2007 8th International Conference on Electronic Packaging Technology
Latest Publications

TOTAL DOCUMENTS

209

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424413911, 9781424413928

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Measured by Nanoindentation

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441421 ◽

2007 ◽

Cited By ~ 1

Author(s):

Ping-Feng Yang ◽

Yi-Shao Lai ◽

Sheng-Rui Jian ◽

Jiunn Chen

Keyword(s):

Mechanical Properties ◽

Intermetallic Compounds

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Warpage and Reliability of Three-dimensional Multi-chip Module with High Density Embedded Substrate

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441521 ◽

2007 ◽

Cited By ~ 1

Author(s):

Gaowei Xu ◽

Jian Zhou ◽

Le Luo

Keyword(s):

Three Dimensional ◽

High Density

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Dr. Tom Chung [biography]

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441558 ◽

2007 ◽

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SiP - A Catalyst for Innovation

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441548 ◽

2007 ◽

Author(s):

William Chen

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Effect of Under Bump Metallization (UBM) Quality on Long Term Reliability

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441571 ◽

2007 ◽

Cited By ~ 1

Author(s):

Richard Rao ◽

Mike Seabock ◽

Tong Fang ◽

Roy Carew

Keyword(s):

Under Bump Metallization

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Image Inspecting System of Positioning Accuracy of the Die Bonder

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441540 ◽

2007 ◽

Cited By ~ 1

Author(s):

Xiangxiu Huang ◽

Ketian Li ◽

Ji'an Liu ◽

Jian-qi Liu ◽

Ji-zhao Weng

Keyword(s):

Positioning Accuracy

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Die Attach Process Monitoring through Multivariate Statistical Process Control Technique

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441504 ◽

2007 ◽

Cited By ~ 1

Author(s):

Jian Gao ◽

Changhong Liu ◽

Haixiang Deng ◽

Xin Chen ◽

Guolu Lin

Keyword(s):

Process Control ◽

Statistical Process Control ◽

Process Monitoring ◽

Control Technique ◽

Multivariate Statistical Process Control ◽

Multivariate Statistical ◽

Statistical Process ◽

Die Attach ◽

Process Control Technique

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Advanced Packaging Technologies for Automotive Electronics

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441375 ◽

2007 ◽

Cited By ~ 1

Author(s):

Man-Lung Sham ◽

Ziyang Gao ◽

Lydia Lap-Wai Leung ◽

Yu-Chih Chen ◽

Tom Chung

Keyword(s):

Automotive Electronics ◽

Advanced Packaging

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The Effect of Aging on Microstructures Evolution and Shear Behaviors in Lead-free Solder Joint

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441512 ◽

2007 ◽

Author(s):

Minghui Yang ◽

Fangjuan Qi ◽

Yaping Ding ◽

Deliang Ren ◽

Changling Xu

Keyword(s):

Solder Joint ◽

Lead Free ◽

Lead Free Solder ◽

Free Solder ◽

Shear Behaviors

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Dr. Xiao Hu Liu [biography]

2007 8th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2007.4441568 ◽

2007 ◽

Download Full-text

2007 8th International Conference on Electronic Packaging TechnologyLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Mechanical Properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 Intermetallic Compounds Measured by Nanoindentation

Warpage and Reliability of Three-dimensional Multi-chip Module with High Density Embedded Substrate

Dr. Tom Chung [biography]

SiP - A Catalyst for Innovation

Effect of Under Bump Metallization (UBM) Quality on Long Term Reliability

Image Inspecting System of Positioning Accuracy of the Die Bonder

Die Attach Process Monitoring through Multivariate Statistical Process Control Technique

Advanced Packaging Technologies for Automotive Electronics

The Effect of Aging on Microstructures Evolution and Shear Behaviors in Lead-free Solder Joint

Dr. Xiao Hu Liu [biography]

2007 8th International Conference on Electronic Packaging Technology
Latest Publications