Chemical role of oxygen plasma in wafer bonding using borosilicate glasses

2001 ◽  
Vol 79 (21) ◽  
pp. 3413-3415 ◽  
Author(s):  
D. M. Hansen ◽  
C. E. Albaugh ◽  
P. D. Moran ◽  
T. F. Kuech
Keyword(s):  
Wafer Bonding ◽  
Oxygen Plasma ◽  
Borosilicate Glasses

The Role of Mobile Charge in Oxygen Plasma-Enhanced Silicon-to-Silicon Wafer Bonding

2010 ◽  
Vol 13 (6) ◽  
pp. H179 ◽  
Author(s):  
B. Raeissi ◽  
A. Sanz-Velasco ◽  
O. Engström
Keyword(s):  
Silicon Wafer ◽  
Wafer Bonding ◽  
Oxygen Plasma ◽  
Mobile Charge

scholarly journals Advantage of NMR and FTIR Spectroscopy to Determine Structure Role of CeO<sub>2</sub> in Complicated Borosilicate Glasses: New Approach

2017 ◽  
Vol 07 (02) ◽  
pp. 22-33 ◽  
Author(s):  
Gomaa El-Damrawi ◽  
Abdelmeguid K. Hassan ◽  
Salma Ehmead ◽  
Amal El Shahawy
Keyword(s):  
Ftir Spectroscopy ◽  
Borosilicate Glasses ◽  
New Approach

The role of hydrogen in silicon wafer bonding: an infrared study

2002 ◽  
Author(s):  
M.K. Weldon ◽  
Y.J. Chabal ◽  
S.B. Christman ◽  
J. Bourcereau ◽  
C.A. Goodwin ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Wafer Bonding ◽  
Infrared Study

The structural role of Zr within alkali borosilicate glasses for nuclear waste immobilisation

2011 ◽  
Vol 357 (7) ◽  
pp. 1647-1656 ◽  
Author(s):  
A.J. Connelly ◽  
N.C. Hyatt ◽  
K.P. Travis ◽  
R.J. Hand ◽  
E.R. Maddrell ◽  
...  
Keyword(s):  
Nuclear Waste ◽  
Borosilicate Glasses ◽  
Structural Role ◽  
Alkali Borosilicate Glasses

Role of Bi2O3 in altering the structural, optical, mechanical, radiation shielding and thermoluminescence properties of heavy metal oxide borosilicate glasses

2020 ◽  
Vol 542 ◽  
pp. 120136
Author(s):  
Ashwitha Nancy D'Souza ◽  
Nimitha S. Prabhu ◽  
K. Sharmila ◽  
M. I Sayyed ◽  
H. M Somshekarappa ◽  
...  
Keyword(s):  
Heavy Metal ◽  
Metal Oxide ◽  
Radiation Shielding ◽  
Borosilicate Glasses

Oxidation and Induced Damage in Oxygen Plasma In Situ Wafer Bonding

2000 ◽  
Vol 147 (7) ◽  
pp. 2699 ◽  
Author(s):  
Donato Pasquariello ◽  
Christer Hedlund ◽  
Klas Hjort
Keyword(s):  
Wafer Bonding ◽  
Oxygen Plasma

ChemInform Abstract: Present and Future Role of Chemical Mechanical Polishing in Wafer Bonding

ChemInform ◽  
2010 ◽  
Vol 29 (31) ◽  
pp. no-no
Author(s):  
C. GUI ◽  
M. ELWENSPOEK ◽  
J. G. E. GARDENIERS ◽  
P. V. LAMBECK
Keyword(s):  
Wafer Bonding ◽  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Future Role

ROLE OF O2(a' Δ) IN THE OXYGEN PLASMA

1979 ◽  
Vol 40 (C7) ◽  
pp. C7-135-C7-136
Author(s):  
J. W. Dettmer ◽  
A. Garscadden
Keyword(s):  
Oxygen Plasma

The Role of Wafer Bonding in 3D Integration and Packaging

2010 ◽  
Vol 2010 (1) ◽  
pp. 000355-000360
Author(s):  
James Hermanowski ◽  
Greg George
Keyword(s):  
Wafer Bonding ◽  
Process Integration ◽  
3D Integration ◽  
3D Ic ◽  
Integration Schemes ◽  
Front End

There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bonding, both permanent and temporary, in the fabrication of 3D-IC. Additionally, the materials and process flows used for these processes will be examined in detail.

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