scholarly journals A Methodologic Approach for the Selection of Bio-Resorbable Polymers in the Development of Medical Devices: The Case of Poly(l-lactide-co-ε-caprolactone)

Polymers ◽  
2018 ◽  
Vol 10 (8) ◽  
pp. 851 ◽  
Author(s):  
Alberto Cingolani ◽  
Tommaso Casalini ◽  
Stefano Caimi ◽  
Antoine Klaue ◽  
Mattia Sponchioni ◽  
...  

In the last decades bioresorbable and biodegradable polymers have gained a very good reputation both in research and in industry thanks to their unique characteristics. They are able to ensure high performance and biocompatibility, at the same time avoiding post-healing surgical interventions for device removal. In the medical device industry, it is widely known that product formulation and manufacturing need to follow specific procedures in order to ensure both the proper mechanical properties and desired degradation profile. Moreover, the sterilization method is crucial and its impact on physical properties is generally underestimated. In this work we focused our attention on the effect of different terminal sterilization methods on two commercially available poly(l-lactide-co-ε-caprolactone) with equivalent chemical composition (70% PLA and 30% PCL) and relatively similar initial molecular weights, but different chain arrangements and crystallinity. Results obtained show that crystallinity plays a key role in helping preserve the narrow distribution of chains and, as a consequence, defined physical properties. These statements can be used as guidelines for a better choice of the most adequate biodegradable polymers in the production of resorbable medical devices.

Author(s):  
Alberto Cingolani ◽  
Tommaso Casalini ◽  
Stefano Caimi ◽  
Antoine Klaue ◽  
Mattia Sponchioni ◽  
...  

In the last decades bioresorbable and biodegradable polymers have gained a very good reputation both in research and in industry thanks to their unique characteristics. They are, indeed, able to ensure high performances and biocompatibility, at the same time avoiding post-healing surgical interventions for devices removal. In the medical device industrial use of such biopolymers, it is widely known that product formulation and manufacturing need to follow specific procedures in order to ensure both proper mechanical properties and desired degradation profile. Moreover, also the sterilization method is crucial and its impact on physical properties is generally underestimated. In this work we focused our attention on the effect of different terminal sterilization methods on two commercially available poly(L-lactide-co-ε-caprolactone) with equivalent chemical composition (70% PLA and 30% PCL) and relatively similar initial molecular weight, but different chains arrangement and crystallinity. Results obtained show that crystallinity plays a key role, helping in preserving the narrow distribution of chains and, as a consequence, defined physical properties. These statements can be used as guidelines for a better choice of the most adequate biodegradable polymers in the production of resorbable medical devices.


e-Polymers ◽  
2019 ◽  
Vol 19 (1) ◽  
pp. 385-410 ◽  
Author(s):  
Tejas V. Shah ◽  
Dilip V. Vasava

AbstractOver the past two decades, biodegradable polymers (BPs) have been widely used in biomedical applications such as drug carrier, gene delivery, tissue engineering, diagnosis, medical devices, and antibacterial/antifouling biomaterials. This can be attributed to numerous factors such as chemical, mechanical and physiochemical properties of BPs, their improved processibility, functionality and sensitivity towards stimuli. The present review intended to highlight main results of research on advances and improvements in terms of synthesis, physical properties, stimuli response, and/or applicability of biodegradable plastics (BPs) during last two decades, and its biomedical applications. Recent literature relevant to this study has been cited and their developing trends and challenges of BPs have also been discussed.


