A novel room-temperature wafer direct bonding method by fluorine containing plasma activation

2010 ◽  
Author(s):  
Chenxi Wang ◽  
Tadatomo Suga
Keyword(s):  
Room Temperature ◽  
Plasma Activation ◽  
Bonding Method ◽  
Wafer Direct Bonding

Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method

1997 ◽  
Vol 117-118 ◽  
pp. 808-812 ◽  
Author(s):  
Taek Ryong Chung ◽  
Liu Yang ◽  
Naoe Hosoda ◽  
Hidegi Takagi ◽  
Tadatomo Suga
Keyword(s):  
Room Temperature ◽  
Compound Semiconductors ◽  
Bonding Method ◽  
Wafer Direct Bonding

InGaAsP Lasers on GaAs Fabricated by the Surface Activated Wafer Direct Bonding Method at Room Temperature

1998 ◽  
Vol 37 (Part 1, No. 3B) ◽  
pp. 1405-1407 ◽  
Author(s):  
TaekRyong Chung ◽  
Naoe Hosoda ◽  
Tadatomo Suga ◽  
Hideki Takagi
Keyword(s):  
Room Temperature ◽  
Bonding Method ◽  
Wafer Direct Bonding

Chemical Free Room Temperature Wafer To Wafer Direct Bonding

1995 ◽  
Vol 142 (11) ◽  
pp. 3949-3955 ◽  
Author(s):  
Shari N. Farrens ◽  
James R. Dekker ◽  
Jason K. Smith ◽  
Brian E. Roberds
Keyword(s):  
Room Temperature ◽  
Wafer Direct Bonding

Effect of Temperature on the Interfacial Bonding Strength between PVB and Glass from RT to -50 °C

2011 ◽  
Vol 492 ◽  
pp. 61-65 ◽  
Author(s):  
Yuan Tian ◽  
Yi Wang Bao ◽  
De Tian Wan ◽  
Xiu Fang Wang ◽  
Zhi Ming Han
Keyword(s):  
Bonding Strength ◽  
Room Temperature ◽  
Testing Temperature ◽  
Interfacial Bonding ◽  
Effect Of Temperature ◽  
Laminated Glass ◽  
Interfacial Bonding Strength ◽  
Cooling Speed ◽  
Bonding Method ◽  
Shear Bonding Strength

Laminated glass and photovoltaic laminated glass are widely used in architecture. The interfacial bonding strengths between poly(vinyl butyral) (PVB) and glass were investigated by the cross-bonding method from room temperature to -50 °C. The loading speed was 5 mm/min, and the cooling speed was about 0.5 °C/min. The testing sample was hold at each temperature for half an hour. It was revealed that the testing temperature had great effect on the bonding strength. At room temperature, the tensile bonding strength was 11.49 MPa and the shear bonding strength was 6.61 MPa. With the temperature decreased from RT to -50 °C, the tensile bonding strength was decreased by 66.81%, but the shear bonding strength was increased by 212.16%. From RT to -30 °C, the change rates of the tensile and shear bonding strength bonding strength were 65.57% and 172.68% respectively, only 3.61% and 14.48% from -30 °C to -50 °C. The mechanism for the bonding strength depended on testing temperatures from RT to -50 °C was also discussed.

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