Аморфизация кремниевых нанонитей при облучении ионами аргона

The irradiation of silicon nanowires with Ar+ ions with an energy of 250 keV and fluences from 1013 cm^-2 to 10^16 cm^-2 was carried out. The dependence of the destruction of the structure under the action of ion irradiation on the fluence is investigated by the Raman spectroscopy. It is shown that the amorphization of porous silicon occurs at higher dpa values than in thin silicon thin films.

Numerical Simulation and Experiment of a High-Efficiency Tunnel Oxide Passivated Contact (TOPCon) Solar Cell Using a Crystalline Nanostructured Silicon-Based Layer

We report on the tunnel oxide passivated contact (TOPCon) using a crystalline nanostructured silicon-based layer via an experimental and numerical simulation study. The minority carrier lifetime and implied open-circuit voltage reveals an ameliorated passivation property, which gives the motivation to run a simulation. The passivating contact of an ultra-thin silicon oxide (1.2 nm) capped with a plasma enhanced chemical vapor deposition (PECVD) grown 30 nm thick nanocrystalline silicon oxide (nc-SiOx), provides outstanding passivation properties with low recombination current density (Jo) (~1.1 fA/cm2) at a 950 °C annealing temperature. The existence of a thin silicon oxide layer (SiO2) at the rear surface with superior quality (low pinhole density, Dph < 1 × 10−8 and low interface trap density, Dit ≈ 1 × 108 cm−2 eV−1), reduces the recombination of the carriers. The start of a small number of transports by pinholes improves the fill factor (FF) up to 83%, reduces the series resistance (Rs) up to 0.5 Ω cm2, and also improves the power conversion efficiency (PEC) by up to 27.4%. The TOPCon with a modified nc-SiOx exhibits a dominant open circuit voltage (Voc) of 761 mV with a supreme FF of 83%. Our simulation provides an excellent match with the experimental results and supports excellent passivation properties. Overall, our study proposed an ameliorated knowledge about tunnel oxide, doping in the nc-SiOx layer, and additionally about the surface recombination velocity (SRV) impact on TOPCon solar cells.

Silicon Nitride Interface Engineering for Fermi Level Depinning and Realization of Dopant-Free MOSFETs

Problems with doping in nanoscale devices or low temperature applications are widely known. Our approach to replace the degenerate doping in source/drain (S/D)-contacts is silicon nitride interface engineering. We measured Schottky diodes and MOSFETs with very thin silicon nitride layers in between silicon and metal. Al/SiN/p-Si diodes show Fermi level depinning with increasing SiN thickness. The diode fabricated with rapid thermal nitridation at 900 ∘C reaches the theoretical value of the Schottky barrier to the conduction band ΦSB,n=0.2 eV. As a result, the contact resistivity decreases and the ambipolar behavior can be suppressed. Schottky barrier MOSFETs with depinned S/D-contacts consisting of a thin silicon nitride layer and contact metals with different work functions are fabricated to demonstrate unipolar behavior. We presented n-type behavior with Al and p-type behavior with Co on samples which only distinguish by the contact metal. Thus, the thermally grown SiN layers are a useful method suppress Fermi level pinning and enable reconfigurable contacts by choosing an appropriate metal.

Optical Modulator using Ultra-Thin Silicon Waveguide in SOI Hybrid Technology

We propose a detailed study of an on-chip optical modulator using a non-conventional silicon-based platform. This platform is based on the optimum design of ultra-thin silicon on insulator (SOI) waveguide. This platform is characterized by low field confinement inside the core waveguide and high sensitivity to the cladding index. Accordingly, it lends itself to a wide range of applications, such as sensing and optical modulation. By employing this waveguide into the Mach-Zehnder interferometer (MZI) configuration, an efficient optical modulator is reported using an organic polymer as an active material for the electro-optic effect. An extinction ratio of more than 20 dB is achieved with energy per bit of 13.21 fJ/bit for 0.5 V applied voltage. This studied platform shows promising and adequate performance for modulation applications. It is cheap and easy to fabricate.