Chemical Free Room Temperature Wafer To Wafer Direct Bonding

1995 ◽  
Vol 142 (11) ◽  
pp. 3949-3955 ◽  
Author(s):  
Shari N. Farrens ◽  
James R. Dekker ◽  
Jason K. Smith ◽  
Brian E. Roberds
Keyword(s):  
Room Temperature ◽  
Wafer Direct Bonding

Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method

1997 ◽  
Vol 117-118 ◽  
pp. 808-812 ◽  
Author(s):  
Taek Ryong Chung ◽  
Liu Yang ◽  
Naoe Hosoda ◽  
Hidegi Takagi ◽  
Tadatomo Suga
Keyword(s):  
Room Temperature ◽  
Compound Semiconductors ◽  
Bonding Method ◽  
Wafer Direct Bonding

Room-Temperature Wafer Direct Bonding Using Ne-Beam Surface-Activation

2014 ◽  
Vol 64 (5) ◽  
pp. 69-75 ◽  
Author(s):  
H. Takagi ◽  
Y. Kurashima ◽  
A. Maeda
Keyword(s):  
Room Temperature ◽  
Surface Activation ◽  
Beam Surface ◽  
Wafer Direct Bonding

Room temperature wafer direct bonding of smooth Si surfaces recovered by Ne beam surface treatments

2013 ◽  
Vol 102 (25) ◽  
pp. 251605 ◽  
Author(s):  
Yuichi Kurashima ◽  
Atsuhiko Maeda ◽  
Hideki Takagi
Keyword(s):  
Room Temperature ◽  
Surface Treatments ◽  
Beam Surface ◽  
Wafer Direct Bonding

Wafer Direct Bonding at Room Temperature by Means of the Surface Activated Bonding

1996 ◽  
Author(s):  
Tadatomo SUGA ◽  
Taek Ryong CHUNG ◽  
Liu YANG ◽  
Naoe HOSODA ◽  
Hideki TAKAGI
Keyword(s):  
Room Temperature ◽  
Wafer Direct Bonding
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