High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life

2009 ◽  
Author(s):  
Satoru Katsurayama ◽  
Hironori Tohmyoh ◽  
Masumi Saka
Keyword(s):  
Physical Properties ◽  
Thermal Cycle ◽  
High Performance ◽  
Flip Chip ◽  
Substrate Interface ◽  
Interconnect Reliability ◽  
Day By Day ◽  
Underfill Material ◽  
Selection Of

Generally, underfill material is adopted for encapsulation of flip chip package. And, the role of the underfill materials has become important day by day due to variant requirements for higher reliability of flip chip package. Also lower warpage gives higher mount-ability of the flip chip package and the small changes in the warpage of the package during the thermal cycle mitigate the stress working at the bump/substrate interface and bump/chip interface. Therefore, controlling the warpage of the flip chip package becomes very important problem for enhancing the performance of the package, i.e., the higher mount-ability and longer interconnect life. In this study, the effect of physical properties of underfill materials and substrates on the warpage behavior and the interconnect reliability of the flip chip package is reported. It was found from the experiments that the selection of an underfill and a substrate gave the highest interconnect reliability for the bump bonds. In addition to control the warpage behavior of the package during assembly, by selecting the suitable underfill material and substrate, the flip chip package with lower warpage and higher interconnect reliability can be realized.

Development of 3D System-in-Package with TSV Technology

2014 ◽  
Vol 2014 (1) ◽  
pp. 000612-000617 ◽  
Author(s):  
Shota Miki ◽  
Takaharu Yamano ◽  
Sumihiro Ichikawa ◽  
Masaki Sanada ◽  
Masato Tanaka
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Organic Substrate ◽  
Back Side ◽  
Final Thickness ◽  
Chip Technology ◽  
Type Semiconductor ◽  
Interconnect Reliability ◽  
Solder Balls ◽  
Carrier Wafer

In recent years, products such as smart phones, tablets, and wearable devices, are becoming miniaturized and high performance. 3D-type semiconductor structures are advancing as the demand for high-density assembly increases. We studied a fabrication process using a SoC die and a memory die for 3D-SiP (System in Package) with TSV technology. Our fabrication is comprised of two processes. One is called MEOL (Middle End of Line) for exposing and completing the TSV's in the SoC die, and the other is assembling the SoC and memory dice in a 3D stack. The TSV completion in MEOL was achieved by SoC wafer back-side processing. Because its final thickness will be a thin 50μm (typical), the SoC wafer (300 mm diameter) is temporarily attached face-down onto a carrier-wafer. Careful back-side grinding reveals the “blind vias” and fully opens them into TSV's. A passivation layer is then grown on the back of the wafer. With planarization techniques, the via metal is accessed and TSV pads are built by electro-less plating without photolithography. After the carrier-wafer is de-bonded, the thin wafer is sawed into dice. For assembling the 3D die stack, flip-chip technology by thermo-compression bonding was the method chosen. First, the SoC die with copper pillar bumps is assembled to the conventional organic substrate. Next the micro-bumps on the memory die are bonded to the TSV pads of the SoC die. Finally, the finished assembly is encapsulated and solder balls (BGA) are attached. The 3D-SiP has passed both package-level reliability and board-level reliability testing. These results show we achieved fabricating a 3D-SiP with high interconnect reliability.

Sedimentation in canola oil: a review

1999 ◽  
Vol 39 (1) ◽  
pp. 103 ◽  
Author(s):  
L. Hermann ◽  
R. Mailer ◽  
K. Robards
Keyword(s):  
Physical Properties ◽  
Canola Oil ◽  
High Performance ◽  
Full Potential ◽  
Relative Role ◽  
Scanning Calorimetry ◽  
Sediment Formation ◽  
Preliminary Separation ◽  
Future Work

