Titania/Alumina Bilayer Gate Dielectrics for Ge MOS Devices: Frequency- and Temperature-Dependent Electrical Characteristics

2010 ◽  
Vol 13 (9) ◽  
pp. G79 ◽  
Author(s):  
Shankar Swaminathan ◽  
Paul C. McIntyre
1989 ◽  
Vol 146 ◽  
Author(s):  
Mehrdad M. Moslehit ◽  
Ahmad Kermani

ABSTRACTRapid thermal oxidation (RTO) of Si using transient linearly-ramped-temperature saw-toothed (LRT-ST) and triangular (LRT-TA) thermal cycles has been examined through evaluations of the process uniformity, slip dislocation patterns, and electrical characteristics of MOS devices. The strong effects of the thermal cycle parameters on process uniformity and slips indicate that the overall performance of an RTP tool must be specified both under the steady-state and transient thermal cycles. The electrical characteristics of MOS devices with LRT-grown gate oxides are comparable to those for devices with oxides grown by the trapezoidal thermal cycles.


Vacuum ◽  
2008 ◽  
Vol 83 (2) ◽  
pp. 276-281 ◽  
Author(s):  
A. Bengi ◽  
S. Altındal ◽  
S. Özçelik ◽  
S.T. Agaliyeva ◽  
T.S. Mammadov

2014 ◽  
Vol 598 (1) ◽  
pp. 129-134 ◽  
Author(s):  
Sung Woo Lee ◽  
Dong Wook Kim ◽  
Hyunji Shin ◽  
Jong Sun Choi ◽  
Jin-Hyuk Bae ◽  
...  

2003 ◽  
Vol 24 (4) ◽  
pp. 230-232 ◽  
Author(s):  
H.Y. Yu ◽  
H.F. Lim ◽  
J.H. Chen ◽  
M.F. Li ◽  
Chunxiang Zhu ◽  
...  

1981 ◽  
Vol 4 ◽  
Author(s):  
C J Pollard ◽  
A E Glaccum ◽  
J D Speight

ABSTRACTThe optimum e-beam anneal conditions for damage free wafer annealing, implant activation uniformity across 3 inch wafers and low dose boron activation have been investigated with reference to the needs of MOS device processing. Some effects of e-beam annealing on MOS gate dielectrics are reported.


2005 ◽  
Vol 252 (4) ◽  
pp. 1153-1158 ◽  
Author(s):  
Enise Ayyildiz ◽  
Hidayet Cetin ◽  
Zs. J. Horváth

2013 ◽  
Vol 8 (1) ◽  
pp. 18 ◽  
Author(s):  
Fa-Hsyang Chen ◽  
Jim-Long Her ◽  
Yu-Hsuan Shao ◽  
Yasuhiro H Matsuda ◽  
Tung-Ming Pan

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