Rapid Thermal Annealing of Implanted Layers in Silicon Nitride Encapsulated Gallium Arsenide

1987 ◽  
Vol 134 (10) ◽  
pp. 2560-2565 ◽  
Author(s):  
M. R. Wilson ◽  
P. B. Kosel ◽  
Y. D. Shen ◽  
B. M. Welch
1996 ◽  
Vol 424 ◽  
Author(s):  
S. S. He ◽  
V. L. Shannon ◽  
T. Nguyen

AbstractPECVD silicon nitride was deposited by silane and deuterium ammonia. Silicon rich and nitrogen rich silicon nitride were deposited by varying the ratio of the SiH4/DH3. From FTIR, we found that the wave numbers of SiD and ND shifted lower when compared to SiH and NH bond in the NH3 nitride. In Si-rich nitride, both Si-H and Si-D bonds were found, which is different from N-rich nitride, where only an ND bond was found. Most of the hydrogen in NH(D) comes from the ammonia during PECVD deposition. We found that some of the deuterium exchanges its bonding to silicon from the initial bonding to nitrogen during a rapid thermal annealing process.


1994 ◽  
Vol 64 (20) ◽  
pp. 2652-2654 ◽  
Author(s):  
A. Markwitz ◽  
H. Baumann ◽  
E. F. Krimmel ◽  
K. Bethge ◽  
W. Grill

2013 ◽  
Vol 47 (11) ◽  
pp. 1470-1474 ◽  
Author(s):  
A. V. Murel ◽  
V. M. Daniltsev ◽  
E. V. Demidov ◽  
M. N. Drozdov ◽  
V. I. Shashkin

1993 ◽  
Vol 59 (1-2) ◽  
pp. 533-536 ◽  
Author(s):  
A. N. Akimov ◽  
L. A. Vlasukova ◽  
F. F. Komarov ◽  
M. Kulik

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