Summary. Sediment formation or cloudiness in canola oil presents a problem for the industry which is currently solved by winterisation. Various techniques have been used to examine the chemical and physical properties of the sediment. Knowledge of the physical properties are due largely to investigations using differential scanning calorimetry. Chemical composition has been determined by high resolution chromatographic methods particularly gas chromatography following preliminary separation of the sediment from the oil and fractionation. Major components of the sediment are wax esters with lesser amounts of triacylglycerols, hydrocarbons, free fatty acids and alcohols. Nevertheless, full characterisation of the sediment is yet to be achieved although the full potential of developments such as softer ionisation techniques for mass spectrometric detection in high performance liquid chromatography have not been exploited. The process of sediment formation is discussed in relation to nucleation of the oil and crystal growth. On this basis, factors determining sedimentation behaviour in a particular sample are probably kinetic and influenced by trace components of the oil. The fundamental question to be answered in future work is the relative role of environment and genetics in regulating susceptibility to sedimentation.

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
Sangil Lee ◽  
M. J. Yim ◽  
Daniel Baldwin
Keyword(s):  
Formation Mechanism ◽  
High Performance ◽  
Flip Chip ◽  
Chemical Interaction ◽  
Void Formation ◽  
Scanning Calorimetry ◽  
Design Guideline ◽  
Low Weight ◽  
Molecular Components ◽  
Underfill Material

This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package assembly. During the process, low weight molecular components, such as fluxing agents and water molecules, could be induced by the chemical interaction between solder wetting and underfill curing when these components are heated to melt and cure, respectively. The low weight molecular components become volatile with exposure to temperatures above their boiling points; this was found to be the main source of the extensively formed underfill voiding. This mechanism of chemically and thermally induced voids was explained using void formation study, differential scanning calorimetry thermogram comparison, and gas chromatography and mass spectroscopy chemical composition identification on the suggested chemical reaction formula. This finding can enhance understanding of the mechanism that drives no-flow underfill voiding and can develop a void-free flip chip assembly process using no-flow underfill material for cost effective and high performance electronics packaging applications. Furthermore, this study provides the design guideline to develop an advanced no-flow underfill having high performance at high temperature range for the lead-free application.

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
Satoru Katsurayama ◽  
Hironori Tohmyoh
Keyword(s):  
Thermal Cycling ◽  
Flip Chip ◽  
Capillary Flow ◽  
Curing Process ◽  
Assembly Process ◽  
Test Circuit ◽  
Interconnect Reliability ◽  
Flip Chip Packaging ◽  
Underfill Material

In flip chip packages, it is common practice for interconnects to be encapsulated with a liquid underfill material. This paper describes the effects of different underfill processes, i.e., the conventional capillary-flow underfill and two no-flow underfill processes, on flip chip packaging. The warpage of the package was examined, and the value of this during three different underfill encapsulating processes was measured. In addition, the interconnect reliability of the bump bonds after thermal-cycling was evaluated using a test circuit. The warpage of the package before curing varied depending on the assembly process, but that after curing was almost the same for all the processes studied. It was found that the interconnect reliability is closely related to the differences in the warpage arising from the assembly process, and that the smaller change in warpage introduced by the curing process gave a higher interconnect reliability for the bump bonds. Based on these findings, lower curing temperatures are considered to be more effective for improving the mountability of the package and the interconnect reliability.

scholarly journals The role of scientific breeding in increasing of the potential possibilities of drug-free sowing hemp

2020 ◽  
Vol 27 ◽  
pp. 47-54
Author(s):  
V. H. Vyrovets ◽  
I. M. Layko ◽  
S. V. Mishchenko ◽  
L. M. Horshkova ◽  
H. I. Kyrychenko ◽  
...  
Keyword(s):  
High Performance ◽  
Breeding Methods ◽  
Unconscious Selection ◽  
Biological Features ◽  
New Information ◽  
New Varieties ◽  
The Creation ◽  
Drug Free ◽  
Selection Of

