Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
Sangil Lee ◽  
M. J. Yim ◽  
Daniel Baldwin
Keyword(s):  
Formation Mechanism ◽  
High Performance ◽  
Flip Chip ◽  
Chemical Interaction ◽  
Void Formation ◽  
Scanning Calorimetry ◽  
Design Guideline ◽  
Low Weight ◽  
Molecular Components ◽  
Underfill Material

This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package assembly. During the process, low weight molecular components, such as fluxing agents and water molecules, could be induced by the chemical interaction between solder wetting and underfill curing when these components are heated to melt and cure, respectively. The low weight molecular components become volatile with exposure to temperatures above their boiling points; this was found to be the main source of the extensively formed underfill voiding. This mechanism of chemically and thermally induced voids was explained using void formation study, differential scanning calorimetry thermogram comparison, and gas chromatography and mass spectroscopy chemical composition identification on the suggested chemical reaction formula. This finding can enhance understanding of the mechanism that drives no-flow underfill voiding and can develop a void-free flip chip assembly process using no-flow underfill material for cost effective and high performance electronics packaging applications. Furthermore, this study provides the design guideline to develop an advanced no-flow underfill having high performance at high temperature range for the lead-free application.

Spatial analysis of underfill flow in flip-chip encapsulation

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Fei Chong Ng ◽  
Mohd Hafiz Zawawi ◽  
Mohamad Aizat Abas
Keyword(s):  
Spatial Analysis ◽  
Formation Mechanism ◽  
Flip Chip ◽  
Void Formation ◽  
Past Research ◽  
Air Entrapment ◽  
Time Model ◽  
Content Type ◽  
Filling Time ◽  
Underfill Flow

Purpose The purpose of the study is to investigate the spatial aspects of underfill flow during the flip-chip encapsulation process, for instance, meniscus evolution and contact line jump (CLJ). Furthermore, a spatial-based void formation mechanism during the underfill flow was formulated. Design/methodology/approach The meniscus evolution of underfill fluid subtended between the bump array and the CLJ phenomenon were visualized numerically using the micro-mesh unit cell approach. Additionally, the meniscus evolution and CLJ phenomenon were modelled analytically based on the formulation of capillary physics. Meanwhile, the mechanism of void formation was explained numerically and analytically. Findings Both the proposed analytical and current numerical findings achieved great consensus and were well-validated experimentally. The variation effects of bump pitch on the spatial aspects were analyzed and found that the meniscus arc radius and filling distance increase with the pitch, while the subtended angle of meniscus arc is invariant with the pitch size. For larger pitch, the jump occurs further away from the bump entrance and takes longer time to attain the equilibrium meniscus. This inferred that the concavity of meniscus arc was influenced by the bump pitch. On the voiding mechanism, air void was formed from the air entrapment because of the fluid-bump interaction. Smaller voids tend to merge into a bigger void through necking and, subsequently, propagate along the underfill flow. Practical implications The microscopic spatial analysis of underfill flow would explain fundamentally how the bump design will affect the macroscopic filling time. This not only provides alternative visualization tool to analyze flow pattern in the industry but also enables the development of accurate analytical filling time model. Moreover, the void formation mechanism gave substantial insights to understand the root causes of void defects and allow possible solutions to be formulated to tackle this issue. Additionally, the microfluidics sector could also benefit from these spatial analysis insights. Originality/value Spatial analysis on underfill flow is scarcely conducted, as the past research studies mainly emphasized on the temporal aspects. Additionally, this work presented a new mechanism on the void formation based on the fluid-bump interaction, in which the formation and propagation of micro-voids were numerically visualized for the first time. The findings from current work provided fundamental information on the flow interaction between underfill fluid and solder bump to the package designers for optimization work and process enhancement.

Interactions between Variable Frequency Microwave Underfill Processing and High Performance Packaging Materials

2013 ◽  
Vol 2013 (1) ◽  
pp. 000461-000466 ◽  
Author(s):  
Mamadou Diobet Diop ◽  
Marie-Claude Paquet ◽  
Dominique Drouin ◽  
David Danovitch
Keyword(s):  
High Performance ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Curing Temperature ◽  
Variable Frequency ◽  
Asymmetric Distribution ◽  
Unexpected Result ◽  
Scanning Calorimetry ◽  
Negative Effect ◽  
Curing Methods

