Encyclopedia of Packaging Materials, Processes, and Mechanics
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9789811201110, 9789811209635, 9789811201158, 9789811209680
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Design, Fabrication, and Characterization of Dense Compressible MicroInterconnects

2019 ◽  
pp. 105-121
Author(s):  
PAUL K. JO ◽  
MUNEEB ZIA ◽  
JOE L. GONZALEZ ◽  
HANJU OH ◽  
MUHANNAD S. BAKIR
Keyword(s):  
Fabrication And Characterization

Design, Fabrication, and Assembly of 3-Arc-Fan Compliant Interconnects

2019 ◽  
pp. 1-20
Author(s):  
PHILIP Y. CHUNG ◽  
WEI CHEN ◽  
RAPHAEL I. OKEREKE ◽  
SURESH K. SITARAMAN

Wire Bond Substrates

2019 ◽  
pp. 311-352
Author(s):  
CHARLES ARVIN ◽  
DAVID J RUSSELL ◽  
HAILE WILSON
Keyword(s):  
Wire Bond

Electronic Packaging Technology

2019 ◽  
pp. 1-20
Author(s):  
PENGLI ZHU ◽  
DAOQIANG DANIEL LU ◽  
ZHUQING ZHANG ◽  
CHINGPING WONG
Keyword(s):  
Electronic Packaging ◽  
Packaging Technology
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