Aim. An ancient dream of hemp farmers was the breeding of new varieties of monoecious hemp. The unexpected problem of hemp production has arisen the need to attract scientific breeding to create the world's first non-narcotic highly productive hemp. Methods. Measures of unconscious selection of plants in the period of threshing under the name "sichka" and "molochka" served as a prototype. The development of breeding methods was carried out in parallel to solve the problems of increasing the fiber content in the stems, the simultaneity of maturation, the creation of a new monoecious form of hemp, increase the yield of fiber and seeds and the removal of narcotically neutral new varieties. Results. Breeders of different generations researched and created new high-performance non-narcotic varieties of dioecious, simultaneously ripening and monoecious hemp varieties such as Hlukhivski 1, Hlukhivski 10, US 6, USO 1, USO 14, USO 16, Dniprovski odnodomni 6, USO 31, Hliana, Hlesia and others. Conclusions. Many years of cultivation of hemp and the creation of all new varieties of them showed that with a long substantiated study of this culture it is possible to obtain new information as yet unknown, due to the versatile differentiation of this culture by sexual types, openly showing the morphological and biological features of the sexes, representing gender forms that gradually change into one another, bringing researchers closer to new discoveries in genetics. Keywords: hemp, hemp forms, methods and ways of breeding, breeding varieties.

scholarly journals Role of soft computing techniques in predicting stock market direction

2012 ◽  
Vol 1 (2) ◽  
pp. 198
Author(s):  
Panchal Amitkumar Mansukhbhai ◽  
Dr. Jayeshkumar Madhubhai Patel
Keyword(s):  
Stock Market ◽  
Soft Computing ◽  
Financial Market ◽  
Input Data ◽  
Complex Problem ◽  
Data Series ◽  
Soft Computing Techniques ◽  
Day By Day ◽  
Selection Of

The stock market is a complex and dynamic system with noisy, non-stationary and chaotic data series. Prediction of a financial market is more challenging due to chaos and uncertainty of the system. Soft computing techniques are progressively gaining presence in the financial world. Compared to traditional techniques to predict the market direction, soft computing is gaining the advantage of accuracy and speed. However the input data selection is the major issue in soft computing. The aim of this paper is to explain the potential day by day research contribution of soft computing to solve complex problem such as stock market direction prediction. This study paper synthesizes five reference papers and explains how soft computing is gaining the popularity in the field of financial market. The selection of papers are based on various models wich are processing different input parameters for predicting the direction of stock market.

scholarly journals A Methodologic Approach for the Selection of Bio-Resorbable Polymers in the Development of Medical Devices: The Case of Poly(l-lactide-co-ε-caprolactone)

Polymers ◽  
2018 ◽  
Vol 10 (8) ◽  
pp. 851 ◽  
Author(s):  
Alberto Cingolani ◽  
Tommaso Casalini ◽  
Stefano Caimi ◽  
Antoine Klaue ◽  
Mattia Sponchioni ◽  
...  
Keyword(s):  
Physical Properties ◽  
Biodegradable Polymers ◽  
Medical Devices ◽  
High Performance ◽  
Surgical Interventions ◽  
Resorbable Polymers ◽  
Molecular Weights ◽  
Product Formulation ◽  
Good Reputation ◽  
Selection Of

In the last decades bioresorbable and biodegradable polymers have gained a very good reputation both in research and in industry thanks to their unique characteristics. They are able to ensure high performance and biocompatibility, at the same time avoiding post-healing surgical interventions for device removal. In the medical device industry, it is widely known that product formulation and manufacturing need to follow specific procedures in order to ensure both the proper mechanical properties and desired degradation profile. Moreover, the sterilization method is crucial and its impact on physical properties is generally underestimated. In this work we focused our attention on the effect of different terminal sterilization methods on two commercially available poly(l-lactide-co-ε-caprolactone) with equivalent chemical composition (70% PLA and 30% PCL) and relatively similar initial molecular weights, but different chain arrangements and crystallinity. Results obtained show that crystallinity plays a key role in helping preserve the narrow distribution of chains and, as a consequence, defined physical properties. These statements can be used as guidelines for a better choice of the most adequate biodegradable polymers in the production of resorbable medical devices.

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