The Degradation of Thin Silicon Dioxide Films Subjected to Pulse Voltage Stresses at Nanoscale

2019 ◽  
Vol 28 (2) ◽  
pp. 339-343 ◽  
Author(s):  
You-Lin Wu ◽  
Jing-Jenn Lin ◽  
Sheng-Hsiang Chang ◽  
Chiung-Yi Huang
1989 ◽  
Author(s):  
A. Kalnitsky ◽  
S. P. Tay ◽  
J. P. Ellul ◽  
J. W. Andrews ◽  
E. A. Irene ◽  
...  

1971 ◽  
Vol 118 (4) ◽  
pp. 614 ◽  
Author(s):  
K. H. Beckmann ◽  
N. J. Harrick

1999 ◽  
Vol 592 ◽  
Author(s):  
R. Rodríguez ◽  
M. Nafría ◽  
E. Miranda ◽  
J. Suñé ◽  
X. Aymerich

ABSTRACTThe degradation and breakdown of thin silicon dioxide films has been analysed using a two-step stress method. This procedure allows the evaluation of the degradation induced by the electrical stress without any assumption about the microscopic nature of the degradation process. The method has been used to analyse and compare the degradation dynamics when constant-voltage (CVS) and constant-current stresses (CCS) are applied to the oxide. Moreover, it is shown that in the case of CVS, the fitting of the I-t characteristics can provide quantitative information about the degradation (degradation rate) and breakdown (mean-time-to-breakdown), without taking into account any degradation model.


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