Variable frequency microwave (VFM) has been recently proposed as an alternative underfill curing method that provides flip chip package warpage improvement as well as potential underfill cure time reductions. The current paper outlines how such advantages in VFM processing of underfill can be compromised when applied to high performance organic packages. VFM recipes for three underfill materials were developed by performing several VFM curing runs followed by curing rate measurements using the differential scanning calorimetry method. The VFM curing rate was seen to strongly dependent upon the underfill chemistry. By testing flip chip parts that comprised large and high-end substrates, we showed that the underfill material has negligible impact on VFM warpage with the major cause attributed to the coefficient of thermal expansion mismatch between the die and the substrate. Comparison between the convection and the VFM methods indicated two warpage tendencies that depended upon the VFM curing temperature. First, when both curing methods used comparably high temperatures, warpage increases up to about + 20% were found with VFM. This unexpected result was explained by the high-density Cu loading of the substrate which systematically carried heat generated by VFM energy from the die/underfill system to the substrate. Since this high-end substrate consists of sequential dielectric/Cu layers with asymmetric distribution of Cu, additional stresses due to local CTE mismatches between the Cu and the dielectric layers were induced within the substrate processed with VFM. Second, warpage reductions down to about − 22% were obtained at the VFM curing temperature of 110°C with a curing time similar to that of convection cure. This suggests that the negative effect of the local CTE mismatches were no longer at play at the lower VFM temperatures and that the significantly lower final cure temperatures produced lower total shrinkage of the die and the substrate. Finally, due to lower elastic moduli, the cured VFM parts showed better mechanical reliability with no fails up to 1500 cycles.

High Yield, Near Void-Free Assembly Process of a Flip Chip in Package Using No-Flow Underfill

2010 ◽  
Vol 2010 (1) ◽  
pp. 000798-000805 ◽  
Author(s):  
Sangil Lee ◽  
Daniel F. Baldwin
Keyword(s):  
Flip Chip ◽  
Void Nucleation ◽  
Void Formation ◽  
Bubble Nucleation ◽  
Nucleation Theory ◽  
High Yield ◽  
Process Conditions ◽  
Assembly Process ◽  
Fine Pitch ◽  
Underfill Material

The advanced assembly process for a flip chip in package (FCIP) using no-flow underfill material presents challenges with high I/O density (over 3000 I/O) and fine-pitch (down to 150 μm) interconnect applications because it has narrowed the feasible assembly process window for achieving robust interconnect yield. In spite of such challenges, a high yield, nearly void-free assembly process has been achieved in the past research using commercial no-flow underfill material with a high I/O, fine pitch FCIP. The initial void area (approximately 7% ) could cause early failures such solders fatigue cracking or solder bridging in thermal reliability. Therefore, this study reviewed a classical bubble nucleation theory to predict the conditions of underfill void nucleation in the no flow assembly process. Based on the models prediction, systematic experiments were designed to eliminate underfill voiding using parametric studies. First, a void formation study investigated the effect of reflow parameter on underfill voiding and found process conditions of void-free assembly with robust interconnections. Second, a void formation characterization validated the determined reflow conditions to achieve a high yield and void-free assembly process, and the stability of assembly process using a large scale of assemblies respectively. This paper presents systematic studies into void formation study and void formation characterization through the use of structured experimentation which was designed to achieve a high yield, void-free assembly process leveraging a void formation model based on classical bubble nucleation theory. Indeed, the theoretical models were in good agreement with experimental results.

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

2019 ◽  
Vol 3 (1) ◽  
pp. 69-83 ◽  
Author(s):  
Madhav Datta
Keyword(s):  
Electronic Packaging ◽  
High Performance ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Void Formation ◽  
High Volume ◽  
Lead Free ◽  
Manufacturing Processes ◽  
Solder Paste ◽  
Chip Technology

Electronic packaging is the methodology for connecting and interfacing the chip technology with a system and the physical world. The objective of packaging is to ensure that the devices and interconnections are packaged efficiently and reliably. Chip–package interconnection technologies currently used in the semiconductor industry include wire bonding, tape automated bonding and flip-chip solder bump connection. Among these interconnection techniques, the flip-chip bumping technology is commonly used in advanced electronic packages since this interconnection is an area array configuration so that the entire surface of the chip can be covered with bumps for the highest possible input/output (I/O) counts. The present article reviews the manufacturing processes for the fabrication of flip-chip bumps for chip–package interconnection. Various solder bumping technologies used in high-volume production include evaporation, solder paste screening and electroplating. Evaporation process produces highly reliable bumps, but it is extremely expensive and is limited to lead or lead-rich solders. Solder paste screening is cost-effective, but issues related to excessive void formation limits the process to low-end products. On the other hand, electrochemical fabrication of flip-chip bumps is an extremely selective and efficient process, which is extendible to finer pitch, larger wafers and a variety of solder compositions, including lead-free alloys. Electrochemically fabricated copper pillar bumps offer fine pitch capabilities with excellent electromigration performance. Due to these virtues, the copper pillar bumping technology is emerging as a lead-free bumping technology option for high-performance electronic packaging.

