Wafer edge polishing process for defect reduction during immersion lithography

2008 ◽  
Author(s):  
Motoya Okazaki ◽  
Raymond Maas ◽  
Sen-Hou Ko ◽  
Yufei Chen ◽  
Paul Miller ◽  
...  
Keyword(s):  
Polishing Process ◽  
Defect Reduction ◽  
Immersion Lithography ◽  
Wafer Edge

Defectivity improvement by modified wafer edge treatment in immersion lithography

2009 ◽  
Author(s):  
Masafumi Fujita ◽  
Takao Tamura ◽  
Naka Onoda ◽  
Takayuki Uchiyama
Keyword(s):  
Immersion Lithography ◽  
Edge Treatment ◽  
Wafer Edge

Defect reduction by using a new rinse solution for 193-nm conventional and immersion lithography

2006 ◽  
Author(s):  
Osamu Miyahara ◽  
Takeshi Shimoaoki ◽  
Ryoichiro Naito ◽  
Kousuke Yoshihara ◽  
Junichi Kitano
Keyword(s):  
Defect Reduction ◽  
Immersion Lithography ◽  
193 Nm

New Evaluation Method of Polishing Pad Property for Estimating Edge Roll-Off of Silicon Wafer

2016 ◽  
Vol 874 ◽  
pp. 34-39
Author(s):  
Yuma Obayashi ◽  
Urara Satake ◽  
Toshiyuki Enomoto
Keyword(s):  
Final Stage ◽  
Evaluation Method ◽  
Silicon Wafers ◽  
Polishing Process ◽  
Integration Density ◽  
Surface Flatness ◽  
Edge Surface ◽  
Wafer Manufacturing ◽  
Polishing Pads ◽  
Wafer Edge

With the ever-growing demand for further increase in the integration density of semiconductor devices, silicon wafers as the substrates for most devices are required to be extremely flat. In particular, it is strongly required to suppress edge roll-off, which seriously deteriorates the surface flatness near the wafer edge during polishing process in the final stage of the wafer manufacturing. In this study, we investigate the properties of polishing pads required for decreasing edge roll-off and propose the evaluation method of the properties. Polishing experiments with silicon wafers and evaluation tests for polishing pads reveal that the proposed method can estimate the obtained edge surface flatness.

Wafer Edge Process Integration and Defect Inspection with the Immersion Lithography Process

2014 ◽  
Vol 60 (1) ◽  
pp. 847-853 ◽  
Author(s):  
Q. Ni ◽  
H. Chen ◽  
K. Wang ◽  
Y. Long ◽  
R. Fang
Keyword(s):  
Process Integration ◽  
Defect Inspection ◽  
Immersion Lithography ◽  
Lithography Process ◽  
Edge Process ◽  
Wafer Edge

Focus, dynamics, and defectivity performance at wafer edge in immersion lithography

2008 ◽  
Author(s):  
Takao Tamura ◽  
Naka Onoda ◽  
Masafumi Fujita ◽  
Takayuki Uchiyama
Keyword(s):  
Immersion Lithography ◽  
Wafer Edge
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