco is that it achieves single-layer or multi-layer circuit fabrication on 2D surfaces as well as 2D cutouts that can be assembled into 3D objects by loading various functional inks (e.g., conductive, dielectric, or cleaning) to the wall-hanging drawing robot, as well as employing an optional laser cutting head as a cutting tool. Our technical evaluation shows that Duco's mechanical system works reliably on various surface materials with a wide range of roughness and surface morphologies. The system achieves superior mechanical tolerances (0.1mm XY axis resolution and 1mm smallest feature size). We demonstrate our system with five application examples, including an interactive piano, an IoT coffee maker controller, an FM energy-harvester printed on a large glass window, a human-scale touch sensor and a 3D interactive lamp.

Flexible ECG circuit fabrication and application using vinyl cutting technique

The aim of this study is to prove the capability of vinyl cutting technique to cut the conductive traces of electronic circuit layout which used a copper tape (Copper tape 1181 from 3M) on flexible substrate to replace the method of using nano-scale particle material. A wireless electrocardiography (ECG) circuit was integrated and fabricated on flexible substrate, namely a polyethylene terephthalate (PET) substrate by using vinyl cutting method to produce the conductive line traces. After that, the fabricated circuit is used for acquiring ECG signals from a patient simulator and human subjects to measure the performance differences and compatibility as a wearable device. In the data processing stage, ECG data were denoised using sym20 from Wavelet Transform tool provided by MATLAB. Then, Signal-to-noise-ratio (SNR) was calculated and used as the signal quality indicator. At the end of the study, flexible circuit performance was compared to MIT-BIH Arrhythmia database and it shows that there is no significance difference between both. In conclusion, vinyl cutting method shows a promising fabrication output on PET substrate as the performance of both flexible ECG circuit is comparable with rigid ECG circuit by a previous study.

Single EXCCII-Based Analog Multiplier Structure

A simple analog multiplier circuit employing one current-mode active building block (ABB) and two n-channel metal-oxide semiconductor (NMOS) transistors is presented in this paper. The used ABB is extra-X second generation current conveyor. The used NMOS transistors are operated in triode region. The circuit has appropriate impedance level at the input and output terminals. Some other key features of the proposed circuit are as follows: suitable to integrated circuit fabrication, good dynamic range and low operating power supplies. The nonideal effects of extra-X second generation current conveyor on the proposed circuit are studied. Additionally, the layout of the proposed circuit is developed using Cadence VIRTUOSO Analog Design Environment with gpdk 0.18[Formula: see text][Formula: see text]m technology and post layout simulation results are given to verify the theoretical aspects.

An Electronically Adjustable Waveform Generator

A novel electronically adjustable square/triangular waveform generator has been introduced in this paper. The proposed circuit employs one active element, the multi-output current-controlled current conveyor transconductance amplifier, and one passive component grounded capacitor only. The resistorless realization of the presented generator provides a good advantage in terms of integrated circuit fabrication. In the offered circuit, the frequency and amplitude of the output square wave are electronically tunable by means of relevant bias currents. Additionally, the upper and lower threshold levels are electronically controllable by the respective bias current. On the contrary, electronically adjusting of the duty cycle of output waveform is possible via the external DC current. The generator circuit is simulated with TSMC 0.18[Formula: see text][Formula: see text]m technology parameters and SPICE. Moreover, the introduced circuit is implemented by using commercially available active devices and thus it is also verified experimentally.

Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development

There is an urgent need to fulfill future energy demands for micro and nanoelectronics. This work outlines a number of important design features for carbon-based microsupercapacitors, which enhance both their performance and integration potential and are critical for complimentary metal oxide semiconductor (CMOS) compatibility. Based on these design features, we present CMOS-compatible, graphene-based microsupercapacitors that can be integrated at the back end of the line of the integrated circuit fabrication. Electrode materials and their interfaces play a crucial role for the device characteristics. As such, different carbon-based materials are discussed and the importance of careful design of current collector/electrode interfaces is emphasized. Electrode adhesion is an important factor to improve device performance and uniformity. Additionally, doping of the electrodes can greatly improve the energy density of the devices. As microsupercapacitors are engineered for targeted applications, device scaling is critically important, and we present the first steps toward general scaling trends. Last, we outline a potential future integration scheme for a complete microsystem on a chip, containing sensors, logic, power generation, power management, and power storage. Such a system would be self-powering.