High Performance Flip Chip Package With Higher Mountability and Longer Interconnect Life

2009 ◽  
Author(s):  
Satoru Katsurayama ◽  
Hironori Tohmyoh ◽  
Masumi Saka
Keyword(s):  
Physical Properties ◽  
Thermal Cycle ◽  
High Performance ◽  
Flip Chip ◽  
Substrate Interface ◽  
Interconnect Reliability ◽  
Day By Day ◽  
Underfill Material ◽  
Selection Of

Generally, underfill material is adopted for encapsulation of flip chip package. And, the role of the underfill materials has become important day by day due to variant requirements for higher reliability of flip chip package. Also lower warpage gives higher mount-ability of the flip chip package and the small changes in the warpage of the package during the thermal cycle mitigate the stress working at the bump/substrate interface and bump/chip interface. Therefore, controlling the warpage of the flip chip package becomes very important problem for enhancing the performance of the package, i.e., the higher mount-ability and longer interconnect life. In this study, the effect of physical properties of underfill materials and substrates on the warpage behavior and the interconnect reliability of the flip chip package is reported. It was found from the experiments that the selection of an underfill and a substrate gave the highest interconnect reliability for the bump bonds. In addition to control the warpage behavior of the package during assembly, by selecting the suitable underfill material and substrate, the flip chip package with lower warpage and higher interconnect reliability can be realized.

Star-shaped arylacetylene resins derived from silicon

2020 ◽  
Vol 40 (8) ◽  
pp. 676-684
Author(s):  
Niping Dai ◽  
Junkun Tang ◽  
Manping Ma ◽  
Xiaotian Liu ◽  
Chuan Li ◽  
...  
Keyword(s):  
High Performance ◽  
Room Temperature ◽  
Mechanical Test ◽  
Flexural Modulus ◽  
Mechanical Analysis ◽  
Reinforced Composites ◽  
Scanning Calorimetry ◽  
Chemical Structures ◽  
Structures And Properties ◽  
High Performance Resin

AbstractStar-shaped arylacetylene resins, tris(3-ethynyl-phenylethynyl)methylsilane, tris(3-ethynyl-phenylethynyl) phenylsilane, and tris (3-ethynyl-phenylethynyl) silane (TEPHS), were synthesized through Grignard reaction between 1,3-diethynylbenzene and three types of trichlorinated silanes. The chemical structures and properties of the resins were characterized by means of nuclear magnetic resonance, fourier-transform infrared spectroscopy, Haake torque rheomoter, differential scanning calorimetry, dynamic mechanical analysis, mechanical test, and thermogravimetric analysis. The results show that the melt viscosity at 120 °C is lower than 150 mPa⋅s, and the processing windows are as wide as 60 °C for the resins. The resins cure at the temperature as low as 150 °C. The good processabilities make the resins to be suitable for resin transfer molding. The cured resins exhibit high flexural modulus and excellent heat-resistance. The flexural modulus of the cured TEPHS at room temperature arrives at as high as 10.9 GPa. Its temperature of 5% weight loss (Td5) is up to 697 °C in nitrogen. The resins show the potential for application in fiber-reinforced composites as high-performance resin in the field of aviation and aerospace.

scholarly journals Effect of Nanofiller Content on Dynamic Mechanical and Thermal Properties of Multi-Walled Carbon Nanotube and Montmorillonite Nanoclay Filler Hybrid Shape Memory Epoxy Composites

Polymers ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 700
Author(s):  
Muhamad Hasfanizam Mat Yazik ◽  
Mohamed Thariq Hameed Sultan ◽  
Mohammad Jawaid ◽  
Abd Rahim Abu Talib ◽  
Norkhairunnisa Mazlan ◽  
...  
Keyword(s):  
Shape Memory ◽  
High Performance ◽  
Loss Modulus ◽  
Decomposition Temperature ◽  
Hybrid Nanocomposites ◽  
Mechanical And Thermal Properties ◽  
Scanning Calorimetry ◽  
Hybrid Filler ◽  
Dynamic Mechanical ◽  
Tan Δ

The aim of the present study has been to evaluate the effect of hybridization of montmorillonite (MMT) and multi-walled carbon nanotubes (MWCNT) on the thermal and viscoelastic properties of shape memory epoxy polymer (SMEP) nanocomposites. In this study, ultra-sonication was utilized to disperse 1%, 3%, and 5% MMT in combination with 0.5%, 1%, and 1.5% MWCNT into the epoxy system. The fabricated SMEP hybrid nanocomposites were characterized via differential scanning calorimetry, dynamic mechanical analysis, and thermogravimetric analysis. The storage modulus (E’), loss modulus (E”), tan δ, decomposition temperature, and decomposition rate, varied upon the addition of the fillers. Tan δ indicated a reduction of glass transition temperature (Tg) for all the hybrid SMEP nanocomposites. 3% MMT/1% MWCNT displayed best overall performance compared to other hybrid filler concentrations and indicated a better mechanical property compared to neat SMEP. These findings open a way to develop novel high-performance composites for various potential applications, such as morphing structures and actuators, as well as biomedical devices.

