2008 International Conference on Electronic Materials and Packaging
Latest Publications

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Published By IEEE

9781424436200

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

A method of fabricating MEMS accelerometers

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784235 ◽

2008 ◽

Cited By ~ 4

Author(s):

S. Chen ◽

H. T. Chien ◽

J. Y. Lin ◽

Y. W. Hsu

Keyword(s):

Mems Accelerometers

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Effect of alloying W in Ni(5P) metallization of solder joints

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784249 ◽

2008 ◽

Author(s):

D. M. Jang ◽

Jin Yu

Keyword(s):

Solder Joints ◽

Effect Of Alloying

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Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784282 ◽

2008 ◽

Author(s):

Yao-Ren Liu ◽

Jenn-Ming Song ◽

Yi-Shao Lai ◽

Ying-Ta Chiu ◽

Wei-Ting Chen

Keyword(s):

Transition Metals ◽

Interfacial Reactions ◽

Electroless Ni

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Alloying design of Sn-Ag-Cu solders for the improvement in drop test performance

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784222 ◽

2008 ◽

Cited By ~ 2

Author(s):

Li-Wei Lin ◽

Jenn-Ming Song ◽

Yi-Shao Lai ◽

Ying-Ta Chiu ◽

Ning-Cheng Lee

Keyword(s):

Test Performance ◽

Drop Test

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Variability-aware lTCC spiral inductor synthesis

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784246 ◽

2008 ◽

Author(s):

Tuck-Boon Chan ◽

Hsin-Chia Lu

Keyword(s):

Spiral Inductor

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Extraction of micro-contact properties using a novel micromachined on-chip apparatus

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784284 ◽

2008 ◽

Author(s):

Ben-Hwa Jang ◽

Po-Hsun Tseng ◽

Weileun Fang ◽

Shin-Way Lin

Keyword(s):

On Chip

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Measurement of temperature distribution in SnAg3.5 flip-chip solder joints during current stressing using infrared microscopy

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784283 ◽

2008 ◽

Author(s):

Hsiang-Yao Hsiao ◽

Chih Chen

Keyword(s):

Temperature Distribution ◽

Flip Chip ◽

Solder Joints ◽

Infrared Microscopy ◽

Current Stressing

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Evaluation of residual stress in a transistor using micron scale strain sensors

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784275 ◽

2008 ◽

Cited By ~ 3

Author(s):

Takuya Sasaki ◽

Nobuki Ueta ◽

Hideo Miura

Keyword(s):

Residual Stress ◽

Strain Sensors

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Optical density measurement of TFT-LCD by PMT coupled monochrome LED

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784230 ◽

2008 ◽

Cited By ~ 1

Author(s):

Fu-Ming Tzu ◽

Jung-Hua Chou

Keyword(s):

Optical Density ◽

Density Measurement ◽

Optical Density Measurement

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Post-mold cure process simulation of IC packaging

2008 International Conference on Electronic Materials and Packaging ◽

10.1109/emap.2008.4784241 ◽

2008 ◽

Author(s):

Chi-Hong Shue ◽

Sheng-Jye Hwang ◽

Huei-Huang Lee ◽

Durn-Yuan Huang ◽

Yao-Jung Lee

Keyword(s):

Process Simulation ◽

Cure Process ◽

Ic Packaging

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2008 International Conference on Electronic Materials and PackagingLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

A method of fabricating MEMS accelerometers

Effect of alloying W in Ni(5P) metallization of solder joints

Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections

Alloying design of Sn-Ag-Cu solders for the improvement in drop test performance

Variability-aware lTCC spiral inductor synthesis

Extraction of micro-contact properties using a novel micromachined on-chip apparatus

Measurement of temperature distribution in SnAg3.5 flip-chip solder joints during current stressing using infrared microscopy

Evaluation of residual stress in a transistor using micron scale strain sensors

Optical density measurement of TFT-LCD by PMT coupled monochrome LED

Post-mold cure process simulation of IC packaging

2008 International Conference on Electronic Materials and Packaging
Latest Publications