The Role of Wafer Edge in Wafer Bonding Technologies

2020 ◽  
Vol 98 (4) ◽  
pp. 103-114
Author(s):  
Roy Knechtel ◽  
Uwe Schwarz ◽  
Sophia Dempwolf ◽  
Andy Nevin ◽  
Holger Klingner ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Edge

The Role of Wafer Edge in Wafer Bonding Technologies

2020 ◽  
Vol MA2020-02 (22) ◽  
pp. 1633-1633
Author(s):  
Roy Knechtel ◽  
Uwe Schwarz ◽  
Sophia Dempwolf ◽  
Andy Nevin ◽  
Holger Klingner ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Edge

The role of hydrogen in silicon wafer bonding: an infrared study

2002 ◽  
Author(s):  
M.K. Weldon ◽  
Y.J. Chabal ◽  
S.B. Christman ◽  
J. Bourcereau ◽  
C.A. Goodwin ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Wafer Bonding ◽  
Infrared Study

ChemInform Abstract: Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding

ChemInform ◽  
2010 ◽  
Vol 29 (31) ◽  
pp. no-no
Author(s):  
C. GUI ◽  
M. ELWENSPOEK ◽  
J. G. E. GARDENIERS ◽  
P. V. LAMBECK
Keyword(s):  
Wafer Bonding ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Future Role

The Role of Wafer Bonding in 3D Integration and Packaging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000355-000360
Author(s):  
James Hermanowski ◽  
Greg George
Keyword(s):  
Wafer Bonding ◽  
Process Integration ◽  
3D Integration ◽  
3D Ic ◽  
Integration Schemes ◽  
Front End

There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bonding, both permanent and temporary, in the fabrication of 3D-IC. Additionally, the materials and process flows used for these processes will be examined in detail.

The Role of Mobile Charge in Oxygen Plasma-Enhanced Silicon-to-Silicon Wafer Bonding

2010 ◽  
Vol 13 (6) ◽  
pp. H179 ◽  
Author(s):  
B. Raeissi ◽  
A. Sanz-Velasco ◽  
O. Engström
Keyword(s):  
Silicon Wafer ◽  
Wafer Bonding ◽  
Oxygen Plasma ◽  
Mobile Charge

scholarly journals Role of surface morphology in wafer bonding

1991 ◽  
Vol 69 (1) ◽  
pp. 257-260 ◽  
Author(s):  
W. P. Maszara ◽  
B‐L. Jiang ◽  
A. Yamada ◽  
G. A. Rozgonyi ◽  
H. Baumgart ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Wafer Bonding

scholarly journals The Importance of Wafer Edge in Wafer Bonding Technologies and related Wafer Edge Engineering Methods

2021 ◽  
Author(s):  
Roy Knechtel ◽  
Uwe Schwarz ◽  
Sophia Dempwolf ◽  
Holger Klingner ◽  
Andy Nevin ◽  
...  
Keyword(s):  
Wafer Bonding ◽  
Wafer Edge

Chemical role of oxygen plasma in wafer bonding using borosilicate glasses

2001 ◽  
Vol 79 (21) ◽  
pp. 3413-3415 ◽  
Author(s):  
D. M. Hansen ◽  
C. E. Albaugh ◽  
P. D. Moran ◽  
T. F. Kuech
Keyword(s):  
Wafer Bonding ◽  
Oxygen Plasma ◽  
Borosilicate Glasses

The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

2009 ◽  
Vol 94 (3) ◽  
pp. 034105 ◽  
Author(s):  
Da-Quan Yu ◽  
Chengkuo Lee ◽  
Li Ling Yan ◽  
Won Kyoung Choi ◽  
Aibin Yu ◽  
...  
Keyword(s):  
Low Temperature ◽  
Buffer Layer ◽  
Wafer Bonding ◽  
High Yield ◽  
Cu Metallization
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