Thermal properties of polybenzoxazine exhibiting improved toughness: Blending with cyclodextrin and its derivatives

2021 ◽  
pp. 095400832110130
Author(s):  
Hailong Li ◽  
Sipei Zhao ◽  
Li Pei ◽  
Zihe Qiao ◽  
Ding Han ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Hydrogen Bonds ◽  
High Performance ◽  
Practical Application ◽  
Scanning Calorimetry ◽  
Thermoset Resins ◽  
Chemical Structures ◽  
Microscopy Techniques ◽  
Fractured Surface ◽  
Scanning Electron

Polybenzoxazines are emerging as a class of high-performance thermoset polymers that can find their applications in various fields. However, its practical application is limited by its low toughness. The cyclic β-cyclodextrin and a newly synthesized derivative (β-cyclodextrin-MAH) were separately blended with benzoxazine to improve the toughness of polybenzoxazine. The results revealed that the maximum impact strength of the blend was 12.24 kJ·m−2 and 14.29 kJ·m−2 when 1 wt.% of β-Cyclodextrin and β-Cyclodextrin-MAH, respectively, were used. The strengths were 53% and 86% higher than that of pure polybenzoxazine. The curing reaction, possible chemical structures, and fractured surface were examined using differential scanning calorimetry, Fourier transform infrared spectroscopy, and scanning electron microscopy techniques to understand the mechanism of generation of toughness. The results revealed that the sea-island structure and the presence of hydrogen bonds between polybenzoxazine and β-cyclodextrin and β-cyclodextrin-MAH resulted in the generation of toughness. Furthermore, the curves generated during thermogravimetric analysis did not significantly change, revealing the good thermal properties of the system. The phase-separated structure and the hydrogen bonds present in the system can be exploited to prepare synergistically tough polybenzoxazine exhibiting excellent thermal properties. This can be a potential way of modifying the thermoset resins.

scholarly journals Enhanced Water Solubility and Oral Bioavailability of Paclitaxel Crystal Powders through an Innovative Antisolvent Precipitation Process: Antisolvent Crystallization Using Ionic Liquids as Solvent

Pharmaceutics ◽  
2020 ◽  
Vol 12 (11) ◽  
pp. 1008 ◽  
Author(s):  
Qilei Yang ◽  
Chang Zu ◽  
Wengang Li ◽  
Weiwei Wu ◽  
Yunlong Ge ◽  
...  
Keyword(s):  
Oral Bioavailability ◽  
High Performance ◽  
Water Solubility ◽  
Water Soluble ◽  
Precipitation Process ◽  
X Ray Diffraction ◽  
Scanning Calorimetry ◽  
Antisolvent Precipitation ◽  
Antisolvent Crystallization ◽  
Artificial Gastric Juice

Paclitaxel (PTX) is a poor water-soluble antineoplastic drug with significant antitumor activity. However, its low bioavailability is a major obstacle for its biomedical applications. Thus, this experiment is designed to prepare PTX crystal powders through an antisolvent precipitation process using 1-hexyl-3-methylimidazolium bromide (HMImBr) as solvent and water as an antisolvent. The factors influencing saturation solubility of PTX crystal powders in water in water were optimized using a single-factor design. The optimum conditions for the antisolvent precipitation process were as follows: 50 mg/mL concentration of the PTX solution, 25 °C temperature, and 1:7 solvent-to-antisolvent ratio. The PTX crystal powders were characterized via scanning electron microscopy, Fourier transform infrared spectroscopy, high-performance liquid chromatography–mass spectrometry, X-ray diffraction, differential scanning calorimetry, thermogravimetric analysis, Raman spectroscopy, solid-state nuclear magnetic resonance, and dissolution and oral bioavailability studies. Results showed that the chemical structure of PTX crystal powders were unchanged; however, precipitation of the crystalline structure changed. The dissolution test showed that the dissolution rate and solubility of PTX crystal powders were nearly 3.21-folds higher compared to raw PTX in water, and 1.27 times higher in artificial gastric juice. Meanwhile, the bioavailability of PTX crystal increased 10.88 times than raw PTX. These results suggested that PTX crystal powders might have potential value to become a new oral PTX formulation with high bioavailability.

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