2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference
Latest Publications

TOTAL DOCUMENTS

(FIVE YEARS 0)

H-INDEX

(FIVE YEARS 0)

Published By IEEE

9781424436149

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Optical spectral emission endpoint detection for passivation etch

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5297255 ◽

2009 ◽

Author(s):

Yue Kok Hong Kenneth ◽

Chin Chye Seng ◽

Chin Tiong Tay ◽

Se Kwang Leong James ◽

Boon Kiat Goh

Keyword(s):

Endpoint Detection ◽

Spectral Emission

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Novel in-line inspection method for non-visual defects and charging

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155979 ◽

2009 ◽

Cited By ~ 3

Author(s):

K. Hoppner ◽

R. Manuwald ◽

T. Fahr ◽

E. Zschech ◽

N. Tamayo ◽

...

Keyword(s):

Inspection Method ◽

Visual Defects

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Electro-static induced metal breakdown at interlayer dielectric post CMP brush clean process

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155945 ◽

2009 ◽

Cited By ~ 2

Author(s):

Stephane Lariviere ◽

Francis Picore ◽

Pierre Louis Saez ◽

Jean-Luc Baltzinger ◽

Bruno Delahaye ◽

...

Keyword(s):

Interlayer Dielectric

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Going green with on-site generated fluorine: Sustainable cleaning agent for CVD processes

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155996 ◽

2009 ◽

Cited By ~ 1

Author(s):

Paul Stockman ◽

Greg Shuttleworth

Keyword(s):

Cleaning Agent

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Application of a Run-to-Run controller to a vapor phase epitaxy process

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155985 ◽

2009 ◽

Cited By ~ 1

Author(s):

C. De Luca ◽

E. Maran ◽

J. Baumgartl ◽

A. Beghi

Keyword(s):

Vapor Phase ◽

Vapor Phase Epitaxy

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Novel single-wafer, single-chamber combined dry and wet system for stripping and in-situ cleaning of high-dose ion-implanted photoresists

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155994 ◽

2009 ◽

Author(s):

Y. J. Kim ◽

C.R. Yoon ◽

E.S. Roh ◽

J.K. Cho ◽

Takeshi Hattori

Keyword(s):

High Dose ◽

Single Chamber ◽

Ion Implanted

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Detection of critical defects with E-beam technology for development and monitoring of advanced NAND processes

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155964 ◽

2009 ◽

Cited By ~ 1

Author(s):

Hiroyuki Hayashi ◽

Masafumi Oomura ◽

Naoki Ihata ◽

Akihiro Shinkawa ◽

Frank Fan ◽

...

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40% cycle time improvement as a result of continuous improvement activities

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155960 ◽

2009 ◽

Author(s):

Bernd Janke ◽

Uwe Kuschereitz

Keyword(s):

Continuous Improvement ◽

Cycle Time

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Defect reduction in ArF immersion lithography, using particle trap wafers with CVD thin films

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155991 ◽

2009 ◽

Author(s):

Yoshinori Matsui ◽

Naka Onoda ◽

Seiji Nagahara ◽

Takayuki Uchiyama

Keyword(s):

Thin Films ◽

Defect Reduction ◽

Immersion Lithography ◽

Particle Trap

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Yield enhancement and excursions prevention using fault detection and classification methods and product test data

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference ◽

10.1109/asmc.2009.5155963 ◽

2009 ◽

Author(s):

Helene Ansquer ◽

Christophe Balsan ◽

Nathanael Moreaud ◽

Dominique Deprost

Keyword(s):

Fault Detection ◽

Test Data ◽

Yield Enhancement ◽

Classification Methods ◽

Fault Detection And Classification ◽

Product Test

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2009 IEEE/SEMI Advanced Semiconductor Manufacturing ConferenceLatest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Optical spectral emission endpoint detection for passivation etch

Novel in-line inspection method for non-visual defects and charging

Electro-static induced metal breakdown at interlayer dielectric post CMP brush clean process

Going green with on-site generated fluorine: Sustainable cleaning agent for CVD processes

Application of a Run-to-Run controller to a vapor phase epitaxy process

Novel single-wafer, single-chamber combined dry and wet system for stripping and in-situ cleaning of high-dose ion-implanted photoresists

Detection of critical defects with E-beam technology for development and monitoring of advanced NAND processes

40% cycle time improvement as a result of continuous improvement activities

Defect reduction in ArF immersion lithography, using particle trap wafers with CVD thin films

Yield enhancement and excursions prevention using fault detection and classification methods and product test data

2009 IEEE/SEMI Advanced Semiconductor Manufacturing Conference
Latest Publications