Author(s):  
Satoru Katsurayama ◽  
Hironori Tohmyoh ◽  
Masumi Saka

Generally, underfill material is adopted for encapsulation of flip chip package. And, the role of the underfill materials has become important day by day due to variant requirements for higher reliability of flip chip package. Also lower warpage gives higher mount-ability of the flip chip package and the small changes in the warpage of the package during the thermal cycle mitigate the stress working at the bump/substrate interface and bump/chip interface. Therefore, controlling the warpage of the flip chip package becomes very important problem for enhancing the performance of the package, i.e., the higher mount-ability and longer interconnect life. In this study, the effect of physical properties of underfill materials and substrates on the warpage behavior and the interconnect reliability of the flip chip package is reported. It was found from the experiments that the selection of an underfill and a substrate gave the highest interconnect reliability for the bump bonds. In addition to control the warpage behavior of the package during assembly, by selecting the suitable underfill material and substrate, the flip chip package with lower warpage and higher interconnect reliability can be realized.


Alloy Digest ◽  
1973 ◽  
Vol 22 (9) ◽  

Abstract BERYLCO 25 is the standard high-performance beryllium copper alloy most widely used because of its high strength, hardness and excellent spring characteristics. BERYLCO 25 is the updated version of BERYLCO 25S (Alloy Digest Cu-3, November 1952). This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-271. Producer or source: Kawecki Berylco Industries Inc..


Alloy Digest ◽  
2005 ◽  
Vol 54 (3) ◽  

Abstract MoldStar 90 is a high-performance beryllium-free copper alloy for the blow-molding and injection-molding industries. This datasheet provides information on composition, physical properties, hardness, tensile properties, and compressive strength. It also includes information on machining, joining, and surface treatment. Filing Code: CU-732. Producer or source: Performance Alloys.


Alloy Digest ◽  
2005 ◽  
Vol 54 (2) ◽  

Abstract MoldStar 150 (formerly PAS 940) is a high performance copper alloy for the blow-molding and injection-molding industries. This datasheet provides information on composition, physical properties, tensile properties, and compressive strength. It also includes information on forming, machining, joining, and surface treatment. Filing Code: CU-729. Producer or source: Performance Alloys.


Alloy Digest ◽  
2020 ◽  
Vol 69 (7) ◽  

Abstract Alcoa 351 SupraCast is a heat-treatable aluminum-silicon-copper alloy that also contains small amounts of magnesium, manganese, vanadium, and zirconium. It is designed for components exposed to elevated temperatures in high performance engines. This datasheet provides information on composition, physical properties, and tensile properties as well as fatigue. It also includes information on heat treating, machining, and joining. Filing Code: Al-466. Producer or source: Alcoa Corporation.


Alloy Digest ◽  
2018 ◽  
Vol 67 (6) ◽  

Abstract Alloy CuSn6 (UNS C51900) is a high-performance copper alloy. Typical uses include components for the electronics industry such as connector springs, relays, leaf springs, and switches as well as machine parts. This datasheet provides information on composition, physical properties, hardness, tensile properties, and bend strength. It also includes information on corrosion resistance as well as forming and joining. Filing Code: Cu-873. Producer or source: Gebr. Kemper GmbH + Company KG Metallwerke.


Alloy Digest ◽  
1999 ◽  
Vol 48 (1) ◽  

Abstract Olin C197 is a second-generation high performance alloy developed by Olin Brass. It has a strength and bend formability similar to C194 (see Alloy Digest Cu-360, September 1978), but with 25% higher electrical and thermal conductivity. High conductivity allows C197 to replace brasses and bronzes in applications where high current-carrying capability is required. Also, the strength of C197 provides higher contact forces when substituted for many lower strength coppers. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on corrosion and wear resistance as well as forming and joining. Filing Code: CU-627. Producer or source: Olin Brass.


Alloy Digest ◽  
1981 ◽  
Vol 30 (5) ◽  

Abstract ULTRONZE is a copper alloy also known as Olin Alloy 654. It bridges the gap between standard high-performance copper alloys and beryllium-copper alloys, thus enabling the design of parts with properties previously only attainable with more expensive materials. The alloy has superior stress-relaxation characteristics, good bend performance and excellent corrosion resistance. Among its typical uses are electrical connectors, fuse clips and relay springs. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and bend strength. It also includes information on corrosion resistance as well as forming, heat treating, and machining. Filing Code: Cu-417. Producer or source: Olin Brass.


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