Scan Tests with Multiple Fault Activation Cycles for Delay Faults

2006 ◽  
Author(s):  
Zhuo Zhang ◽  
S.M. Reddy ◽  
I. Pomeranz ◽  
Xijiang Lin ◽  
J. Rajski
Keyword(s):  
Delay Faults ◽  
Multiple Fault ◽  
Fault Activation

Magnetic Current Imaging Power Short Localization

2015 ◽  
Author(s):  
J. Gaudestad ◽  
F. Rusli ◽  
A. Orozco ◽  
M.C. Pun
Keyword(s):  
Thermal Imaging ◽  
Flip Chip ◽  
Optical Microscope ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Multiple Fault ◽  
Defect Location ◽  
Isolation Techniques ◽  
Chip Sample

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.

scholarly journals Reliability Improvement of a Radial Feeder Using Multiple Fault Passage Indicators

2012 ◽  
Vol 14 ◽  
pp. 223-228 ◽  
Author(s):  
E. Vidyasagar ◽  
P.V.N. Prasad ◽  
Ather Fatima
Keyword(s):  
Multiple Fault ◽  
Reliability Improvement

scholarly journals Analysis of insidious fault activation and water inrush from the mining floor

2014 ◽  
Vol 24 (4) ◽  
pp. 477-483 ◽  
Author(s):  
Xinyu Hu ◽  
Lianguo Wang ◽  
Yinlong Lu ◽  
Mei Yu
Keyword(s):  
Water Inrush ◽  
Fault Activation
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